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A multi-energy field assisted ultrashort pulse laser processing monitoring device and method

An ultra-short pulse laser, processing technology, applied in metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve the problems of few applications of multi-energy field-assisted technology, insufficient processing stability, and small heat-affected zone. Achieve the effect of improving product qualification rate, ensuring material processing quality, improving performance and quality

Active Publication Date: 2022-01-11
HUAZHONG UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This processing technology is not limited by the strength of the material, and can be used to process high-strength materials in the aerospace field. It has high efficiency and precision and a small heat-affected zone, but the processing stability is insufficient, and cavitation will also occur.
[0004] Existing studies have shown that special energy field assisted forming technology can significantly improve the forming efficiency and quality of materials, and can optimize the processing process of high-strength and difficult-to-deform materials by introducing ultrafast pulsed laser micromachining. There are not many applications, and it is also particularly important for the monitoring of multi-energy field coupling

Method used

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  • A multi-energy field assisted ultrashort pulse laser processing monitoring device and method

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Embodiment Construction

[0034] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

[0035] as attached figure 1 As shown, the present invention provides a multi-energy field assisted ultrashort pulse laser processing monitoring device, which includes a processing unit, an auxiliary unit, a monitoring unit, and a control unit, wherein,

[0036] The processing unit includes an ultrashort pulse laser 1, an optical path element, a three-degree-of-freedom motion platform 2, a squar...

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Abstract

The invention discloses a multi-energy field assisted ultrashort pulse laser processing process monitoring device and method. By controlling the motion platform, the laser light emitted by the ultrashort pulse laser passes through the optical path element and then focuses on the surface of the workpiece to induce plasma for microprocessing ; and introduce the coupling effect of acoustic field-magnetic field-flow field in the process of ultrashort pulse laser micromachining, and use high-magnification cameras and schlieren instruments to observe the plasma evolution process, bubble pulsation process and material removal process at different time and space scales, Capture the signal changes of the flow field, light field, and sound field during the processing, and use the thermal imager to observe the temperature field changes of the processing area and the surrounding fluid in an all-round way, and finally realize the accurate monitoring of the state of ultrashort pulse laser micromachining assisted by multi-energy fields. The multi-energy field-assisted ultrashort pulse laser processing process monitoring device provided by the invention is beneficial to ensure the quality of material processing, improve the qualified rate of products, and is especially suitable for the manufacturing process of micro-nano structure.

Description

technical field [0001] The invention belongs to the technical field of special energy field assisted manufacturing and monitoring, and more specifically relates to a multi-energy field assisted ultrashort pulse laser processing monitoring device and method. Background technique [0002] In order to meet the continuous requirements of lightweight and safety in the aerospace field, more and more high-strength materials are used to manufacture complex components, such as the preparation of anti-condensation super-hydrophobic interface micro-nano structures, and the complex wall of laval nozzles in wind tunnels Processing, but this type of structure is difficult to form and difficult to manufacture. [0003] Ultrafast pulsed laser micromachining is a non-contact processing technology with high shape and position accuracy. It induces optical breakdown of the medium through picosecond or femtosecond laser focusing, generates dense and opaque plasma, and uses plasma heat conduction...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/03B23K26/70
CPCB23K26/032B23K26/0342B23K26/707
Inventor 张臻张国军吴杰黄禹张意薛涛刘邓华
Owner HUAZHONG UNIV OF SCI & TECH
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