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Preparation method of boron nitride nanosheet-carbon nanotube heat-conducting filler and heat-conducting composite material

A technology of carbon nanotubes and thermally conductive fillers, which is applied in the field of composite materials, can solve the problems of boron nitride skeletons that are difficult to achieve long-range orderly heat conduction and high contact thermal resistance of the skeletons, and achieve reduced phonon scattering, low cost, and reduced contact The effect of thermal resistance

Active Publication Date: 2021-01-05
ANHUI UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The invention aims to solve the problem that the boron nitride skeleton is difficult to achieve long-range orderly heat conduction and the contact thermal resistance in the skeleton is too high

Method used

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  • Preparation method of boron nitride nanosheet-carbon nanotube heat-conducting filler and heat-conducting composite material
  • Preparation method of boron nitride nanosheet-carbon nanotube heat-conducting filler and heat-conducting composite material
  • Preparation method of boron nitride nanosheet-carbon nanotube heat-conducting filler and heat-conducting composite material

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[0029] figure 1 A flow chart for preparing boron nitride nanosheet-carbon nanotube thermally conductive filler provided by the present invention. combine figure 1 As shown, the embodiment of the present invention provides a method for preparing a boron nitride nanosheet-carbon nanotube thermally conductive filler, comprising the following steps:

[0030] Step S1, exfoliating hexagonal boron nitride to prepare boron nitride nanosheets with functional groups on the surface;

[0031] Step S2, respectively preparing a solution of boron nitride nanosheets with functional groups on the surface, a metal salt solution, and a ligand solution; uniformly mixing the solution of boron nitride nanosheets with functional groups on the surface and the metal salt solution to obtain a mixed solution; Adding the ligand solution to the mixed solution, and performing a stirring reaction to obtain a boron nitride nanosheet-carbon nanotube precursor;

[0032] Step S3, preparing the boron nitride ...

Embodiment 1

[0065] This embodiment provides a method for preparing a boron nitride nanosheet-carbon nanotube thermally conductive filler, comprising the following steps:

[0066] 1.1 Dissolve 12g of urea in 100ml of deionized water, stir and mix evenly to obtain a urea solution, add 200mg of zirconia ball milling beads of two different diameters and 100mg of hexagonal boron nitride powder to the urea solution, stir and mix evenly, and put it into the ultrasonic In the machine, the ball milling process was carried out for 24 hours under the ultrasonic condition of an ultrasonic frequency of 60kHZ; after the ball milling process was completed, the ball milling beads were removed to obtain a ball milling liquid, and the ball milling liquid was centrifuged at a speed of 2500 rpm for 10 min, and after removing the supernatant, washed with water for 3 times, the washed product was obtained, and the washed product was vacuum-dried at 70° C. for 24 hours to obtain amidated boron nitride nanosheets...

Embodiment 2

[0071] This embodiment provides a method for preparing a boron nitride nanosheet-carbon nanotube thermally conductive filler, comprising the following steps:

[0072] 2.1 Dissolve 9g of urea in 100ml of deionized water, stir and mix evenly to obtain a urea solution, add 150mg of zirconia ball milling beads of two different diameters and 90mg of hexagonal boron nitride powder to the urea solution, stir and mix evenly, and then put it into the ultrasonic In the machine, the ball milling process was carried out for 18 hours under the ultrasonic condition of an ultrasonic frequency of 60kHZ; after the ball milling process was completed, the ball milling beads were removed to obtain a ball milling liquid, and the ball milling liquid was centrifuged at a speed of 3000rpm for 5min, and after removing the supernatant, washed with water for 3 times, the washed product was obtained, and the washed product was vacuum-dried at 70° C. for 24 hours to obtain amidated boron nitride nanosheets...

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Abstract

The invention provides a preparation method of a boron nitride nanosheet carbon nanotube heat-conducting filler, which comprises the following steps: S1, carrying out lamella stripping on hexagonal boron nitride to prepare a boron nitride nanosheet with functional groups on the surface; S2, respectively preparing a boron nitride nanosheet solution with functional groups on the surface, a metal salt solution and a ligand solution, uniformly mixing the boron nitride nanosheet solution with the functional group on the surface with a metal salt solution to obtain a mixed solution, then adding a ligand solution into the mixed solution, and carrying out a stirring reaction to obtain a boron nitride nanosheet carbon nanotube precursor; and S3, preparing the boron nitride nanosheet carbon nanotubeprecursor into a three-dimensional skeleton by an ice template method, and calcining the three-dimensional skeleton in a protective atmosphere to obtain the boron nitride nanosheet carbon nanotube heat-conducting filler. The heat-conducting filler prepared by the invention solves the problems that a boron nitride skeleton is difficult to realize long-range ordered heat conduction and the contactthermal resistance in the skeleton is excessively high.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a method for preparing a boron nitride nanosheet-carbon nanotube thermally conductive filler and a thermally conductive composite material. Background technique [0002] With the rapid development of electronic technology, electronic products have experienced significant miniaturization and high power densification, and electronic devices integrate functions into small components. As the working efficiency of electronic products becomes higher and higher, the heat generated by electronic components increases and the temperature rises sharply. High temperature not only affects the stability of electronic products, but also has a negative effect on its service life. In severe cases, it will cause equipment damage or even danger. Therefore, it is necessary to use composite materials with excellent thermal conductivity to timely export heat from electronic products to so...

Claims

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Application Information

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IPC IPC(8): C08K9/04C08K3/38C08K7/00C08K3/04C08L63/00C09K5/14
CPCC08K9/04C08K3/38C08K7/00C08K3/041C09K5/14C08K2003/385C08L63/00
Inventor 钱家盛李旭伍斌苗继斌杨斌夏茹曹明
Owner ANHUI UNIVERSITY
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