Flexible circuit board structure with aluminum foil replacing polymer flexible film and preparation process

Abstract

The invention relates to a flexible circuit board structure with aluminum foil replacing a polymer flexible film, which comprises an aluminum foil layer, a conductive layer and a high-thermal-conductivity insulating glue layer, wherein the upper end face of the aluminum foil layer is evenly coated with the high-thermal-conductivity insulating glue layer with the thickness not larger than 0.5 mm, the upper end face of the aluminum foil layer is connected with the conductive layer through the high-thermal-conductivity insulating glue layer, and the conductive layer and the aluminum foil layer are distributed in parallel. The specific preparation process comprises the steps of pretreating the aluminum foil layer, coating the high-thermal-conductivity insulating glue layer and positioning theconductive layer. On one hand, the flexible circuit board is simple in structure and production process, low in production cost and good in structural strength, toughness, insulating property and flame retardance, on the other hand, compared with a traditional PI film, the production and use cost of the flexible circuit board can be effectively reduced, the high temperature resistance and circuitload capacity of the flexible circuit board are improved, requirements of operation of a large-load and large-circuit circuit system are effectively met, so that the effects of improving the comprehensive performance of the flexible circuit board and reducing the production and use cost are achieved.

Description

technical field [0001] The invention relates to a structure and a preparation process of a flexible circuit board in which aluminum foil replaces a polymer flexible film, and belongs to the technical field of flexible circuit boards. Background technique [0002] With the cost and progress of flexible circuit board production technology, it is widely used in electronic products, lighting equipment and other equipment, but in actual use, it is found that the flexible circuit boards currently used are often based on PI film-based circuits. Although the structure can meet the needs of use, the cost of PI film is relatively high, and the flexibility of PI film is relatively poor, which limits the improvement of the performance of flexible circuit boards and the control of production and use costs. In addition, the current flexible circuit board based on PI film Circuit boards are often poor in high temperature resistance, and are easily damaged by high temperature during operati...

AI Technical Summary

Problems solved by technology

[0002] With the cost and progress of flexible circuit board production technology, it is widely used in electronic products, lighting equipment and other equipment, but in actual use, it is found that the flexible circuit boards currently used are often based on PI film-based circuits. Although the structure can meet the needs of use, the cost of PI film is relatively high, and the flexibility of PI film is relatively poor, which limits the improvement of the performance of flexible circuit boards and the control of production and use costs. In addition, the current flexible circuit board based on PI film Circuit boards are often poor in high temperature resistance, and are easily damaged by high temperature during operation and cannot meet the needs of large current and large load circuit systems.

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