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Epoxy resin composition for semiconductor encapsulation and semiconductor device

An epoxy resin and semiconductor technology, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the cumbersome process of protective coating coating, pattern formation, cleaning, and sputtering protective coating. and other problems, to achieve the effect of excellent curability, excellent productivity and continuous production

Pending Publication Date: 2021-01-05
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the current rewiring method, the mainstream is copper plating, etc., and the processes of coating, patterning, cleaning, sputtering, removal of the protective coating, and electroplating are very cumbersome.

Method used

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  • Epoxy resin composition for semiconductor encapsulation and semiconductor device
  • Epoxy resin composition for semiconductor encapsulation and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0094] Hereinafter, although an Example and a comparative example are shown, and this invention is demonstrated in more detail, this invention is not limited to a following example.

[0095] Materials used in Examples and Comparative Examples are shown below.

[0096] (A) epoxy resin

[0097] ・Epoxy resin 1: o-cresol novolak type epoxy resin: "EPICLON N-695" (epoxy equivalent 210) manufactured by DIC Corporation

[0098] ・Epoxy resin 2: biphenyl aralkyl type epoxy resin: "NC-3000" manufactured by Nippon Kayaku Co., Ltd. (epoxy equivalent 273)

[0099] (B) Phenol curing agent

[0100] ・Curing agent 1: Novolac type phenolic resin: "TD-2093Y" manufactured by DIC Corporation (phenol equivalent: 110)

[0101] ・Curing agent 2: Aralkyl type phenolic resin: "MEHC-7851SS" manufactured by Meiwa Kasei Co., Ltd. (phenol equivalent: 175)

[0102] (C) curing accelerator

[0103] Curing accelerator 1: N'-[3-[[[(dimethylamino)carbonyl]amino]methyl]-3,5,5-trimethylcyclohexyl]-N,N-dimethyl...

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Abstract

Provided are: an epoxy resin composition for semiconductor encapsulation, which has excellent curability and enables the selective and easy formation of a metal layer (plating layer) on the surface orinside of a cured product by electroless plating; and a semiconductor device which comprises the cured product of the composition. The epoxy resin composition for semiconductor encapsulation comprises: (A) an epoxy resin, (B) a phenol-based curing agent, (C) a curing accelerator having a urea structure, (D) a laser direct structuring additive, and (E) an inorganic filler.

Description

technical field [0001] The present invention relates to an epoxy resin composition for semiconductor encapsulation capable of forming a coating layer or a wiring layer on the surface of a cured product or inside the cured product by electroless plating, and to a semiconductor device having the cured product. Background technique [0002] In order to prevent erroneous operations due to electromagnetic noise generated by equipment, semiconductor devices mounted in communication equipment such as mobile phones and smartphones need to have electromagnetic wave shielding performance. [0003] As a method of imparting electromagnetic wave shielding performance to a semiconductor device, there are a method of using a metal plate, a method of vapor-depositing a metal layer on a semiconductor surface by sputtering, and the like. However, the method of using a metal plate to provide electromagnetic wave shielding performance is not suitable for thinning / miniaturization of communicatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L91/06C08K3/36C08K3/24C08K3/22H01L21/56H01L23/29H01L23/552
CPCC08L63/00H01L23/295H01L21/56H01L23/552C08L2203/206C08K2003/2227C08K2201/005C08L91/06C08K3/36C08K3/24C08K3/22C08K5/21C08K5/05C08K3/013C08K2003/2265C08K2003/2296C08K2003/2293C08K2003/2289C08K2003/2217C08K2003/2262C08K2003/2248
Inventor 长田将一大石宙辉川村训史萩原健司横田竜平金田雅浩
Owner SHIN ETSU CHEM IND CO LTD