High-power chip heat dissipation system and method with built-in microneedle ring imitating small intestine villi

Abstract

The invention discloses a high-power chip heat dissipation system and method with a built-in microneedle ring imitating the villi of the small intestine. It is difficult to meet the heat dissipation requirements of high-power chips only by creating an air-cooled or water-cooled environment outside the heat-absorbing box. The air outlet at the top of the fan of the present invention is bonded to the double vortex linear condensation pipe; the three-layer coiled liquid channel is fixed inside the heat-absorbing box, and a number of microneedle rings imitating small intestine villi are embedded in the channel; the entrance of the three-layer coiled liquid channel is connected to the The outlet of the inlet peristaltic pump is connected by a hose, the inlet of the inlet peristaltic pump is connected to the outlet of the outlet peristaltic pump through a hose and a double scroll linear condenser; the inlet of the outlet peristaltic pump is connected with the outlet of the three-layer coiled liquid channel by a hose A thermocouple is fixed on the side of the heat-absorbing box, and a hexagonal honeycomb microneedle array group is fixed on the top surface. The combination of the external air cooling system and the internal liquid cooling system of the present invention increases the heat dissipation area in multiple places and prolongs the heat exchange time of the cooling liquid to promote heat exchange efficiency and meet the heat dissipation requirements of high-power chips.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation, and in particular relates to a high-power chip heat dissipation system and a heat dissipation method with a built-in microneedle ring imitating small intestine villi. Background technique [0002] With the advancement of science and technology and the development of the times, electronic equipment products are constantly being introduced. According to Moore's Law, when the selling price of electronic products is stable, the number of transistors installed on integrated circuits will quickly double, with a period of about 18 months, and its performance will also double. A more highly integrated circuit means a higher heat flux, which will inevitably lead to a higher operating temperature. [0003] In the field of electronic products, with the rapid development of the microelectronic equipment industry, the size of electronic chips continues to decrease and the power density continues to ...

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Problems solved by technology

[0005] The present invention aims at the problem that the current high-power chip size is continuously reduced and the power density is continuously increased, but the traditional chip heat sink cannot meet the increasing heat dissipation requirements of the chip, and provides a high-power chip heat dissipation system with a built-in microneedle ring imitating small intestine villi And its heat dissipation method, combining external air cooling and internal liquid cooling for the heat absorbing box

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