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Ceramic substrate for integrated packaging

A ceramic substrate, integrated packaging technology, applied in electrical components, circuits, electrical solid devices and other directions, can solve the problems of low thermal conductivity, low cutting efficiency, affecting the service life of components, etc., to achieve the effect of optimizing physical and chemical properties

Inactive Publication Date: 2021-02-05
广州市胜翰计算机配件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The thermal conductivity of existing ceramic substrates is not high, which easily affects the service life of each component
At the same time, the cutting efficiency of the ceramic substrate in the production process is not high, and it is impossible to cut the whole ceramic substrate into multiple ceramic substrates at one time

Method used

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  • Ceramic substrate for integrated packaging
  • Ceramic substrate for integrated packaging
  • Ceramic substrate for integrated packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A ceramic substrate for integrated packaging, prepared from the following raw materials in parts by weight: 30 parts of aluminum nitride, 30 parts of boron nitride, 30 parts of aluminum oxide, 10 parts of beryllium oxide, 5 parts of glass sintering aids, copper aluminum 5 parts of alloy nanoparticles, 2 parts of rare earth oxide, 5 parts of organic solvent, 1 part of plasticizer, 1 part of dispersant, and 1 part of binder;

[0043] Wherein, the ceramic substrate for integrated packaging is prepared through the following steps:

[0044] Step 1: Add aluminum nitride, boron nitride, aluminum oxide, beryllium oxide, copper aluminum alloy nanoparticles, rare earth oxides, organic solvents, plasticizers, dispersants, binders, and glass sintering aids into the ball mill, Wet ball milling for 3 hours to prepare ceramic slurry;

[0045] Step 2: Press the ceramic slurry into the mold, gel and dry to obtain the ceramic green sheet;

[0046] Step 3: Put the ceramic green sheet in...

Embodiment 2

[0051] A ceramic substrate for integrated packaging, prepared from the following raw materials in parts by weight: 40 parts of aluminum nitride, 40 parts of boron nitride, 40 parts of aluminum oxide, 20 parts of beryllium oxide, 10 parts of glass sintering aids, copper aluminum 10 parts of alloy nanoparticles, 5 parts of rare earth oxides, 10 parts of organic solvents, 2 parts of plasticizers, 2 parts of dispersants, and 2 parts of binders;

[0052]Wherein, the ceramic substrate for integrated packaging is prepared through the following steps:

[0053] Step 1: Add aluminum nitride, boron nitride, aluminum oxide, beryllium oxide, copper aluminum alloy nanoparticles, rare earth oxides, organic solvents, plasticizers, dispersants, binders, and glass sintering aids into the ball mill, Wet ball milling for 5 hours to prepare ceramic slurry;

[0054] Steps 2, 3 and 4 are the same as in Example 1.

[0055] Specifically, the glass sintering aid is prepared by the following steps: We...

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Abstract

The invention discloses a ceramic substrate for integrated packaging. In the invention, aluminum nitride, boron nitride, aluminum oxide and beryllium oxide are used as main raw materials, and meanwhile, additives such as a glass sintering aid, copper-aluminum alloy nanoparticles, rare earth oxide, a solvent, a plasticizer, a dispersing agent and a binder are added, so that the physical and chemical properties of the ceramic substrate are further optimized; accoridng to GB / T 36133-2018, the thermal conductivity of the ceramic substrate for integrated packaging is 470 to 495 W / (m.k); the cuttingequipment can cut the ceramic substrate into six pieces through matched rotation of the upper supporting plate and the lower supporting plate, and meanwhile, cutting of the ceramic substrates of different sizes can be completed; the cutting is efficient, the cutting equipment can cut two ceramic substrates at the same time, and the cutting efficiency is high. In addition, the whole feeding and discharging process is automatic, and participation of operators is not needed.

Description

technical field [0001] The invention relates to the technical field of ceramic substrate processing, in particular to a ceramic substrate for integrated packaging. Background technique [0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of an alumina or aluminum nitride ceramic substrate at high temperature. The produced ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current-carrying capacity. ability. Ceramic substrates are increasingly used in ultra-high brightness LED lamps. At present, a prominent feature of circuit board system integration is large integration scale and high integration density, which is manifested in the large number of components and the integration of a large number of ultra-large-scale and large-scale integrated...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373H01L23/15H01L21/48C04B35/10C04B35/581C04B35/583C04B35/622C04B35/64
CPCC04B35/10C04B35/581C04B35/583C04B35/622C04B35/64C04B2235/3205C04B2235/3224C04B2235/3225C04B2235/3227C04B2235/402C04B2235/407H01L21/4807H01L23/15H01L23/3731
Inventor 陈桂锋
Owner 广州市胜翰计算机配件有限公司
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