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Heat-conducting wave-absorbing silica gel composite material and preparation method thereof

A technology of composite materials and wave-absorbing materials, which is applied in heat exchange materials, chemical instruments and methods, magnetic field/electric field shielding, etc., can solve the problem of difficulty in meeting the heat dissipation requirements of electronic equipment, limited filling ratio, and the mechanics of heat-conducting and wave-absorbing composite materials. Performance degradation and other problems, achieve good electromagnetic shielding, improve thermal conductivity, and exert the effect of thermal conductivity

Active Publication Date: 2021-01-08
SHENZHEN HFC SHIELDING PRODS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, some heat-conducting and absorbing products have appeared in the market, which can not only solve the problem of heat conduction, but also solve the problem of absorbing waves. These products are usually made by compounding heat-conducting powder and absorbing powder The filling ratio of wave powder is limited, and the thermal conductivity of composite materials is often lower than 4W / m K, which is difficult to meet the heat dissipation requirements of electronic equipment
In addition, a large proportion of thermally conductive powder filled will also cause a decrease in the mechanical properties of the thermally conductive and wave-absorbing composite material

Method used

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Examples

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preparation example Construction

[0032] The present invention also provides a preparation method of heat-conducting and wave-absorbing silica gel composite material, the preparation method comprising

[0033] The steps of preparing magnetic BN nanosheets: preparing ferroferric oxide precursor solution, adding BN nanosheets to the precursor solution for reaction mixing, washing, and drying, to obtain ferric oxide BN nanosheets uniformly dispersed on the surface;

[0034] The steps for preparing MXene nanosheets: add LiF to HCl solution and stir to prepare an etching solution containing hydrofluoric acid, and then add the MAX phase Ti 3 AlC 2 Add it to the etching solution for stirring, centrifugation, cleaning, ultrasonication, filter, and dry to obtain MXene nanosheets;

[0035] Steps for preparing the base material: Add boron nitride nanosheets containing ferric oxide on the surface, MXene nanosheets, silicone oil, thermal conductive powder, coupling agent, curing agent, and inhibitor into the homogenizer a...

Embodiment 1

[0042] This embodiment provides a high thermal conductivity wave-absorbing silica gel composite material and its preparation method, including the following steps:

[0043] Steps for preparing magnetic BN nanosheets: use ferric sulfate and ethylene glycol to prepare 500g of iron ferric oxide precursor solution with a mass fraction of 5% iron, weigh 300g of boron nitride nanosheets with a particle size of 40nm and add them to the precursor solution The stirring reaction was carried out under the condition of 35° C., the stirring speed was 1500 rpm, and the stirring time was 3 hours. After the stirring was completed, the mixed liquid was filtered, washed, and dried to obtain magnetic BN nanosheets.

[0044] Steps for preparing MXene nanosheets: adding 100g LiF to 500mL HCl solution with a mass fraction of 35% for stirring at a rotation speed of 1000rpm, and stirring for 15 minutes to obtain an etching solution containing hydrofluoric acid. Weigh 80gMAX phase Ti 3 AlC 2 Add it ...

Embodiment 2

[0048] This embodiment provides a high thermal conductivity wave-absorbing silica gel composite material and its preparation method, including the following steps:

[0049] Steps for preparing magnetic BN nanosheets: use ferric sulfate and ethylene glycol to prepare 500 g of iron ferric oxide precursor solution with a mass fraction of 7% iron, weigh 300 g of boron nitride nanosheets with a particle size of 55 nm and add them to the precursor solution The stirring reaction was carried out under the condition of 35° C., the stirring speed was 1500 rpm, and the stirring time was 3 hours. After the stirring was completed, the mixed liquid was filtered, washed, and dried to obtain magnetic BN nanosheets.

[0050] Steps for preparing MXene nanosheets: adding 150g LiF to 500mL HCl solution with a mass fraction of 38% for stirring at a rotation speed of 1000rpm, and stirring for 15 minutes to obtain an etching solution containing hydrofluoric acid. Weigh 100gMAX phase Ti 3 AlC 2 Add...

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Abstract

The invention relates to a heat-conducting wave-absorbing silica gel composite material, which is a magnetic heat-conducting wave-absorbing material formed by taking magnetic boron nitride nanosheets,heat-conducting powder and MXene nanosheets as raw materials through directional arrangement. The invention also discloses a preparation method of the heat-conducting wave-absorbing silica gel composite material. The heat-conducting wave-absorbing silica gel composite material disclosed by the invention is a magnetic heat-conducting wave-absorbing material after directional arrangement, and due to the adoption of the magnetic boron nitride nanosheets, directional arrangement can be carried out through a magnetic field, the heat-conducting property of boron nitride can be greatly exerted, andthe heat conductivity coefficient of silica gel is obviously improved under the condition of a relatively low filling ratio.

Description

technical field [0001] The invention relates to the technical field of heat-conducting and wave-absorbing materials, in particular to a heat-conducting and wave-absorbing silica gel composite material and a preparation method thereof. Background technique [0002] With the advent of the 5G era, electronic equipment is developing toward miniaturization and high integration. The operating frequency of electronic chips is increasing, the heat flux is increasing, and the problem of electromagnetic interference is becoming more and more prominent. How to solve the problem of heat conduction and wave absorption at the same time has become an urgent need. solved problem. [0003] At present, some heat-conducting and absorbing products have appeared in the market, which can not only solve the problem of heat conduction, but also solve the problem of absorbing waves. These products are usually prepared by compounding heat-conducting powder and absorbing powder with organic silicon. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K13/04C08K7/00C08K5/5425C08K3/22C08K3/28C08K3/04C08K3/08C09K5/14H05K9/00H01Q17/00
CPCC08L83/04C09K5/14H05K9/0081H01Q17/00C08K2201/011C08K2201/014C08K2201/01C08K2003/2227C08K2003/2296C08K2003/222C08K2003/282C08K2003/0806C08K2003/0812C08L2205/025C08K13/04C08K7/00C08K5/5425C08K3/22C08K3/28C08K3/042C08K3/08
Inventor 曹勇羊尚强谢佑南陈印方晓陈肯
Owner SHENZHEN HFC SHIELDING PRODS CO LTD
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