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Preparation method of fused silica powder for high-frequency high-speed copper-clad plate

A technology for silicon micropowder and copper clad laminate, which is applied in the field of preparation of molten silicon micropowder for high frequency and high speed copper clad laminates, can solve problems such as complicated processes, and achieve the effects of simple process, not easy to absorb water, and good compatibility.

Active Publication Date: 2021-03-16
JIANGSU NOVORAY NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method requires secondary surface modification of spherical silica, followed by high-temperature dehydration, and the process is complex

Method used

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  • Preparation method of fused silica powder for high-frequency high-speed copper-clad plate
  • Preparation method of fused silica powder for high-frequency high-speed copper-clad plate
  • Preparation method of fused silica powder for high-frequency high-speed copper-clad plate

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] In step (1), the raw material of high-purity molten silicon micropowder with a particle size of D50=110.2 μm, diameter distance=1.31, magnetic substance=2.0 ppm, and silicon dioxide content of 99.93% is added to a jet mill for crushing, and the molten silicon is obtained by classification Micro powder semi-finished product, wherein the crushing pressure is 0.4MPa, the air flow temperature is 120°C, the particle size obtained by classification is D50=13.4μm, D100=52.7μm, 2 / g, a semi-finished product of fused silica powder with a silicon dioxide content of 99.92% and a moisture content of 0.08%;

[0031] In step (2), the semi-finished product of molten silicon powder is added to the modification machine, and the fluorine-containing silane KBM7103 (Shin-Etsu Chemical Industry Co., Ltd. of Japan) is added at the same time, and the modification is carried out at a temperature of 220 ° C. The modification time is 1.0 h, and then The fused silicon micropowder product for high-...

Embodiment 2

[0033] In step (1), the particle size is D50=38.2μm, the diameter distance=1.40, the magnetic substance=2.6ppm, and the high-purity fused silica sand of the high-purity fused silica micropowder raw material with a silicon dioxide content of 99.91% is added in the jet mill to carry out Crushing and grading to obtain a semi-finished product of fused silica powder, wherein the crushing pressure is 0.6MPa, and the airflow temperature is 160°C. The particle size of the semi-finished fused silica powder is D50=9.2μm, D100=41.2μm, 2 / g, silicon dioxide content is 99.89%, moisture content is 0.07%;

[0034] In step (2), add the semi-finished product of fused silica powder into the modification machine, and at the same time add heptadecafluorodecyltrimethoxysilane (Hangzhou Jessica Chemical Co., Ltd.), and modify it at a temperature of 240°C. The time is 1.0h, and then graded to obtain a fused silica powder product for high-frequency copper clad laminates, wherein the fused silica powd...

Embodiment 3

[0036] In step (1), the raw material of high-purity molten silicon micropowder with a particle size of D50=55.3 μm, radial distance=1.35, magnetic substance=2.2 ppm, and a silicon dioxide content of 99.91% is added to a jet mill for crushing, and the molten silicon is obtained by classification Micro-powder semi-finished product, in which the crushing pressure is 0.5MPa, the air flow temperature is 160°C, the particle size of the fused silica micro-powder semi-finished product is D50=11.4μm, D100=47.2μm, 2 / g, silicon dioxide content is 99.90%, moisture content is 0.06%;

[0037] In step (2), the semi-finished product of fused silica powder is added to the modification machine, and tridecafluorooctyltrimethoxysilane (Hangzhou Jessica Chemical Co., Ltd.) is added at the same time to modify at a temperature of 220 ° C. The modification time 1.0h, and then graded to obtain fused silica powder products for high-frequency copper-clad laminates, wherein the moisture content of the fu...

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Abstract

The invention discloses a preparation method of fused silica powder for a high-frequency high-speed copper-clad plate. The method comprises the following steps: adding narrow-distributed high-purity fused silica powder into a high-temperature jet mill for crushing, grading to obtain a high-purity fused silica powder semi-finished product with low specific surface area and low moisture content, modifying by using fluorosilane under a high-temperature condition, and further dehydrating to obtain the fused silica powder for the high-frequency and high-speed copper-clad plate with low moisture content and low water absorption is obtained. The method disclosed by the invention is short in flow, simple in process and suitable for industrial production, and the prepared fused silica powder is lowin Df, has low water absorption and excellent mechanical properties, and is particularly suitable for PTFE resin.

Description

technical field [0001] The invention relates to the technical field of deep processing of inorganic non-metallic materials, and relates to a preparation method of molten silicon micropowder for high-frequency and high-speed copper-clad laminates. Background technique [0002] With the advent of the 5G era, automatic driving, automobile collision avoidance systems, high-speed and large-capacity storage, positioning systems, and the Internet of Things are widely used, and electronic materials and electronic components are required to have high-frequency, high-speed and large-capacity storage and transmission signals. function. The circuit substrate is the key to determine the performance of electronic and communication products, and the carrier copper clad laminate for signal transmission and its important component filler determine the performance of the circuit substrate. The existing printed board materials Dk and Df cannot meet the high-frequency and high-speed transmissi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K3/36C08K9/06C08L27/18C01B33/18
CPCC08K3/36C08K9/06C01B33/18C08K2201/003C08K2201/006C01P2004/61C01P2004/62C01P2004/51C01P2006/12C01P2006/80C01P2006/82C08L27/18
Inventor 李晓冬曹家凯孙小耀刘亚飞王聿东顾东进
Owner JIANGSU NOVORAY NEW MATERIAL CO LTD
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