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Temperature sensor with NTC thermosensitive chip and preparation process of temperature sensor

A temperature sensor and heat-sensitive technology, applied in the field of sensors, can solve the problem that the reaction speed cannot meet the requirements of high sensitivity of temperature detection, etc., and achieve the effects of excellent heat transfer and heat transfer effect, good heat transfer effect, and good protection effect

Active Publication Date: 2021-04-06
句容市双诚电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This reaction speed cannot meet the requirements for high sensitivity of temperature detection

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A temperature sensor with an NTC thermosensitive chip, including a thermally conductive substrate, an NTC thermosensitive chip, leads, and a glass insulating packaging layer. The above-mentioned structure is a conventional structure of an existing sensor, which is not limited here, and can be designed according to existing technical requirements. Further, it also includes a transition metal base and a packaging extradition mechanism. The transition metal base adopts a metal mesh structure, which is located between the thermally conductive substrate and the NTC thermal chip, and is a transition layer, and the metal mesh-shaped transition metal base The upper is printed and coated with glass insulating paste, and after sintering, the metal mesh is located in the package of glass insulating paste, which is used as a connection strengthening skeleton and a heat conducting skeleton, which is practical and efficient. The outer diameter of the metal mesh is 0.02±0.002mm, and th...

Embodiment 2

[0034] Based on the temperature sensor structure of Embodiment 1, further preferably, the inner and outer walls of the packaging extradition mechanism are sprayed with a layer of conductive paste, and the thickness of the coating is 0.1-0.5 mm. The conductive paste adopts any one or combination of silver electronic paste and copper electronic paste. The composition is selected, and the two are mixed and applied at a volume ratio of 1:1.

Embodiment 3

[0036] Based on the temperature sensor structure of Example 1 or Example 2, both the transition metal base and the thermally conductive substrate contain copper, aluminum, tin, and manganese elements, and the (copper+aluminum+tin) element mass percentage accounts for an overlap ratio greater than 50%, the mass percentage of manganese element is greater than 5%, and the NTC thermal chip is connected to the thermally conductive substrate through a transition metal base and glass insulating paste;

[0037] Specifically, aluminum-tin-copper alloy ingots and aluminum-manganese alloy ingots with a mass ratio of 1:0.1-0.3 are selected as raw materials for forming the heat-conducting substrate. / T 3190-2008 standard.

[0038] The transition metal abutment is made of brass, bronze, titanium-aluminum alloy and zinc-manganese alloy by melting and casting, in which (copper + aluminum + tin) elements account for more than 70% by mass.

[0039] At the same time, the encapsulation extraditi...

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PUM

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Abstract

The invention provides a temperature sensor with an NTC (Negative Temperature Coefficient) thermosensitive chip and a preparation process of the temperature sensor. The temperature sensor comprises a heat conduction substrate, the NTC thermosensitive chip, a lead, a glass insulation packaging layer, a transition metal base station and a packaging introduction mechanism, wherein both the transition metal base station and the heat conduction substrate contain copper, aluminum, tin and manganese elements, the mass percentage of the (copper+aluminum+tin) elements is larger than 50%, the mass percentage of the manganese elements is larger than 5%, and the NTC thermosensitive chip is connected with the heat conduction substrate through the transition metal base table and the glass insulating slurry; the packaging introduction mechanismis made of composite metal material and in a corrugated pipe shape, and is connected to the heat conduction substrate by the infiltration sintering of glass insulated sizing agent. According to the temperature sensor, the structure of the sensor is reasonably designed, selection of raw materials is optimized, the prepared temperature sensor is high in sensitivity and strong in stability, and the effective service life is prolonged by more than one time.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a temperature sensor with an NTC thermosensitive chip and a preparation process thereof. Background technique [0002] With NTC thermal chip as the core component, thermistors and temperature sensors composed of different packages are widely used in various temperature detection, temperature compensation, and temperature control circuits. The central role of the electronic signal. [0003] With the development of electronic technology, various electronics are further multi-functional and intelligent, and the application of NTC thermal chips in various occasions that need to detect, control, and compensate temperature is increasing. [0004] Due to the sensitivity requirements of detecting temperature, the response speed of NTC temperature sensor is required to be faster and faster, which requires the thermal time constant of NTC temperature sensor to be as small as possible and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/22G01K1/08H01C7/00C22C21/08B05D5/12B05D1/26
CPCG01K7/22G01K1/08H01C7/008C22C21/08B05D5/12B05D1/26
Inventor 王梅凤
Owner 句容市双诚电子有限公司