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Method for producing electrolytic copper foil

A technology of electrolytic copper foil, manufacturing method, applied in electrolytic process, electroforming, electrode, etc., can solve problems such as coarse roughness, peeling of tin plating layer, etc.

Active Publication Date: 2021-03-23
泰科斯科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, Patent Document 2 proposes that by improving the electrolytic solution, the surface on the "rough side" side of the aforementioned "untreated electrolytic copper foil" is formed into a valley shape, the roughness is rough, and the peeling of the tin plating layer occurs. question

Method used

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  • Method for producing electrolytic copper foil
  • Method for producing electrolytic copper foil
  • Method for producing electrolytic copper foil

Examples

Experimental program
Comparison scheme
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Embodiment 1～8、 comparative example 1～7

[0114] Preparation containing sulfuric acid (H 2 SO 4 ) 100g / L, and copper sulfate pentahydrate (CuSO 4 ·5H 2 (0) sulfuric acid-copper sulfate aqueous solution of 280g / L. Hereinafter, this electrolytic solution is referred to as "basic electrolytic solution".

[0115] As additives to be added to the above-mentioned basic electrolytic solution, the following components were respectively prepared.

[0116] Additives (A): hydroxyethyl cellulose with a molecular weight of 250,000, hydroxyethyl cellulose with a molecular weight of 500,000 (both manufactured by DAICEL FINECHEM Co., Ltd.), polyglycerin (manufactured by DAICEL CHEMICAL INDUSTRIES CO., abbreviated as PGL )

[0117] ・Additive (B): Collagen peptide with a molecular weight of 5000 (manufactured by Asahi Chemical Industry Co., Ltd.)

[0118] ・Additive (C): Sodium 3-mercapto-1-propanesulfonate (manufactured by Koei Chemicals Co., Ltd.)

[0119] ・Additive (D): Thiourea (manufactured by Nippon Chemical Industries), N,N...

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Abstract

The present invention relates to a method for producing an electrolytic copper foil, the method enabling providing an electrolytic copper foil such that the electrical conductivity is 99% or more, thethickness is 10 [mu]m or less, a problem of a bend is suppressed, the front side and the rear side are flat, the tensile strength is 500 MPa or more, and the elongation percentage is 5.5% or more. The method for producing an electrolytic copper foil includes forming an electrolytic copper foil by using, as an electrolytic solution, a sulfuric acid-copper sulfate aqueous solution not containing aheavy metal other than a copper metal, using an insoluble anode and a cathode drum facing the insoluble anode, and passing a direct current between these electrodes, wherein, in the electrolytic solution, particular additives (A) to (E) are contained each in a particular amount, and the additive (D) and the additive (A) are each added in a ratio such that (D) / (A) is 0.2 to 0.7.

Description

technical field [0001] The present invention relates to a method for manufacturing electrolytic copper foil. Related to: A technology for providing an electrolytic copper foil useful as, for example, a negative electrode material of a secondary battery and a material for an electronic circuit board, the electrolytic copper foil exhibiting an electrical conductivity of 99% or more and having a thickness as thin as 10 μm or less, and also having a thickness of 500 MPa or more High tensile strength and high elongation of more than 5.5%, the rough surface becomes a smooth surface with low surface roughness, and the practical value is extremely high. Background technique [0002] Electrodeposited copper foil is manufactured by the following method using a plating technique as is well known. An aqueous solution containing sulfuric acid and copper sulfate is used as an electrolyte solution, and the electrolyte solution is filled between a cylindrical titanium drum as a cathode and...

Claims

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Application Information

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IPC IPC(8): C25D1/04C25D1/00H01M4/64H01M4/66H05K1/09
CPCC25D1/04H05K1/09C25D3/38H05K2201/0355C25D1/00H01M4/661Y02E60/10H05K1/0237C25D17/10H05K1/03
Inventor 小黑了一
Owner 泰科斯科技股份有限公司
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