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Ammonia-nitrogen-free environment-friendly micro-etching pretreatment liquid and treatment method

A pre-treatment liquid, ammonia-free technology, applied in the field of solder resist and tin pre-treatment corrosion, OSP, can solve the problems of short service life and lack of bath liquid, improve utilization rate, promote intergranular reaction, and improve roughness The effect of degree and uniformity

Active Publication Date: 2021-02-23
珠海联鼎化工设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Patent CN108950558A discloses a formula of copper surface micro-etching treatment agent, its main components are potassium persulfate 6%-10%, sulfuric acid 3%-7%, citric acid 0.2%-0.4%, potassium persulfate stabilizer 0.1%~0.3%, reaction inhibitor 0.02%~0.06%, although the microetching agent does not use ammonia nitrogen compounds, but due to the lack of copper ion complexing agent, the service life of the bath is too short

Method used

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  • Ammonia-nitrogen-free environment-friendly micro-etching pretreatment liquid and treatment method
  • Ammonia-nitrogen-free environment-friendly micro-etching pretreatment liquid and treatment method
  • Ammonia-nitrogen-free environment-friendly micro-etching pretreatment liquid and treatment method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] Chemical microetching solution includes: H 2 o 2 (6g / L)+H 2 SO 4 (10g / L), sulfosalicylic acid 5g / L, ethylene glycol 2mL / L, itaconic acid 0.5g / L, corrosion inhibitor phytic acid 0.25g / L, ethanol and emulsifier compound 0.5mL / L, roughening agent is cyclohexanoic acid 0.05g / L.

[0058] The parameters of the above obtained copper sheet include appearance brightness, uniformity of copper surface erosion, maximum copper ion concentration that can be accommodated in the bath, erosion rate and final rate reduction rate, and fingerprint printing and oil removal function. (5 represents excellent, 4 represents good, 3 represents poor, 2 represents poor, 1 represents very poor); erosion uniformity 5 (5 represents excellent uniformity, 4 represents good uniformity, 3 represents poor uniformity, 2 Represents poor uniformity, 1 represents very poor solderability); the maximum concentration of copper ions in the bath solution is 40g / L, and the corrosion rate of immersion corrosion...

Embodiment 2

[0060] Chemical microetching solution includes: H 2 o 2 (6g / L)+H 2 SO 4 (10g / L), sulfosalicylic acid 5g / L, ethylene glycol 2mL / L, itaconic acid 0.5g / L, corrosion inhibitor phytic acid 0.25g / L, ethanol and emulsifier compound 0.5mL / L, roughening agent is cyclohexanoic acid 0.05g / L.

[0061] The parameters of the above obtained copper sheet include appearance brightness, uniformity of copper surface erosion, maximum copper ion concentration that can be accommodated in the bath, erosion rate and final rate reduction rate, and fingerprint printing and oil removal function. (5 represents excellent, 4 represents good, 3 represents poor, 2 represents poor, 1 represents very poor); erosion uniformity 5 (5 represents excellent uniformity, 4 represents good uniformity, 3 represents poor uniformity, 2 Represents poor uniformity, 1 represents very poor solderability; the maximum concentration of copper ions in the bath solution is 40g / L, and the corrosion rate of immersion and corros...

Embodiment 3

[0063] Chemical microetching solution includes: H 2 o 2 (6g / L)+H 2 SO 4 (10g / L), sulfosalicylic acid 15g / L, ethylene glycol 2mL / L, itaconic acid 0.5g / L, corrosion inhibitor phytic acid 0.25g / L, ethanol and emulsifier compound 0.5mL / L, roughening agent is cyclohexanoic acid 0.15g / L.

[0064] The parameters of the above obtained copper sheet include appearance brightness, uniformity of copper surface erosion, maximum copper ion concentration that can be accommodated in the bath, erosion rate and final rate reduction rate, and fingerprint printing and oil removal function. (5 represents excellent, 4 represents good, 3 represents poor, 2 represents poor, 1 represents very poor); erosion uniformity 5 (5 represents excellent uniformity, 4 represents good uniformity, 3 represents poor uniformity, 2 Represents poor uniformity, 1 represents very poor solderability); the maximum concentration of copper ions in the bath solution is 40g / L, and the corrosion rate of immersion corrosio...

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Abstract

The invention discloses ammonia-nitrogen-free environment-friendly micro-etching pretreatment liquid and a treatment method. The ammonia-nitrogen-free environment-friendly micro-etching pretreatment liquid comprises the following raw materials in concentration: 6 g / L-18 g / L of hydrogen peroxide, 10 g / L of sulfuric acid, 5 g / L-15 g / L of a copper ion complexing agent, 2 g / L-8 g / L of a hydrogen peroxide stabilizer, 0.5 g / L-1.5 g / L of a hydrogen peroxide activation promoter, 0.2 g / L-0.55 g / L of a corrosion inhibitor, 0.05 g / L-0.15 g / L of a coarsening agent and 0.5 mL / L-1.5 mL / L of an oil removingagent, and the pH of a composite additive is 4+ / -1.0. The ammonia-nitrogen-free environment-friendly micro-etching pretreatment liquid has the beneficial effects that the micro-etching liquid is provided with a copper surface which is bright and clean, the etching rate is uniform and is kept within the range of 0.5 micron / min-0.6 micron / min, and the micro-etching liquid is stable.

Description

technical field [0001] The invention relates to the technical field of OSP, solder resist and tin-melting pretreatment etch, and specifically relates to an ammonia nitrogen-free environment-friendly micro-etch pretreatment liquid and a treatment method. Background technique [0002] There are many types of pre-treatments for OSP, solder resist and tin-tin micro-etching, but most of the micro-etching agents on the market with ammonia nitrogen compounds as the main additive components occupy an absolute advantage in the market. Facing the increasingly severe environmental protection situation, ammonia nitrogen treatment is time-consuming and laborious At the same time, it poses a challenge to the trend of environmental protection. Under this background, the company complies with the development trend of the times and develops a non-ammonia nitrogen microetch agent with good effect. [0003] In the modern technology, the patent CN110079804A can be cited as the microetching solu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18
CPCC23F1/18Y02P10/20
Inventor 许国军杨荣华卢意鹏齐文茂刘高飞许香林吴运会
Owner 珠海联鼎化工设备有限公司
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