Application of compound as polyimide curing accelerator, polyimide precursor as well as preparation method and application of polyimide precursor

A technology of polyimide precursor and curing accelerator, applied in the field of polyimide materials, can solve the problems of curing agent residue, large amount of addition, continuous volatilization, etc.

Active Publication Date: 2021-02-05
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the curing accelerator exists in the form of a complex and is added in a large amount, w

Method used

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  • Application of compound as polyimide curing accelerator, polyimide precursor as well as preparation method and application of polyimide precursor
  • Application of compound as polyimide curing accelerator, polyimide precursor as well as preparation method and application of polyimide precursor
  • Application of compound as polyimide curing accelerator, polyimide precursor as well as preparation method and application of polyimide precursor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] This embodiment provides a polyimide precursor and a polyimide film, and the preparation method is as follows:

[0070] (1) At room temperature, under an inert atmosphere and mechanical stirring, dissolve 1.99g of 4,4'-diaminodiphenyl ether in 37.53g of N-methylpyrrolidone solvent, and wait until the 4,4'-diaminodiphenyl ether is completely After dissolving, divide 2.18g of 1,2,4,5-pyromellitic dianhydride into two equal parts, add them to the diamine solution in batches at intervals of 20 minutes, and stir mechanically for 6 hours to obtain a polyimide precursor solution .

[0071] (2) At room temperature, under an inert atmosphere and mechanical stirring, 55.08 mg of curing accelerator 5-aminobenzimidazole (accounting for 4.14% by mole of the dianhydride monomer) is added to the polyimide obtained in step (1) In the precursor solution, react for 2h. Then place it in a vacuum drying oven, defoaming for 2h, to obtain a 5-aminobenzimidazole-polyimide precursor solution...

Embodiment 2

[0075] This example provides a polyimide precursor and a polyimide film. The difference between the preparation method and Example 1 is that the N-methylpyrrolidone in step (1) is replaced by the same quality N,N-di Methyl acetamide to obtain 5-aminobenzimidazole-polyimide film.

Embodiment 3

[0077]This example provides a polyimide precursor and a polyimide film. The difference between the preparation method and Example 1 is that the N-methylpyrrolidone in step (1) is replaced by N,N-dimethylformaldehyde Amide to obtain 5-aminobenzimidazole-polyimide film.

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Abstract

The invention relates to an application of a compound as a polyimide curing accelerator, a polyimide precursor as well as a preparation method and an application of the polyimide precursor. The compound is an X group substituted nitrogen heterocyclic compound; wherein the X group is selected from any one or a combination of at least two of -NH2, -COOH, -OH, -SH or = N-NH2. An X group in the curingaccelerator can react with a dianhydride group at the tail end of a polyimide main chain, so that the X group is connected with the dianhydride group in the form of a covalent bond, low-temperature curing can be realized under the condition of a small addition amount, and the hidden danger of continuous volatilization is avoided in subsequent use; and compared with the intrinsic polyimide, the dielectric property, the mechanical property and the thermal property of the polyimide are not obviously reduced.

Description

technical field [0001] The invention relates to the technical field of polyimide materials, in particular to the application of a compound as a polyimide curing accelerator, a polyimide precursor, a preparation method and application thereof. Background technique [0002] Polyimide (PI) is a class of polymers containing imide rings in the main chain of the molecule. It has excellent mechanical, thermal, and dielectric properties. It is a special engineering plastic with excellent performance. The material with the highest heat resistance level among polymers is widely used in aerospace, electronic and electrical, automobile, high-speed rail and chemical industries. In general, PI is usually obtained from the reaction of diamine and dianhydride to form its precursors - polyamic acid (PAA), polyamic acid ester (PAE), etc., and then imidized at high temperature (>300°C). However, high-temperature imidization limits the application of PI in some fields. For example, when PI...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08J5/18C08G73/1071C08G73/1085C08J2379/08
Inventor 张国平李金辉随裕莹单良孙蓉
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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