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A kind of 3D printing photosensitive resin and its preparation method and application

A technology of photosensitive resin and 3D printing, which is applied in the field of 3D printing and photocuring, which can solve the problems of brittle photosensitive resin, uneven mechanical properties of parts in all directions, and poor interlayer adhesion, so as to improve the notched impact strength and improve mechanical properties. Performance and surface step effect, the effect of high interlayer adhesion

Active Publication Date: 2021-12-14
FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems that the existing 3D printing photosensitive resin is generally brittle, the anisotropic mechanical properties of the parts are not uniform, and the interlayer adhesion is poor, and then provide a 3D printing photosensitive resin and its preparation method and use , the 3D printing photosensitive resin can improve the interlayer adhesive force of the 3D printing part, improve the uniformity of the mechanical properties of the part, and can also increase the thermal stability of the photosensitive resin part well. strength and toughness

Method used

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  • A kind of 3D printing photosensitive resin and its preparation method and application
  • A kind of 3D printing photosensitive resin and its preparation method and application
  • A kind of 3D printing photosensitive resin and its preparation method and application

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preparation example Construction

[0065] The preparation method of the present invention will be further described in detail in conjunction with specific examples below. It should be understood that the following examples are only for illustrating and explaining the present invention, and should not be construed as limiting the protection scope of the present invention. All technologies realized based on the above contents of the present invention are covered within the scope of protection intended by the present invention.

[0066] The experimental methods used in the following examples are conventional methods unless otherwise specified; the reagents and materials used in the following examples can be obtained from commercial sources unless otherwise specified.

[0067] In the description of the present invention, it should be noted that the test process of tensile strength is completed with reference to ASTM D638. The test process of tensile elongation at break is completed with reference to ASTM D638. Th...

Embodiment 1

[0069] Preparation of modified styrene-butadiene rubber nanoparticles:

[0070] 100g styrene-butadiene latex (Jinan Shanhai Chemical Industry, solid content 34%, wherein butadiene content 75wt%, particle size 120nm), distilled water 150g, OP-10 0.5g, sodium dodecylbenzenesulfonate 0.3g, KPS 0.4g , stirred at 70°C for 30min, added dropwise 30.5g of methyl methacrylate and styrene mixture (molar ratio 1:1) at a rate of 10mL / h, and reacted at 80°C for 2 hours. Add 2 g of glycidyl methacrylate dropwise at a rate of 5 mL / h, react at 80°C for 1 hour, and protect under nitrogen throughout the above reaction. Add CaCl 2 The solution was demulsified, filtered and washed three times with hot distilled water, and then freeze-dried for 48 hours for later use.

[0071] 50 parts of prepolymer epoxy resin (DER331, Dow Chemical), 10 parts of prepolymer epoxy acrylate (CN104NS, Sartomer), 11 parts of reactive diluent ethoxylated trimethylolpropane triacrylate, Mix 20 parts of reactive dilue...

Embodiment 2

[0074] The preparation of modified styrene-butadiene rubber nanoparticles is the same as in Example 1.

[0075] 50 parts of prepolymer epoxy resin (DER331, Dow Chemical), 10 parts of prepolymer epoxy acrylate (CN104NS, Sartomer), 11 parts of reactive diluent ethoxylated trimethylolpropane triacrylate, Mix 18 parts of reactive diluent 3-ethyl-3 hydroxymethyl oxetane, heat to 80°C and stir until transparent state; add 5 parts of modified styrene-butadiene rubber nanoparticles prepared above, Stir for 6h (speed 2500r / min); add 2 parts of photoinitiator 1-hydroxycyclohexyl phenyl ketone, 4 parts of photoinitiator diphenyl-(4-phenylthio)phenylsulfonium hexafluoroantimonate, Heat to 60° C. with a constant temperature magnetic stirring device, and stir for 1 h in the dark to prepare a resin for use.

[0076] Use a 355nm laser stereolithography (SLA) 3D printer for 3D printing.

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Abstract

The invention provides a 3D printing photosensitive resin and a preparation method thereof. The photosensitive resin composition comprises the following components in parts by mass: 20-80 parts of a prepolymer, 20-50 parts of a reactive diluent, and 1 photoinitiator -20 parts, 1-20 parts of modified styrene-butadiene rubber nanoparticles; wherein, the modified styrene-butadiene rubber nanoparticles have a core-shell structure, wherein the core is styrene-butadiene rubber, and the shell is group of styrene and methyl methacrylate copolymers. The interlayer adhesion of the workpiece prepared by the photosensitive resin is higher, and the uniformity of mechanical properties in the isotropic direction can be improved. When used in 3D printing, the mechanical properties and surface step effect of the workpiece can be improved, and the printing effect is greatly improved. And the forming effect of the part can meet the needs of multi-degree-of-freedom 3D printing.

Description

technical field [0001] The invention relates to the field of 3D printing and photocuring, in particular to a 3D printing photosensitive resin and its preparation method and application. Background technique [0002] 3D printing technology was born in the late 1970s. Because 3D printing has the advantages of short manufacturing cycle, parts with complex structures, and high utilization rate of materials, it has been well applied in the fields of industrial modeling, packaging, manufacturing, architecture, art, medicine, aviation, aerospace, and film and television. [0003] In 3D printing technology, laser light curing technology (SLA) is still the most widely used technology. The raw material used in SLA technology is a mixture of epoxy resin and epoxy acrylate with an interpenetrating network structure, so its products combine the advantages of low shrinkage of epoxy resin, high heat resistance and high curing rate of acrylate resin. However, the photosensitive resin form...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/10C08L51/04C08F279/02C08F220/14C08F212/08B33Y70/00
CPCC08L63/00C08F279/02B33Y70/00C08L63/10C08L51/04C08F220/14C08F212/08
Inventor 翁子骧李悦微吴立新
Owner FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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