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Printed circuit board OSP micro-etching pretreatment liquid and micro-etching method

A technology for printed circuit boards and pre-treatment liquids, which is applied in printed circuits, printed circuit manufacturing, and chemical/electrolytic methods to remove conductive materials. The effect of stable etching solution, bright and clean copper surface, and uniform etching rate

Active Publication Date: 2021-02-09
珠海联鼎化工设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Patent CNl0l351090 discloses a formula of copper surface micro-etching treatment agent, its main components are organic copper 10%-50%, organic acid 10%-30%, guanidine compound 0.1%-5%, azole compound 0.1% ~5%, alcohol amine compounds 0.1%~5%, among which guanidine compounds are made of Cu 2+ Functional substances that ions bite the copper surface vertically. Although some complexing agents are added, the existence of copper ions will still lead to poor stability and short service life of the microetching solution.

Method used

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  • Printed circuit board OSP micro-etching pretreatment liquid and micro-etching method
  • Printed circuit board OSP micro-etching pretreatment liquid and micro-etching method
  • Printed circuit board OSP micro-etching pretreatment liquid and micro-etching method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Chemical microetching solution includes: H 2 o 2 (6)+H 2 SO 4 (10g / L), N-methyl amine 5g / L, butanediol 2g / L, enoic acid methylene amidoester 0.5g / L, corrosion inhibitor is benzotriazole 0.2g / L, three Ethanolamine 3ml / L.

[0061] The parameters of the above obtained copper sheet include appearance brightness, uniformity of copper surface erosion, maximum copper ion concentration that can be accommodated in the bath, erosion rate and final rate reduction rate, and fingerprint printing and oil removal function. (5 represents excellent, 4 represents good, 3 represents poor, 2 represents poor, 1 represents very poor); erosion uniformity 5 (5 represents excellent uniformity, 4 represents good uniformity, 3 represents poor uniformity, 2 Represents poor uniformity, 1 represents very poor solderability); the bath can accommodate a maximum concentration of copper ions of 40g / L, and the immersion corrosion rate ranges from 0.8 to 1.2 μm / min from the beginning to the maximum co...

Embodiment 2

[0063] h 2 o 2 (18g / L)+H 2 SO 4 (10g / L), N-methyl amine 15g / L, butanediol 2g / L, enoic acid methylene amidoester 0.5g / L, corrosion inhibitor is benzotriazole 0.2g / L, three Ethanolamine 3mL / L.

[0064] The parameters of the above obtained copper sheet include appearance brightness, uniformity of copper surface erosion, maximum copper ion concentration that can be accommodated in the bath, erosion rate and final rate reduction rate, and fingerprint printing and oil removal function. (5 represents excellent, 4 represents good, 3 represents poor, 2 represents poor, 1 represents very poor); erosion uniformity 5 (5 represents excellent uniformity, 4 represents good uniformity, 3 represents poor uniformity, 2 Represents poor uniformity, 1 represents very poor solderability; the maximum concentration of copper ions in the bath solution is 40g / L, and the corrosion rate of immersion corrosion ranges from 0.8 to 1.2 μm / min from the beginning to the maximum concentration of copper ions...

Embodiment 3

[0066] h 2 o 2 (6g / L)+H 2 SO 4 (10g / L), N-methyl amine 5g / L, butanediol 8g / L, enoic acid methylene amidoester 1.5g / L, corrosion inhibitor is benzotriazole 0.55g / L, three Ethanolamine 3mL / L.

[0067] The parameters of the above obtained copper sheet include appearance brightness, uniformity of copper surface erosion, maximum copper ion concentration that can be accommodated in the bath, erosion rate and final rate reduction rate, and fingerprint printing and oil removal function. (5 represents excellent, 4 represents good, 3 represents poor, 2 represents poor, 1 represents very poor); erosion uniformity 5 (5 represents excellent uniformity, 4 represents good uniformity, 3 represents poor uniformity, 2 Represents poor uniformity, 1 represents very poor solderability); the bath can accommodate a maximum concentration of copper ions of 40g / L, and the immersion corrosion rate ranges from 0.8 to 1.2 μm / min from the beginning to the maximum concentration of copper ions; The oil ...

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Abstract

The invention discloses a printed circuit board OSP micro-etching pretreatment solution and a micro-etching method. The printed circuit board OSP micro-etching pretreatment solution comprises the following raw materials by concentration: 5-15g / L of a copper ion complexing agent, 2-8g / L of a hydrogen peroxide stabilizer, 0.5-1.5 g / L of a hydrogen peroxide activation promoter, 0.2-0.55 g / L of a corrosion inhibitor and 3-6mL / L of a cationic surfactant, wherein the pH value of the additive compound liquid is 8 + / -1.0. the OSP micro-etching pretreatment liquid for the printed circuit board has theadvantages that the copper surface is bright and clean, the etching rate is uniform and is kept within the range of 0.8-1.2 mu m / min, and the micro-etching liquid is stable.

Description

technical field [0001] The invention relates to the technical field of OSP pretreatment etching, in particular to a printed circuit board OSP microetching pretreatment solution and a microetching method. Background technique [0002] As a surface treatment process for packaging substrates and printed circuit boards, OSP has the advantages of good oxidation resistance, excellent solderability, and low cost. Compared with other surface treatment methods such as chemical silver, chemical gold, nickel gold and nickel Compared with palladium, it has incomparable advantages. [0003] However, the current domestic OSP pre-treatment micro-etching technology has been at a competitive disadvantage compared with some companies in foreign developed countries such as Japan and other countries, such as Meige. If it is too fast, the retention is relatively low; on the other hand, the erosion roughness and uniformity are quite different from those of Meg. At present, the main systems of m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06C23F1/18
CPCH05K3/067C23F1/18
Inventor 许国军杨荣华卢意鹏齐文茂刘高飞许香林吴运会
Owner 珠海联鼎化工设备有限公司
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