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A kind of printed circuit board osp micro-etching pretreatment liquid and micro-etching method

A technology for printed circuit boards and pretreatment liquids, which is applied in printed circuits, printed circuit manufacturing, and removal of conductive materials by chemical/electrolytic methods. The effect of stable etching solution, improving utilization rate and accelerating copper bite rate

Active Publication Date: 2022-07-12
珠海联鼎化工设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Patent CNl0l351090 discloses a formula of copper surface micro-etching treatment agent, its main components are organic copper 10%-50%, organic acid 10%-30%, guanidine compound 0.1%-5%, azole compound 0.1% ~5%, alcohol amine compounds 0.1%~5%, among which guanidine compounds are made of Cu 2+ Functional substances that ions bite the copper surface vertically. Although some complexing agents are added, the existence of copper ions will still lead to poor stability and short service life of the microetching solution.

Method used

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  • A kind of printed circuit board osp micro-etching pretreatment liquid and micro-etching method
  • A kind of printed circuit board osp micro-etching pretreatment liquid and micro-etching method
  • A kind of printed circuit board osp micro-etching pretreatment liquid and micro-etching method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Chemical micro-etching solutions include: H 2 O 2 (6)+H 2 SO 4 (10g / L), N-methylbenzylamine 5g / L, butanediol 2g / L, alkenoic acid methylene amide ester 0.5g / L, corrosion inhibitor is benzotriazole 0.2g / L, three Ethanolamine 3ml / L.

[0061] The copper sheets obtained above are measured by parameters including appearance brightness, copper surface bite uniformity, maximum copper ion concentration that can be accommodated in the bath, bite corrosion rate and final rate decrease rate, and fingerprint print degreasing function, etc. The appearance brightness is 5 (5 means excellent, 4 means good, 3 means poor, 2 means poor, 1 means very poor); bite uniformity 5 (5 means excellent uniformity, 4 means good uniformity, 3 means poor uniformity, 2 Represents poor uniformity, 1 represents very poor solderability); the maximum copper ion concentration that the bath can accommodate is 40g / L, and the immersion bite rate from the beginning to the maximum accommodated copper ion con...

Embodiment 2

[0063] H 2 O 2 (18g / L)+H 2 SO 4 (10g / L), N-methylbenzylamine 15g / L, butanediol 2g / L, alkenoic acid methylene amide ester 0.5g / L, corrosion inhibitor is benzotriazole 0.2g / L, triazole Ethanolamine 3mL / L.

[0064] The copper sheets obtained above are measured by parameters including appearance brightness, copper surface bite uniformity, maximum copper ion concentration that can be accommodated in the bath, bite corrosion rate and final rate decrease rate, and fingerprint print degreasing function, etc. The appearance brightness is 5 (5 means excellent, 4 means good, 3 means poor, 2 means poor, 1 means very poor); bite uniformity 5 (5 means excellent uniformity, 4 means good uniformity, 3 means poor uniformity, 2 Represents poor uniformity, 1 represents very poor solderability; the maximum copper ion concentration that the bath can accommodate is 40g / L, and the immersion bite rate from the beginning to the maximum accommodated copper ion concentration ranges from 0.8 to 1.2 μ...

Embodiment 3

[0066] H 2 O 2 (6g / L)+H 2 SO 4 (10g / L), N-methylbenzylamine 5g / L, butanediol 8g / L, alkenoic acid methylene amide ester 1.5g / L, corrosion inhibitor is benzotriazole 0.55g / L, triazole Ethanolamine 3mL / L.

[0067] The copper sheets obtained above are measured by parameters including appearance brightness, copper surface bite uniformity, maximum copper ion concentration that the bath can accommodate, bite rate and final rate decline rate, and fingerprint print degreasing function, etc. The appearance brightness is 5 (5 means excellent, 4 means good, 3 means poor, 2 means poor, 1 means very poor); bite uniformity 5 (5 means excellent uniformity, 4 means good uniformity, 3 means poor uniformity, 2 Represents poor uniformity, 1 represents very poor solderability); the maximum copper ion concentration that the bath can accommodate is 40g / L, and the immersion bite rate from the beginning to the maximum accommodated copper ion concentration ranges from 0.8 to 1.2 μm / min; fingerprint...

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Abstract

The invention discloses a pre-treatment solution for OSP micro-etching of printed circuit boards and a micro-etching method. The pre-treatment solution for OSP micro-etching of printed circuit boards comprises raw materials with the following concentration components: copper ion complexing agent 5-15 g / L , hydrogen peroxide stabilizer 2~8g / L, hydrogen peroxide activation accelerator 0.5~1.5g / L, corrosion inhibitor 0.2~0.55g / L and cationic surfactant 3~6mL / L, additive compound pH=8±1.0 . The beneficial effects of the present invention are as follows: the OSP micro-etching pretreatment solution of the printed circuit board provided by the present invention has the advantages of bright and clean copper surface, uniform etching rate and kept within the range of 0.8-1.2 μm / min, stable micro-etching solution and the like.

Description

technical field [0001] The invention relates to the technical field of OSP pre-etching, in particular to a pre-treatment solution for OSP micro-etching of printed circuit boards and a micro-etching method. Background technique [0002] As a surface treatment process for packaging carrier boards and printed circuit boards, OSP has the advantages of good oxidation resistance, excellent solderability, and low cost. It is compatible with other surface treatment methods such as chemical silver, chemical gold, nickel gold and nickel. Compared with palladium, it has incomparable advantages. [0003] However, at present, the domestic OSP pretreatment micro-etching technology has always been at a competitive disadvantage compared with some companies in developed foreign countries such as Japan, such as Meger. Too fast, the retention is relatively low; on the other hand, the bite roughness and uniformity are quite different from those of Meg. At present, the main systems of micro-et...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06C23F1/18
CPCH05K3/067C23F1/18
Inventor 许国军杨荣华卢意鹏齐文茂刘高飞许香林吴运会
Owner 珠海联鼎化工设备有限公司
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