Ultraviolet LED packaging adhesive with high light extraction efficiency and light aging resistance and packaging structure

A technology of LED packaging and highlight extraction, which is applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of not being able to withstand high-power ultraviolet radiation, short life, and short service life, and achieve long-term stable light aging resistance and prolong degradation and aging time, reducing the effect of total reflection light loss

Active Publication Date: 2020-12-08
TIANJIN ZHONGHUAN ELECTRONICS LIGHTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Organic encapsulation uses organic colloid to bond the lens and bracket together. It has a simple structure and is easy to operate, but it is not resistant to high-power ultraviolet radiation after encapsulation. Due to high-intensity ultraviolet light irradiation in organic encapsulation, the photoaging phenomenon of organic materials is serious, and the material is yellow. , and then broken, the life is shorter
Inorganic packaging uses a layer of alloy coating on the lens, and the lens and ceramic substrate are bonded by solder paste or silver glue. The cost is high, and the coating is easy to fall off, and the service life is not long. Secondary refraction, which increases light loss and leads to low light extraction efficiency

Method used

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  • Ultraviolet LED packaging adhesive with high light extraction efficiency and light aging resistance and packaging structure
  • Ultraviolet LED packaging adhesive with high light extraction efficiency and light aging resistance and packaging structure
  • Ultraviolet LED packaging adhesive with high light extraction efficiency and light aging resistance and packaging structure

Examples

Experimental program
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Effect test

Embodiment 1

[0041] An ultraviolet LED packaging structure with high light extraction efficiency and long service life, comprising an ultraviolet LED chip 2 with a wavelength of 200-400nm, a packaging substrate 3 and an encapsulation adhesive layer 1 covering the ultraviolet LED chip 2, the positive side of the ultraviolet LED chip 2 The negative chip electrodes 21 are respectively connected to the two substrate electrodes 31 of the packaging substrate 3 .

[0042]The encapsulation adhesive of the encapsulation adhesive layer 1 contains colloids of Si-O, C-F, and Si-F bonds, a nickel light-stable quencher accounting for 0.1% of the colloid mass percent, and a dialkyl dialkyl group accounting for 3% of the colloid mass percent. Dithiocarbamate, 2,2-diphenyl-1-trinitrophenylhydrazine accounting for 5% of the colloid mass percentage, piperidine derivatives accounting for 10% of the colloid mass percentage, accounting for the colloid mass percentage 2% phosphate ester, 3% PEG400 in colloid mas...

Embodiment 2

[0044] An ultraviolet LED packaging structure with high light extraction efficiency and long service life, comprising an ultraviolet LED chip 2 with a wavelength of 200-400nm, a packaging substrate 3 and an encapsulation adhesive layer 1 covering the ultraviolet LED chip 2, the positive side of the ultraviolet LED chip 2 The negative chip electrodes 21 are respectively connected to the two substrate electrodes 31 of the packaging substrate 3 .

[0045] The encapsulating adhesive of the encapsulating adhesive layer 1 contains colloids of Si-O, C-F, and Si-F bonds, a nickel light-stable quencher accounting for 5% of the colloid mass percent, and a dialkyl dialkyl group accounting for 5% of the colloid mass percent. Phosphorodithioate, p-benzoquinone accounting for 7% of the colloid mass percent, piperazine derivatives accounting for 8 percent of the colloid mass percent, titanate accounting for 5 percent of the colloid mass percent, accounting for 3 percent of the colloid mass pe...

Embodiment 3

[0047] An ultraviolet LED packaging structure with high light extraction efficiency and long service life, comprising an ultraviolet LED chip 2 with a wavelength of 200-400nm, a packaging substrate 3 and an encapsulation adhesive layer 1 covering the ultraviolet LED chip 2, the positive side of the ultraviolet LED chip 2 The negative chip electrodes 21 are respectively connected to the two substrate electrodes 31 of the packaging substrate 3 .

[0048] The encapsulation adhesive of the encapsulation adhesive layer 1 contains colloids of Si-O, C-F, and Si-F bonds, a nickel light-stable quencher accounting for 10% by mass of the colloid, and a thiodisulfide accounting for 10% by mass of the colloid. Phenol esters, 2-methyl-2-nitrosomethane accounting for 15% of the colloid mass percent, piperidine derivatives accounting for 15 percent of the colloid mass percent, phosphate esters accounting for 5 percent of the colloid mass percent, accounting for colloid The mass percentage is ...

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Abstract

The invention provides an ultraviolet LED packaging adhesive with high light extraction efficiency and light aging resistance. The adhesive comprises the following components in percentage by mass: colloid containing Si-O, C-F and Si-F bonds, a quencher accounting for 0.1-10% of the colloid, a hydroperoxide decomposer accounting for 0.1-10% of the colloid, a free radical scavenger accounting for 0.1-15% of the colloid, a hindered amine light stabilizer accounting for 0.1-15% of the colloid, a coupling agent accounting for 0.5-5% of the mass of the colloid, and a dispersing agent accounting for1-5% of the mass of the colloid. The invention further provides a packaging structure. According to the packaging adhesive and the packaging structure, the degradation and aging time of the polymer can be prolonged, the long-term stable light aging resistance effect is achieved, the total reflection light loss generated in the ultraviolet refraction process is effectively reduced, and the light extraction efficiency of the packaging material is improved.

Description

technical field [0001] The invention belongs to the technical field of LED chip packaging, and in particular relates to an ultraviolet LED packaging glue and packaging structure with high light extraction efficiency and light aging resistance. Background technique [0002] The existing high-power ultraviolet packaging adopts two packaging methods: organic and inorganic. Organic encapsulation uses organic colloid to bond the lens and bracket together. It has a simple structure and is easy to operate. However, it is not resistant to high-power ultraviolet radiation after encapsulation. The organic encapsulation is seriously photo-aging due to high-intensity ultraviolet light irradiation, and the material is yellow. Change, and then break, the life is shorter. Inorganic packaging uses a layer of alloy coating on the lens, and the lens and ceramic substrate are bonded by solder paste or silver glue. The cost is high, and the coating is easy to fall off, and the service life is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56
CPCH01L33/56
Inventor 高欣洪建明李春峰李冬
Owner TIANJIN ZHONGHUAN ELECTRONICS LIGHTING TECH
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