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A kind of rutile titanium dioxide and its preparation method and application

A technology of titanium dioxide and rutile type, applied in the direction of titanium dioxide, titanium oxide/hydroxide, printed circuit components, etc., can solve the problems of low filling amount, low dielectric constant, high dielectric loss, etc., and achieve high spheroidization rate, high Effect of dielectric constant and low dielectric loss

Active Publication Date: 2022-01-14
SUZHOU GINET NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the high dielectric constant materials currently on the market are either too high in dielectric loss or low in filling content. The copper clad laminates made by filling with this material are either low in dielectric constant or high in dielectric loss, which cannot meet customer needs.

Method used

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  • A kind of rutile titanium dioxide and its preparation method and application
  • A kind of rutile titanium dioxide and its preparation method and application
  • A kind of rutile titanium dioxide and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0085] The preparation steps of rutile type titanium dioxide are as follows:

[0086] (1) Add hexadecane (2000 parts) into the reaction kettle, then add ammonia solution (35 parts), the concentration of ammonia water is 5mol / L, emulsify and stir at a high speed, the stirring speed is 3000rpm, and the stirring time is 30 minutes;

[0087] (2) Add tetrabutyl titanate (300 parts) into the reaction kettle emulsified in the above step (1) for homogenization and high-speed stirring, add ammonia water to the reaction kettle to control its pH value to 8.5, and the temperature is 240 °C, stirring The speed is 3000rpm, the reaction time is 6h, and spherical titanium dioxide is prepared.

[0088] (3) Calcining the spherical titanium dioxide prepared in step (2) at high temperature, the heating curve is as follows: calcination at 150°C for 2 hours, calcination at 600°C for 1.5 hours, and calcination at 1200°C for 5 hours.

[0089] pass Figure 1 to Figure 3 It can be seen that the chemi...

Embodiment 2

[0091] Use the spherical rutile titanium dioxide and PTFE emulsion produced in Example 1, mix it according to the mass ratio of 6:1 and make it into a resin composition. After drying, use a mold to press it into a bonding sheet of 500*500mm*5mm, and then use it 5 adhesive sheets with copper foil on both sides, pressed into a copper clad laminate under a pressure of 50kg and a temperature of 385°C.

[0092] After measurement, the viscosity of the resin composition is 600cps, the dielectric constant of the copper clad laminate is 13, and the dielectric loss is 0.0012.

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Abstract

The invention relates to a rutile titanium dioxide and its preparation method and application. The spheroidization rate of the rutile titanium dioxide is ≥ 95%, the particle size D50 is 2-8 microns, the relative dielectric constant is 100-120, and the dielectric loss is 0.0005- 0.002, TiO in rutile titanium dioxide 2 The content of ≥98wt%. The rutile titanium dioxide in the present invention has high spheroidization rate, high dielectric constant and low dielectric loss.

Description

technical field [0001] The invention belongs to the field of copper-clad laminates, and in particular relates to a rutile-type titanium dioxide and a preparation method and application thereof. Background technique [0002] Copper-clad laminates can be used as substrate materials in the production process of printed circuit boards, and are widely used in computer, communication, consumer electronics, industrial / medical, military, semiconductor and automotive industries, involving almost all electronic information products. [0003] With the rapid development of satellite, 5G communication, navigation and other fields, the application requirements of various electronic products are getting higher and higher. In order to meet the requirements of miniaturization, light weight, high speed, high frequency and precision, etc., It is necessary to develop fillers for copper clad laminates with high dielectric constant and low dielectric loss and copper clad laminates prepared theref...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C01G23/053C01G23/08C08L27/18C08K7/18C08K3/22H05K1/05
Inventor 贾波胡林政
Owner SUZHOU GINET NEW MATERIAL TECH CO LTD
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