Nickel-platinum alloy sputtering target material and preparation method thereof

Abstract

The invention discloses a nickel-platinum alloy sputtering target material and a preparation method thereof. According to the technical scheme, the nickel-platinum alloy sputtering target material comprises, by mass, 05-65 parts of platinum powder and 35-95 parts of nickel powder. The preparation method comprises the following steps that S1, the platinum powder and the nickel powder are evenly mixed, large-particle impurities are filtered out, and powdery particles which are equal in size are reserved; and S2, the powdery particles reserved after filtering in S1 are poured into ethyl alcohol for soaking and cleaning. The nickel-platinum alloy sputtering target material and the preparation method thereof have the beneficial effects that the powder metallurgy mode is different from a traditional smelting method, and the nickel-platinum alloy sputtering target material obtained through powder metallurgy has better density; and in the actual use test, the nickel-platinum alloy sputtering target material and a base material have better adhering performance, and using is made more convenient and reliable. Compared with the traditional smelting method, the powder metallurgy mode can makethe preparation cost be greatly reduced, the preparation steps are greatly optimized, the preparation efficiency is improved, the preparation process is simplified, and thus the economic benefits areincreased.

Description

technical field [0001] The invention relates to the technical field of nickel-platinum alloys, in particular to a nickel-platinum alloy sputtering target and a preparation method thereof. Background technique [0002] Powder metallurgy is a process technology for producing metal powder or using metal powder (or a mixture of metal powder and non-metal powder) as raw material, forming and sintering to manufacture metal materials, composite materials and various types of products. The powder metallurgy method has similarities with the production of ceramics, and both belong to the powder sintering technology. Therefore, a series of new powder metallurgy technologies can also be used for the preparation of ceramic materials. Due to the advantages of powder metallurgy technology, it has become the key to solve the problems of new materials and plays a pivotal role in the development of new materials. [0003] In the field of semiconductor technology, noble metals have good chemi...

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Problems solved by technology

[0005] Therefore, the present invention provides a nickel-platinum alloy sputtering target and its preparation method. By using powder metallurgy, it is different from the traditional smelting method. The nickel-platinum alloy target obtained by powder metallurgy has better density. In the actual use test, it has better adhesion to the substrate, and is more convenient and reliable to use. At the same time, compared with the traditional smelting method, powder metallurgy greatly reduces its preparation cost, greatly optimizes the preparation steps, and improves the preparation efficiency. Simplifies the preparation process, thereby improving its economic benefits, to solve the problems of cumbersome steps, long preparation cycle and time-consuming preparation by smelting method in traditional technology