Two-phase flow cooling device for IGBT

Abstract

The invention relates to a two-phase flow cooling device for IGBT. The device comprises a heat exchange cold plate module, a flow mixing pipe, a liquid storage buffer tank, a radiator and a power pump, the heat exchange cold plate module, the flow mixing pipe, the liquid storage buffer tank and the radiator are sequentially and annularly connected to form a cooling circulation flow channel, and the power pump is connected into the cooling circulation flow channel; and the heat exchange cold plate module comprises a hollow shell, the two ends of the shell are connected into the cooling circulation flow channels, a heat exchange panel is arranged on one side face of the shell, IGBTs are welded to the outer side face of the heat exchange panel, heat exchange fins are arranged on the inner side face of the heat exchange panel, and an intensified boiling layer is arranged on each heat exchange fin. Compared with like devices in the prior art, the cooling device has the advantages that efficient heat dissipation of small-flow refrigerants is achieved, the power requirement and the overall leakproofness requirement of the cooling device for the power pump are lowered, and the working stability is improved.

Description

technical field [0001] The invention relates to the field of IGBT heat dissipation, in particular to a two-phase flow cooling device for IGBT. Background technique [0002] At present, the cooling methods for high-power IGBT chips on the market mainly adopt forced air cooling and indirect liquid cooling technologies. [0003] The main way of air cooling is the forced convection heat transfer of fans and heat sinks. Its main disadvantages are: poor heat dissipation efficiency, unstable temperature control, greatly affected by the space environment and temperature, and the air cooling device occupies a large volume overall, the system is not airtight, and has a great impact on the life of the electronic components of the system. [0004] The indirect liquid cooling technology uses a liquid cooling plate for cooling. The IGBT chip is pasted on the liquid cooling plate through thermal paste, thermal adhesive, etc., and then the liquid cooling plate is connected to an external r...

AI Technical Summary

Problems solved by technology

Its main disadvantages are: poor heat dissipation efficiency, unstable temperature control, greatly affected by the space environment and air temperature, and the air cooling device occupies a large volume overall, the system is not airtight, and has a great impact on the life of electronic components in the system

Its main disadvantages are: controlling the temperature of the chip requires a large flow of refrigerant, which leads to large flow resistance and high pressure of the entire system, high requirements for the power of the system pump, and high requirements for the airtightness of the system, which is prone to failure. Poor stability; at the same time, water or ethylene glycol aqueous solution is generally used as the coolant, which may cause scaling and corrosion risks for a long time

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