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Method for preparing copper-tungsten alloy from ultrafine tungsten powder

A technology of ultra-fine tungsten powder and copper-tungsten alloy, used in metal processing equipment, coating, transportation and packaging, etc., can solve the problem of particle size limitation of tungsten powder, the influence of hardness and wear resistance of copper-tungsten alloy, preparation time of precursor preparation shortening of time

Active Publication Date: 2021-04-27
SHAANXI SIRUI ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

It not only solves the uniformity problem of copper-tungsten alloy powder, but also greatly shortens the preparation time, especially the preparation time of the precursor, and obtains pure copper-tungsten alloy powder, but does not limit the particle size of tungsten powder. When tungsten When the powder particle size is too large or irregular, it will affect the hardness and wear resistance of copper-tungsten alloy.

Method used

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  • Method for preparing copper-tungsten alloy from ultrafine tungsten powder
  • Method for preparing copper-tungsten alloy from ultrafine tungsten powder
  • Method for preparing copper-tungsten alloy from ultrafine tungsten powder

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Experimental program
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Embodiment 1

[0036] A method for preparing copper-tungsten alloy by using ultrafine tungsten powder, comprising the following steps:

[0037] S1. Pretreatment of tungsten powder:

[0038] S1-1. Ball milling: clean the tungsten powder and put it into a ball mill for 8 hours, and add absolute ethanol. The weight ratio of the amount of absolute ethanol added to the tungsten powder is 1:1, and the tungsten powder with a particle size of 10-50 μm after ball milling is obtained. ;

[0039] S1-2. Atomized powder making: use high-pressure water mist to atomize the ball-milled tungsten powder to obtain ultrafine tungsten powder with a particle size of 50-350nm after atomization;

[0040]S1-3. Alkali / pickling: The atomized ultrafine tungsten powder is subjected to alkali washing and pickling respectively. The steps of alkali washing are: immerse the ultrafine tungsten powder in the degreasing agent, the degreasing agent and the ultrafine tungsten The volume ratio of the powder is 4:1, and the comp...

Embodiment 2

[0048] This embodiment is basically the same as Embodiment 1, except that the particle size of the tungsten powder in the pretreatment of the tungsten powder is different.

[0049] S1. Pretreatment of tungsten powder:

[0050] S1-1. Ball milling: clean the tungsten powder and put it into a ball mill for 8 hours, and then add absolute ethanol. The weight ratio of the amount of absolute ethanol added to the tungsten powder is 1:1, and the tungsten powder with a particle size of 50-80 μm after ball milling is obtained. ;

[0051] S1-2. Atomized powder making: use high-pressure water mist to atomize the ball-milled tungsten powder to obtain ultrafine tungsten powder with a particle size of 350-600nm after atomization.

Embodiment 3

[0053] This embodiment is basically the same as Embodiment 1, except that the particle size of the pre-treated tungsten powder in step S1 is different.

[0054] S1. Pretreatment of tungsten powder:

[0055] S1-1. Ball milling: Clean the tungsten powder and put it into a ball mill for 8 hours, and add absolute ethanol. The weight ratio of the amount of absolute ethanol added to the tungsten powder is 1:1, and the tungsten powder with a particle size of 80-100 μm after ball milling is obtained. ;

[0056] S1-2. Atomized powder making: use high-pressure water mist to atomize the ball-milled tungsten powder to obtain ultrafine tungsten powder with a particle size of 600-800nm ​​after atomization.

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Abstract

The invention discloses a method for preparing copper-tungsten alloy from superfine tungsten powder. The method comprises the following steps of S1, tungsten powder pretreatment: ball milling, powder preparation through atomization, and alkali / acid pickling; S2, superfine tungsten powder surface copper coating: primary electroplating and secondary electroplating; S3, copper-coated tungsten powder reduction; S4, preforming and S5, vacuum hot pressed sintering. Compared with the copper-tungsten alloy prepared by other methods, the copper-tungsten alloy prepared by the preparation method has higher hardness, higher strength, higher wear resistance and higher arc ablation resistance, and the ultrafine-grained tungsten powder is used for coating, so that the coated particles are more stable and not easy to segregate, and the coating rate is higher, so that the uniformity of the product is ensured, and the service life of the copper-tungsten alloy is prolonged.

Description

technical field [0001] The invention relates to the technical field of preparation of copper-tungsten alloy contacts, in particular to a method for preparing copper-tungsten alloy by using ultrafine tungsten powder. Background technique [0002] Copper-tungsten alloy is a two-phase pseudo-alloy composed of two metals with very different physical properties, tungsten and copper. Tungsten-copper alloy combines the advantages of metal tungsten and copper. The advantages of strength and low thermal expansion coefficient, copper has high electrical conductivity and thermal conductivity, and is widely used in medium and high voltage switch contact materials, military high temperature resistant materials, electrical processing electrodes, electronic packaging materials and heat sink materials. [0003] Due to the high melting point of tungsten, the preparation of copper-tungsten composite materials can only be prepared by powder metallurgy. So far, conventional methods include the...

Claims

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Application Information

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IPC IPC(8): C22C1/04C22C27/04B22F1/02B22F3/14C25D3/38C25D5/10
CPCC22C1/045C22C27/04B22F3/14C25D3/38C25D5/10B22F1/17
Inventor 周兴周宁赵俊杨瑞刘萍徐秀琴
Owner SHAANXI SIRUI ADVANCED MATERIALS CO LTD
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