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Porous copper-based whisker material

A technology of copper whisker and porous copper, which is applied in polycrystalline material growth, metal material coating process, crystal growth, etc., can solve the problems of specific surface area reduction and reduction

Pending Publication Date: 2020-12-25
左海珍
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The specific surface area of ​​the patent needs to be improved. A porous nickel-loaded perovskite catalyst described by the inventor in the series on the same day has a pore size distribution of 5-30 μm and a specific surface area of ​​30-60 μm. 2 / g, porosity 50-70%, the main reason why CN201810567439 is not as good as the porous nickel prepared by dealloying by the inventor is that the method of dealloying is different, in addition, the specific surface area obtained by preliminary and deep dealloying is 30-60m 2 / g, although it is high enough, but after the catalyst active component is loaded, its specific surface area is significantly reduced, such as after the perovskite is loaded, its specific surface area is 20-50m 2 / g, there is a significant decrease, so it is necessary to further increase the specific surface area of ​​the porous copper-based material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] A high specific surface area copper whisker material is characterized in that comprising the following processing steps:

[0068] (1) Preparation of Cu-Al alloy block: (a) physically and uniformly mix 30wt.% 2-3μm copper powder and 60wt.% 7-8μm aluminum powder; (b) press molding at 300Mpa; (c) inert atmosphere or reduction High temperature sintering under atmosphere, sintering temperature 800 o C, high temperature duration 1h, natural cooling, wherein the holding time of the press molding is 5min; the inert atmosphere is N 2 , the reducing atmosphere is H 2 ; The programmed temperature rise rate of the high temperature sintering is 10 o C / min.

[0069] (2) Preliminary dealloying by chemical alkali corrosion: the corrosion solution used is 1M NaOH aqueous solution, the corrosion time is 12h, and the temperature is 30 o C, during the corrosion process, the bubbles were removed by ultrasonic wave, and the corrosion was washed with deionized water several times.

[007...

Embodiment 2

[0076] A high specific surface area copper whisker material is characterized in that comprising the following processing steps:

[0077] (1) Preparation of Cu-Al alloy block: (a) physically and uniformly mix 35wt.% 2-3μm copper powder and 65wt.% 7-8μm aluminum powder; (b) press molding at 350Mpa; (c) inert atmosphere or reduction High temperature sintering under atmosphere, sintering temperature 900 o C, high temperature duration 2h, natural cooling, wherein the holding time of the press molding is 8min; the inert atmosphere is N 2 , the reducing atmosphere is H 2 ; The programmed temperature rise rate of the high temperature sintering is 10 o C / min.

[0078] (2) Preliminary dealloying by chemical alkaline corrosion: the corrosion solution used is 1.5M NaOH aqueous solution, the corrosion time is 18h, and the temperature is 33 o C, during the corrosion process, the bubbles were removed by ultrasonic wave, and the corrosion was washed with deionized water several times.

...

Embodiment 3

[0086] A high specific surface area copper whisker material is characterized in that comprising the following processing steps:

[0087] (1) Preparation of Cu-Al alloy block: (a) physically and uniformly mix 30-40wt.% 2-3μm copper powder and 60-70wt.% 7-8μm aluminum powder; (b) 400Mpa compression molding; (c) High temperature sintering under inert atmosphere or reducing atmosphere, sintering temperature 950 o C, high temperature duration 3h, natural cooling, wherein the holding time of the press molding is 10min; the inert atmosphere is N 2 , the reducing atmosphere is H 2 ; The programmed temperature rise rate of the high temperature sintering is 10 o C / min.

[0088] (2) Preliminary dealloying by chemical alkali corrosion: the corrosion solution used is 2M NaOH aqueous solution, the corrosion time is 24h, and the temperature is 35 o C, during the corrosion process, the bubbles were removed by ultrasonic wave, and the corrosion was washed with deionized water several times...

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Abstract

The invention provides a high-specific-surface-area copper whisker material which is prepared by the following steps: obtaining high-specific-surface-area porous copper by a chemical-electrochemical corrosion dealloying method, then obtaining a tungsten sulfide layer on the porous surface by a method of burning tungsten sulfide by pulse laser, and improving the time and the temperature of a high-temperature reduction process, and effectively controlling the in-situ growth speed and size of the copper whiskers on the surface of the porous copper so that the copper whisker material with high specific surface area is obtained.

Description

technical field [0001] The invention relates to the field of preparation of copper whiskers, in particular to a preparation method for preparing copper whiskers on a porous copper surface. [0002] technical background [0003] First of all, about whiskers: Whiskers are naturally formed or synthetic fibers that grow in the form of single crystals, and their diameters are small, mostly on the order of microns. There are few defects in the whisker, its strength is close to the theoretical value of a complete crystal, and its mechanical strength is equal to the force between adjacent atoms. The highly oriented structure of whiskers not only makes them have high strength, high modulus and high elongation, but also has electrical, optical, magnetic, dielectric and superconducting properties. The strength of whiskers is much higher than that of other chopped fibers, and it is mainly used as a reinforcement of composite materials for the manufacture of high-strength composite mater...

Claims

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Application Information

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IPC IPC(8): C30B29/62C30B29/02C30B1/00B22F3/11C23C14/06C23C14/28C23F1/36C25F3/04B01J32/00C22C1/04
CPCB22F3/114C22C1/0416C23C14/0623C23C14/28C23F1/36C25F3/04C30B1/00C30B29/02C30B29/62
Inventor 左海珍
Owner 左海珍
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