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Surface pretreatment method of metal material and production process of PCB

A surface pretreatment, metal material technology, applied in the improvement of metal adhesion of insulating substrates, secondary processing of printed circuits, electrical components, etc., can solve problems such as unfavorable high-frequency signal transmission, high-frequency signal attenuation, etc.

Pending Publication Date: 2021-05-04
深圳明阳电路科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the increase in the roughness of the copper surface will cause a large amount of attenuation in the transmission process of high-frequency signals, which is not conducive to the transmission of high-frequency signals

Method used

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  • Surface pretreatment method of metal material and production process of PCB
  • Surface pretreatment method of metal material and production process of PCB
  • Surface pretreatment method of metal material and production process of PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] This embodiment provides a method for surface pretreatment of a PCB substrate, the method comprising the following steps:

[0035] S1: Into the board, select the PCB board with copper core board in the inner layer and copper surface after the outer board is electrically or etched, and put it into the pretreatment production line horizontally, and the transmission speed is controlled at 1.5-2.0m / min.

[0036] S2: pickling, pickling with dilute sulfuric acid concentration of 3-6% pickling solution, the control temperature during pickling is 37-43°C, and the control pressure is 0.8-1.8kg / cm 2 .

[0037] S3: One-time washing, using three-stage overflow washing, the volume of each overflow washing tank is 100L, and the washing pressure is controlled at 0.8-1.8kg / cm 2 .

[0038] S4: Bonding agent treatment, under the pH range of 5.5-6.5, the temperature is controlled at 25-28° C., and a bonding agent solution with a concentration of 0.3-0.6 wt% is used to contact the copper...

Embodiment 2

[0044] The present embodiment provides a kind of production technology of PCB board, comprises the following steps:

[0045] Step 1: Use the surface pretreatment method in Example 1 to perform surface pretreatment on the PCB substrate.

[0046]Step 2: use an ink coating wheel to coat a photosensitive ink layer on the surface of the pretreated PCB substrate, and perform baking and drying treatment on the photosensitive ink layer.

[0047] Step 3: Expose the dried PCB substrate to film exposure.

[0048] Step 4: Put the PCB substrate in a developing machine for developing treatment to develop redundant circuits.

[0049] Step 5: After manual visual inspection, place the PCB substrate in an etching machine to etch to remove redundant lines, and finally remove the photosensitive ink layer on the surface, clean and dry.

[0050] Wherein, in the production process of the PCB board, the line types on it may be straight lines, oblique lines, corner lines, arcs and other line types. ...

Embodiment 3

[0052] Comparative Experiment

[0053] The bonding agent solutions with concentrations of 0.1wt%, 0.3wt%, 0.6wt%, and 0.9wt% were used to produce PCB boards by the method in Example 2, and the line width / spacing was set to 70 / 70 μm. Compare the performance of the produced PCB boards, including the following test contents:

[0054] 1. Throwing film inspection: visually inspect the board surface after development, and if there is a flinging film (poor bonding force), it is judged as unqualified;

[0055] 2. AOI scanning: Statistical AOI (automatic optical inspection) scanning defects, the more defect points, the worse the bonding force;

[0056] 3. Line width measurement: After etching, take a slice to measure whether the line width is within the required tolerance range.

[0057] The film throwing test results are shown in Table 1 and Figure 1~4 , Figure 1 ~ Figure 4 It is the picture of the flung film of the product obtained by pretreating the copper surface when the conc...

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Abstract

The invention discloses a surface pretreatment method of a metal material and a production process of a PCB. The surface pretreatment method comprises the following step: enabling 0.3-0.6 wt% of a solution of a bonding agent to be in contact with a metal material. As the bonding agent is in contact with the surface of the metal material, a functional group in a molecule of the bonding agent is tightly combined with metal atoms in the metal material in a coordinate bond manner, so a layer of uniform monomolecular film is formed on the surface; and the other functional group in the molecule of the bonding agent molecule is exposed on the surface and can undergo a polymerization reaction with a resin monomer / polymer, so the resin is firmly adhered to the surface of the metal material, and higher bonding force is obtained. In addition, when the concentration of the bonding agent solution is too low, a formed monomolecular film is not uniform, poor in binding force and easy to fall off; and if the concentration of the bonding agent solution is too high, a plurality of bonding agent films can be formed, and the films formed firstly shield the films formed later, so a part of the films cannot be combined with the metal material, and the binding force is reduced.

Description

technical field [0001] The application relates to the field of printed circuit boards, in particular to the surface pretreatment method of metal materials and the production process of PCB boards. Background technique [0002] Printed circuit board (PCB, Printed Circuit Board), also known as printed circuit board or printed circuit board. Copper foil is the main raw material of printed circuit boards, and the performance of copper foil is closely related to its surface treatment. In the printed circuit board process, copper surface pretreatment runs through the entire process. With the development of 5G (fifth-generation communication) technology, high-frequency signals require low loss or even no loss during transmission, so the requirements for copper surface quality are getting higher and higher. [0003] The traditional copper surface pretreatment process is mainly divided into two categories: the first category is to use chemical methods such as ultra-roughening and e...

Claims

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Application Information

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IPC IPC(8): H05K3/38
CPCH05K3/386H05K3/382H05K2203/0759
Inventor 张可乐伦胡诗益孙俊杰张佩珂
Owner 深圳明阳电路科技股份有限公司
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