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Preparation method of conductive polyimide film

The technology of polyimide film and polyamic acid resin is applied in the field of preparation of conductive polyimide film, and can solve the problems of weak wear resistance of conductive layer, reduced toughness of polyimide film, and high replacement frequency.

Inactive Publication Date: 2021-05-14
复尔德新材料科技(山东)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to cater to the rapid development of industries such as navigation, spacecraft, rocket missiles, atomic energy, and electronic and electrical industries, the existing polyimide film has greatly improved its electrical conductivity and mechanical strength. Strong wear resistance, but the conductive layer is coated on the surface of the polyimide film, and the wear resistance of the conductive layer is weak, which will cause the polyimide film to be replaced frequently during use; at the same time, the existing Although the conductive properties of the polyimide film are improved by uniformly mixing the conductive materials and then drying, the toughness of the polyimide film will be greatly reduced in terms of wear resistance due to the mixing of conductive materials.

Method used

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  • Preparation method of conductive polyimide film

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Effect test

Embodiment 1

[0040] A kind of conductive polyimide film, this conductive polyimide film is made of the raw material of following mass fraction:

[0041] 1g of pyromellitic dianhydride, 1g of silane coupling agent, 5g of polymerized polyamic acid resin, 2.5g of ingredient A, 5g of diaminodiphenyl ether, 3g of dimethylacetamide solvent, 17g of conductive ingredient, and 1.9g of ingredient B.

[0042] Wherein, the ingredient A includes the following raw material components: 1 g of styrene, 1 g of polybutadiene, and 0.5 g of hydrogen.

[0043] Wherein, the conductive ingredients include the following raw material components: 2 g of nano conductive metal powder, 10 g of graphene, and 5 g of conductive mica powder.

[0044] Wherein, the ingredient B includes the following raw material components: ethylene 1g, octene 0.5g, polyester 0.2g, polyurethane elastic fiber 0.2g.

[0045] The preparation for conductive polyimide film comprises the following steps:

[0046] S101, according to the above m...

Embodiment 2

[0055]A kind of conductive polyimide film, this conductive polyimide film is made of the raw material of following mass fraction:

[0056] 3g of pyromellitic dianhydride, 2g of silane coupling agent, 7g of polymerized polyamic acid resin, 4.25g of ingredient A, 8.5g of diaminodiphenyl ether, 3.5g of dimethylacetamide solvent, 26.5g of conductive ingredient, and ingredient B2 .95g.

[0057] Wherein, the ingredient A includes the following raw material components: styrene 1.5g, polybutadiene 2g, hydrogen 0.75g.

[0058] Wherein, the conductive ingredients include the following raw material components: 4.5g of nano-conductive metal powder, 12.5g of graphene, and 9.5g of conductive mica powder.

[0059] Wherein, the ingredient B includes the following raw material components: ethylene 1.5g, octene 1.75g, polyester 0.3g, polyurethane elastic fiber 0.4g.

[0060] The preparation of this conductive polyimide film comprises the following steps:

[0061] S101, according to the above...

Embodiment 3

[0070] A kind of conductive polyimide film, this conductive polyimide film is made of the raw material of following mass fraction:

[0071] 5g of pyromellitic dianhydride, 3g of silane coupling agent, 9g of polymerized polyamic acid resin, 6g of ingredient A, 12g of diaminodiphenyl ether, 4g of dimethylacetamide solvent, 36g of conductive ingredient, and 4g of ingredient B.

[0072] Wherein, the ingredient A includes the following raw material components: 2 g of styrene, 3 g of polybutadiene, and 1 g of hydrogen.

[0073] Wherein, the conductive ingredients include the following raw material components: 7g of nano-conductive metal powder, 15g of graphene, and 14g of conductive mica powder.

[0074] Wherein, the ingredient B includes the following raw material components: ethylene 2g, octene 1g, polyester 0.4g, polyurethane elastic fiber 0.6g.

[0075] The preparation of this conductive polyimide film comprises the following steps:

[0076] S101, according to the above mass p...

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Abstract

The invention discloses a preparation method of a conductive polyimide film. The conductive polyimide film is prepared from the following raw materials in parts by mass: 1-5 parts of pyromellitic dianhydride, 1-3 parts of a silane coupling agent, 5-9 parts of polymerized polyamide acid resin, 2.5-6 parts of an ingredient A, 5-12 parts of diaminodiphenyl ether, 3-4 parts of a dimethylacetamide solvent, 17-36 parts of a conductive ingredient and 1.9-4 parts of an ingredient B; the condition that the replacement frequency is relatively high when the polyimide film is used is avoided; and the toughness of the polyimide film can be greatly reduced due to the mixing of the conductive materials on the aspect of wear resistance.

Description

technical field [0001] The invention relates to the field of conductive polyimide films, in particular to a preparation method of conductive polyimide films. Background technique [0002] Polyimide is chemically stable. Polyimide prevents burning without the addition of flame retardants. General polyimides are resistant to chemical solvents such as hydrocarbons, esters, ethers, alcohols and chlorofluorocarbons. They are also resistant to mild acids but are not recommended for use in stronger alkalis and mineral acids. [0003] In order to cater to the rapid development of industries such as navigation, spacecraft, rocket missiles, atomic energy, and electronic and electrical industries, the existing polyimide film has greatly improved its electrical conductivity and mechanical strength. Strong wear resistance, but the conductive layer is coated on the surface of the polyimide film, and the wear resistance of the conductive layer is weak, which will cause the polyimide fil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08L75/04C08L67/02C08L47/00C08K3/08C08K3/04C08K3/34C08K13/02
CPCC08J5/18C08J2379/08C08J2447/00C08J2467/02C08J2475/04C08J2479/08C08K3/08C08K3/34C08K13/02C08K2201/001C08K2201/011C08K3/042
Inventor 鲍欣
Owner 复尔德新材料科技(山东)有限公司