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Low-smoke-density low-heat-release halogen-free flame-retardant PC material and preparation method and application thereof

A smoke density and low heat technology, applied in the field of low smoke density, low heat release, halogen-free flame retardant PC material and its preparation, can solve the problem of releasing a large amount of smoke and heat, achieve simple operation, scientific design, improve smoke density and heat release performance effect

Active Publication Date: 2021-02-26
SICHUAN COREMER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] One of the objectives of the present invention is to provide a low-smoke density, low-heat release halogen-free flame-retardant PC material, which solves the problem that a large amount of smoke and heat are released when the flame-retardant modified PC composite material is burned in the prior art

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  • Low-smoke-density low-heat-release halogen-free flame-retardant PC material and preparation method and application thereof
  • Low-smoke-density low-heat-release halogen-free flame-retardant PC material and preparation method and application thereof
  • Low-smoke-density low-heat-release halogen-free flame-retardant PC material and preparation method and application thereof

Examples

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Embodiment 1-3

[0061] Examples 1-3 disclose the synthesis method of the organosilicon / phenoxyphosphazene of the present invention.

Embodiment 1

[0063] This embodiment discloses the synthesis method of organosilicon / phenoxyphosphazene of the present invention, specifically:

[0064] ①. Use 40g of hexachlorocyclotriphosphazene to open the ring at 250°C to prepare linear chlorine-containing polyphosphazene. After the reaction is complete, stop heating and set aside;

[0065] ②. At high temperature (160°C), pass 200g of 5wt% NaOH aqueous solution into 100g of xylene containing 10g of bisphenol A and immediately separate the water. When bisphenol A disodium salt is formed and precipitated, use iso Propanol is dissolved, and finally all the solvent is evaporated to obtain dry bisphenol A disodium salt, and finally the prepared bisphenol A disodium salt is dissolved in xylene to prepare 10% bisphenol A disodium salt-xylene solution;

[0066] ③. The linear chlorine-containing polyphosphazene prepared in step ①, 10g methyltrichlorochlorosilane, 80g 10wt% bisphenol A phenol disodium-xylene solution were reacted at 80°C for 2h,...

Embodiment 2

[0068] This embodiment discloses the synthesis method of organosilicon / phenoxyphosphazene of the present invention, specifically:

[0069] ①. Use 45g of hexachlorocyclotriphosphazene to open the ring at 250°C to prepare linear chlorine-containing polyphosphazene. After the reaction is complete, stop heating and set aside;

[0070] ②.Using xylene as a solvent, put 200g of 5wt% NaOH aqueous solution into 100g of xylene containing 10g of bisphenol A at high temperature (160°C) and immediately separate the water, when bisphenol A disodium salt is formed and precipitated Then dissolve it with isopropanol, and finally evaporate all the solvents to obtain dry bisphenol A disodium salt, and finally dissolve the prepared bisphenol A disodium salt in xylene to prepare 15wt% bisphenol A disodium salt salt-xylene solution;

[0071] ③. The linear chlorine-containing polyphosphazene prepared in step ①, 13g ethyltrichlorochlorosilane, 90g 15wt% bisphenol A phenol disodium-xylene solution we...

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Abstract

The invention belongs to the technical field of polymer composite materials, and discloses a low-smoke-density low-heat-release halogen-free flame-retardant PC material and a preparation method and application thereof. The low-smoke-density low-heat-release halogen-free flame-retardant PC material is prepared from the following raw materials in percentage by weight: 10-80wt% of polycarbonate, 10-60wt% of polycarbonate siloxane copolymer, 4-20wt% of organic silicon / poly(bis(phenoxy)phosphazene) copolymer, 5-30wt% of mineral powder and 0.1-5 wt% of processing aid. The structural formula of the organosilicon / poly(bis(phenoxy)phosphazene) copolymer is shown as a formula I in the specification. The balance of mechanical properties, flame retardancy and processability of the PC material is fullyconsidered, the organic silicon / poly(bis(phenoxy)phosphazene) copolymer is creatively adopted as the flame retardant and smoke suppressant, and the smoke suppression and heat absorption effects of the inorganic mineral powder are assisted, so that the smoke density and heat release amount of the material during combustion are effectively reduced.

Description

technical field [0001] The invention belongs to the technical field of polymer composite materials, and in particular relates to a halogen-free flame-retardant PC material with low smoke density, low heat release, and a preparation method and application thereof. Background technique [0002] For vehicles such as rail transit / aircraft and indoor confined spaces with high concentration of people and relatively narrow and closed space, once the material is ignited and burned, it will consume a lot of oxygen, release heat and produce toxic and combustible gas, and the combustible gas will further support combustion This produces more toxic and flammable gases. As people pay more attention to the safety of travel and housing, it is urgently needed by the market to develop a product with low smoke density and low heat release during combustion and high temperature heating. [0003] In the public transport industry, passenger safety and escape are the main drivers of stringent fi...

Claims

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Application Information

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IPC IPC(8): C08L69/00C08L83/10C08K3/34C08K3/26C08K3/22C08G77/452
CPCC08L69/00C08G77/452C08L2201/02C08L2201/22C08K2003/2224C08L2205/025C08L2205/03C08L83/10C08K3/346C08K3/34C08K3/26C08K3/22
Inventor 田满红杨克斌赵银巧黄金刘光耀万绍群
Owner SICHUAN COREMER CO LTD
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