Chemical deposition metal machining line and unit carrying and transporting structure

Abstract

The invention relates to a chemical deposition metal machining line and a unit carrying and transporting structure. The chemical deposition metal machining line is used for a machining procedure of chemical deposition metal of a circuit board, can form a plurality of machined line bodies according to different process requirements, can realize continuous machining of parallel line bodies, and comprises a rack, a unit carrying and transporting structure and a transfer structure; the unit carrying and transporting structure comprises a cylinder body, a carrying chain, a first lifting mechanism and a second lifting mechanism; the transferring structure and the unit carrying and transporting structure are vertically arranged, so that cross-line transferring of continuous machining of parallel line bodies of a circuit board to be machined or transport transferring in single line body manufacturing are realized; and the circuit board to be machined is transferred to the unit carrying and transporting structure. The vertical continuous machining mode of the chemical deposition metal machining line is achieved, the machining precision and the machining quality can be effectively improved, the problem that chemical deposition metal machining is difficult to achieve on-line production of an upper procedure and a lower procedure is effectively solved, and multi-channel machining is achieved.

Description

technical field [0001] The invention relates to the field of circuit board metallization treatment, in particular to a chemical deposition metal processing line and a unit carrying and transporting structure. Background technique [0002] In the process of circuit board processing, there are many processing techniques that need to use chemical redox reaction to deposit metal, which is generally called chemical deposition metal processing. Drilling stains, glue stains, and impurities on the board surface and holes are then soaked in a cylinder filled with deposition liquid of corresponding metal ions. Through the circulation of the potion in the cylinder, the metal ions that need to be deposited on the surface of the board to be processed, The electrons are reduced to metal and attached to the copper layer on the surface of the circuit board; for example: chemical immersion copper processing, chemical immersion nickel gold processing, chemical immersion silver processing, che...

AI Technical Summary

Problems solved by technology

[0007] (1) Insufficient processing quality: due to the need to use the inserting method when processing the gantry-type wire body, the boards to be processed will block each other during the liquid medicine circulation process in the cylinder, which limits the full circulation of the liquid medicine. This limits the chemical exchange on the surface of the board. For the board to be processed with a large thickness-to-diameter ratio (board thickness: hole diameter), it is more difficult to deposit the liquid in the hole, which affects the processing quality. If it is made with a single-chip board insert, it will seriously affect production capacity

[0008] (2) It is difficult to realize automatic processing: the processing of gantry-type wire body requires the action of inserting and dismantling the frame, so the action of collecting and disassembling the board to be processed must be completed, which limits the degree of automation, and the gantry-type crane can only It can be transported within the established track, but can only be transported in a straight line, and cannot realize the operation mode of turning, transshipment, and crossing the line. 1. The continuous automatic processing of the post-process is more difficult and costly. Even if it can be realized, the long-term use of the wire body frequently causes abnormalities, and the stability of the continuous processing is insufficient.

[0009] (3) Cross-line parallel processing or cross-line selective processing cannot be realized:

[0010] In view of the large demand for production capacity and the processing requirements of relatively complex processing technology, the processing line body generally has a large installation space, so the general space saving is also one of the important factors that need to be considered for the line body. Try to install the wire bodies of different processing techniques in the same space, realize the processing method of cross-line body through the way of transfer, and even realize the combined processing of the same process, which can effectively save space, improve processing efficiency, and reduce waiting time. The handling of processed boards protects the quality of the boards, but the gantry-type line body can only be transported in a straight line on the established track, and cannot meet the processing requirements of cross-line or transfer

[0011] (4) Difficult to meet multi-channel (parallel combination of multi-line body) production and processing: Since the line body processed by chemical deposition metal has high requirements on the cleanliness of the cylinder body, the maintenance frequency is high (about 3 days / time). Therefore, the gantry The type line can only rely on increasing the number of cylinders to realize the production and processing of some cylinders and the maintenance of some cylinders at the same time, but too many cylinders need to occupy a large installation space, and it is easy to cause safety hazards. If the overall line is stopped for maintenance operations, then There is too much waste of materials, and the processing efficiency and line body utilization rate are reduced. Based on the above problem (3), the gantry line can only be transported in a straight line, and it is difficult to achieve multi-channel production and processing

[0012] At present, for the processing of copper plating, nickel plating, and gold plating of circuit boards, the processing method of vertical continuous electroplating has been realized, but because the chemical deposition metal processing is realized by oxidation-reduction reactions, the produced metal layer is more fragile and subject to processing. The impact of the line body and the external environment is greater. Different from electroplating copper, electroplating nickel, electroplating gold, etc., which need to be energized to the plate or cylinder to achieve the electroplating effect, chemical deposition metal processing has more refined requirements for each section and is more important for stability. Higher performance requirements, in order to achieve vertical continuous processing effect, it is necessary to make corresponding line body design and production according to the characteristics of chemical deposition metal processing

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