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High-thermal-conductivity insulating silica gel gasket and preparation method thereof

An insulating silica gel, high thermal conductivity technology, applied in chemical instruments and methods, heat exchange materials, etc., can solve the problems of high price and low thermal conductivity, achieve high thermal conductivity, reduce costs, and broaden the scope of application.

Pending Publication Date: 2021-03-09
JIANGSU JICUI ADVANCED POLYMER MATERIAL RES INST CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the thermal conductivity of thermal silica sheets in the domestic market is generally low, which limits its application, while silica gel sheets with high thermal conductivity are mainly imported, and the price is very expensive

Method used

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  • High-thermal-conductivity insulating silica gel gasket and preparation method thereof
  • High-thermal-conductivity insulating silica gel gasket and preparation method thereof
  • High-thermal-conductivity insulating silica gel gasket and preparation method thereof

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preparation example Construction

[0035] The present invention also proposes a preparation method for the above-mentioned high thermal conductivity insulating silica gel gasket, which includes the following steps: weighing each component according to the weight ratio, vacuum kneading vinyl silicone oil, thermal conductivity filler, and modifier for 30-40 minutes to obtain the base Then mix the base glue, cross-linking agent and inhibitor fully for 20-30 minutes, and finally add the platinum catalyst and vacuum mix for 15-20 minutes to obtain the mixed rubber, and then put it on the calender to be calendered and solidified with a certain temperature gradient. Obtain the heat-conducting silica gel gasket.

[0036] Preferably, the temperature range of the drying tunnel of the calender is divided into three temperature sections: 60-80°C, 90-110°C, and 120-150°C.

Embodiment 1

[0038] High thermal conductivity insulating silicone gasket, its raw materials include: 100 parts of vinyl silicone oil with a viscosity of 500mPa.s, 1500 parts of modified spherical alumina, 500 parts of nano-aluminum nitride, 3 parts of 202 high hydrogen-containing silicone oil, UC- 2 parts of 616-terminal hydrogen silicone oil, 3 parts of hexamethyldisilazane, 1 part of platinum catalyst, 0.05 part of acetylenic alcohol inhibitor;

[0039] Among them, in the preparation process of modified spherical alumina, dodecamethyltrimethoxysilane was mixed with methanol and water, and ammonia water was used to adjust the pH value to alkaline, then spherical alumina was added, the temperature was raised to 75°C, and the temperature was kept and stirred for 3 hours. Cool to room temperature, wash with methanol three times, vacuum filter, and dry at 80°C for 24 hours to obtain dodecamethyltrimethoxysilane-modified spherical alumina; wherein, dodecamethyltrimethoxysilane and spherical alu...

Embodiment 2

[0043] High thermal conductivity insulating silicone gasket, its raw materials include by mass: 100 parts of vinyl silicone oil with a viscosity of 800mPa.s, 700 parts of modified spherical alumina, 100 parts of cubic boron nitride, 2.5 parts of 202 high hydrogen-containing silicone oil, UC-616 1.5 parts of hydrogen-terminated silicone oil, 4 parts of vinyltriethoxysilane, 1 part of platinum catalyst, 0.05 parts of acetylenic alcohol inhibitor;

[0044] Among them, in the preparation process of modified spherical alumina, dodecamethyltrimethoxysilane was mixed with methanol and water, and ammonia water was used to adjust the pH value to alkaline, then spherical alumina was added, the temperature was raised to 75°C, and the temperature was kept and stirred for 3 hours. Cool to room temperature, wash with methanol three times, vacuum filter, and dry at 80°C for 24 hours to obtain dodecamethyltrimethoxysilane-modified spherical alumina; wherein, dodecamethyltrimethoxysilane and sp...

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Abstract

The invention discloses a high-thermal-conductivity insulating silica gel gasket comprising the following raw materials in parts by mass: 100 parts of vinyl silicone oil, 800-2000 parts of a thermal conductive filler, 2-5 parts of a cross-linking agent, 2-8 parts of a modifier, 1-3 parts of a platinum catalyst and 0.05-0.1 part of an inhibitor, wherein the thermal conductive filler is composed ofat least one of nano aluminum nitride, cubic boron nitride and nano silicon carbide and dodecyltrimethoxysilane modified spherical aluminum oxide. The invention further provides a preparation method of the high-thermal-conductivity insulating silica gel gasket. Through filler modification treatment and compounding design, the product has excellent properties of high thermal conductivity, high insulation, chemical stability and the like, the thermal conductivity coefficient can reach 8 W / (m*K) or above, and the product is used in the fields of consumer electronics, 5G communication, high-powerchips and the like with high heat dissipation requirements.

Description

technical field [0001] The invention relates to the technical field of heat conduction and heat dissipation, in particular to a high heat conduction insulating silicone gasket and a preparation method thereof. Background technique [0002] With the development of industrial production and science and technology, thermally conductive silicone sheet is used as a high-performance thermally conductive interface material to fill the gap between the heating device and the heat sink or metal base. Its flexibility and elasticity make it suitable for covering different The flat surface can form a good heat conduction path, and also play the role of insulation, shock absorption, and sealing. It is the most popular material in electronic products and electronic equipment. However, with the continuous upgrading of electronic products, the power consumption of equipment continues to increase, and the heat generation also increases. The market's heat conduction requirements for thermall...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K9/06C08K7/18C08K3/28C08K5/5445C08K3/38C08K3/34C08K5/5419C08K9/02C09K5/14
CPCC08L83/04C09K5/14C08K2201/011C08K2003/282C08K2003/385C08L2205/03C08L2205/025C08K9/06C08K7/18C08K3/28C08K5/544C08K3/38C08K3/34C08K5/5419C08K9/02
Inventor 雷军徐晶晶李忠明鄢定祥张力
Owner JIANGSU JICUI ADVANCED POLYMER MATERIAL RES INST CO LTD
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