Method for preparing flexible circuit board based on liquid crystal polymer film

A technology of flexible circuit boards and liquid crystal polymers, applied in chemical/electrolytic methods to remove conductive materials, printed circuits, printed circuit manufacturing, etc., can solve problems such as defects in the forming holes of flexible metal-clad plates, and achieve bending resistance Good foldability, good practicability, and simple operation

Active Publication Date: 2021-02-09
UNIV OF SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The present invention is mainly used to solve the problem that in the prior art, in the process of preparing flexible

Method used

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  • Method for preparing flexible circuit board based on liquid crystal polymer film
  • Method for preparing flexible circuit board based on liquid crystal polymer film
  • Method for preparing flexible circuit board based on liquid crystal polymer film

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0077]Example 1

[0078]For the liquid crystal polymer material, a liquid crystal copolyester of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid with a melting point of 280°C is selected, and the liquid crystal polymer material is dried in a vacuum drying oven, and the drying temperature is 150°C. The drying time is 5 hours, and the moisture content of the resin after drying is less than 400 ppm. A multi-layer co-extrusion blown film device was used to process the liquid crystal polymer by melt extrusion to form a film. Under the conditions of a draw ratio of 10 and an expansion ratio of 4, a film with a melting point of 280°C and a thickness of 25 μm was obtained. The film was placed in a high-temperature blast drying oven and treated at 260°C for 6 hours. After the treatment, the modulus adjustment process was completed at a cooling rate of 3°C / min, and the melting point of the film became 298°C.

[0079]Two electrolytic copper foils with a thickness of 10 μm and a surface roughnes...

Example Embodiment

[0081]Example 2

[0082]The difference from Example 1 is that the thickness of the liquid crystal polymer film 1 is 50 μm.

Example Embodiment

[0083]Example 3

[0084]The difference from Example 1 is that the time for the modulus adjustment process is 8 hours.

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Abstract

The invention discloses a method for preparing a flexible circuit board based on a liquid crystal polymer film, and the method comprises the steps: firstly, preparing a metal foil, and preparing a prefabricated film of a liquid crystal polymer material with the tensile modulus of 0.5-6.0 GPa and the bending modulus of 1.0-11.0 GPa; adjusting the tensile modulus of the prefabricated film from 0.5-6.0 GPa to 1.8-3.5 GPa through the modulus adjusting procedure; besides, adjusting the bending modulus of the prefabricated film to 2.0-8.0 GPa from 1.0-11.0 GPa through the modulus adjusting procedure, and obtainng a finished film, wherein the modulus adjustment process comprises the following steps: carrying out heat treatment on the prefabricated film under the condition of temperature T, cooling the prefabricated film, and controlling the heat treatment time t and the cooling rate vt; then, enabling the metal foil and the finished film to be subjected to hot press molding, and obtaining a molded metal-clad plate; and finally, etching a circuit on the metal conductive layer coated with the metal plate according to the circuit design drawing, and carrying out hole turning and electroplating on the circuit to obtain the flexible circuit board. The problem that in the prior art, a metal-clad plate has the hole forming defect can be solved.

Description

technical field [0001] The invention belongs to the technical field of flexible circuit board preparation, and mainly relates to a method for preparing a flexible circuit board based on a liquid crystal polymer film. Background technique [0002] With the rapid development of communication equipment and technology, the production and preparation of high-performance high-frequency substrate materials has become an indispensable part of the development of high-frequency wireless communication. The flexible circuit board is a single-layer or multi-layer flexible circuit board formed by using a flexible metal-clad plate through the flexible printed circuit board (FPC) process. Steps form a line. When preparing a multi-layer circuit board, the liquid crystal polymer film can be directly used as an adhesive layer and laminated with metal foil to form a metal-clad board, or a low-dielectric adhesive sheet can be used to bond the liquid crystal polymer film and metal foil in sequen...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/0011H05K3/0014H05K3/06
Inventor 李良彬赵浩远
Owner UNIV OF SCI & TECH OF CHINA
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