Preparation method of semi-insulating silicon carbide single crystal wafer
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- SHANXI SEMICORE CRYSTAL CO LTD
- Publication Date
- 2021-05-07
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of single crystal silicon production and processing, and relates to a method for preparing a semi-insulating silicon carbide single crystal wafer. Background technique
[0002] As a wide bandgap semiconductor material, silicon carbide (SiC) has excellent physical properties such as high breakdown field strength, high operating temperature, high electron saturation migration rate and high thermal conductivity. ideal material for devices. Especially in the field of radio frequency, GaN radio frequency devices prepared on semi-insulating SiC single crystal wafers can handle at least 5 times the power of devices made of GaAs materials. For RF devices, a high-resistivity ("semi-insulating") substrate is generally required for coupling connections. Once the substrate is conductive, the frequency of the RF device will cause serious problems. After calculation, the minimum resistivity value of the passive performa...