Copper-clad laminate, wiring board, and copper foil provided with resin
A technology for copper clad laminates and wiring boards, applied in the fields of copper clad laminates, wiring boards, and copper foil with resin, can solve problems such as transmission loss
Pending Publication Date: 2021-05-11
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
It is known that these transmission losses are particularly likely to occur when high-frequency signals are transmitted to the wiring provided on the wiring board
Method used
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Experimental program
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Effect test
Embodiment 1～7 and comparative example 1～4
[0210] In this example, each component used when preparing a resin composition is demonstrated.
[0211] (modified polyphenylene ether compound)
[0212] Modified PPE-1:
[0213] Modified polyphenylene ether obtained by reacting polyphenylene ether with chloromethylstyrene.
[0214] Specifically, it is a modified polyphenylene ether obtained by reacting as follows.
[0215]First, polyphenylene ether (SA90 manufactured by SABIC Innovative Plastics, with 2 terminal hydroxyl groups and a weight-average molecular weight Mw1700) was charged into a 1-liter three-necked flask equipped with a temperature regulator, a stirring device, a cooling device, and a dropping funnel. 200 g, 30 g of a 50:50 mass ratio of p-chloromethyl styrene and m-chloromethyl styrene (chloromethyl styrene manufactured by Tokyo Chemical Industry Co., Ltd.: CMS), 30 g of tetra-n-butylene as a phase transfer catalyst 1.227 g of ammonium bromide and 400 g of toluene were stirred. Then, stirring was performed ...
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Abstract
One aspect of the present invention is a copper-clad laminate comprising an insulating layer and a copper foil that is present so as to be in contact with at least one surface of the insulating layer, wherein: the insulating layer includes a cured article of a resin composition containing a modified polyphenylene ether compound, which has a carbon-carbon unsaturated double bond and in which a terminal is modified by a substituent group; the amount of elemental chromium measured by X-ray photoemission spectroscopy in an exposed surface, at which the insulating layer is exposed by etching the copper-clad laminate using a copper chloride solution, is no more than 7.5 at% with respect to the amount of all elements measured by X-ray photoemission spectroscopy; and the surface roughness of the exposed surface is no more than 2.0 mum in terms of ten-point average roughness.
Description
technical field [0001] The present invention relates to a copper clad laminate, a wiring board, and a resin-coated copper foil. Background technique [0002] In various electronic devices, along with the increase in the amount of information processing, mounting technologies such as higher integration of mounted semiconductor devices, higher wiring density, and multilayering have been rapidly developed. In addition, as wiring boards used in various electronic devices, for example, wiring boards compatible with high frequencies, such as millimeter-wave radar boards used in automotive applications, are required. [0003] When a signal is transmitted to the wiring included in the wiring board, transmission loss due to conductors forming the wiring, transmission loss due to dielectrics around the wiring, and the like occur. It is known that these transmission losses are particularly likely to occur when high-frequency signals are transmitted to the wiring included in the wiring...
Claims
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IPC IPC(8): B32B15/08H05K1/09
CPCB32B15/08H05K1/0326H05K3/022B32B15/20C08G65/485H05K1/09B32B2311/12B32B2371/00B32B2457/08G01N23/2273H05K1/056H05K3/002H05K2201/0166H05K2201/0355
Inventor 井之上裕辉有泽达也山口峻
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD