Copper alloy with capillary core structures on surface and preparation method thereof

Abstract

The invention provides a copper alloy with capillary core structures on the surface and a preparation method thereof. The copper alloy comprises the following components in parts by mass: 90-100 partsof copper, 1-8 parts of nickel, 0.1-5 parts of tin, 0.05-1 part of chromium, 0.01-0.3 part of phosphorus, and 0.01-0.2 part of vanadium; and a plurality of capillary core structures with apertures of1-10 microns are arranged on the surface of the copper alloy. In the copper alloy, capillary cores and a copper alloy basal body are totally integrated structures, so that traditional capillary coreswith burnt copper net structures can be directly replaced, and the falling problem caused by insufficient binding force in the use process can be perfectly solved; the copper alloy is high in quality, low in cost, wide in application range and easy to popularize and use on a large scale; and all the components are interacted, so that the heat conductivity, the mechanical performance, the corrosion resistance, the welding performance and the stability of the copper alloy and copper alloy related products can be effectively improved, the multi-aspect use demands of the copper alloy are satisfied, and the service life is prolonged.

Description

technical field [0001] The application relates to the field of material technology, in particular to a copper alloy with a capillary core structure on the surface and a preparation method thereof, a heat pipe, and a vapor chamber. Background technique [0002] With the development of 5G technology, the data transmission speed and performance of electronic equipment such as 5G mobile phones have been further improved. However, due to the addition of 5G baseband, the thermal effect of electronic equipment has become more and more serious. Therefore, the heat dissipation performance of electronic equipment is urgently needed. improve. [0003] Heat pipes and vapor chambers use the principle of phase change heat transfer. Due to their excellent heat spreading ability, they have been widely used in 5G mobile phones and electronic equipment as the preferred solution for electronic heat dissipation. [0004] At present, 5G electronic products have generally used heat pipes and vap...

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Problems solved by technology

The core of heat pipes and vapor chambers is the capillary liquid-absorbing core (capillary wick) structure inside. At present, sintered copper mesh is mostly used as the capillary core structure of copper heat pipes and vapor chambers. However, due to the copper mesh, copper tubes and copper sheets There is a problem of poor bonding between them. On the one hand, the yield rate of the product is not high enough (currently, the yield rate of copper vapor chamber with sintered copper mesh structure is less than 70%). On the other hand, there is always copper mesh falling off during use. risk, limiting its wider use

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