Automatic chip fixing piece production process

Abstract

The invention discloses an automatic chip fixing piece production process, and relates to the technical field of chip processing. The production process comprises the following steps: 1, automatically conveying an aluminum foil to a paint spraying station; 2, automatically spraying partition paint on the front and back surfaces of the aluminum foil; 3, rapidly curing the partition paint on the aluminum foil; 4, cutting the aluminum foil after the partition paint is cured into a required size; 5, moving the cut aluminum foil to a welding table; 6, moving a fixing piece to the welding table; 7, welding the aluminum foil and the fixing piece to obtain a required chip fixing piece; and 8, automatically discharging and collecting the chip fixing pieces. The process is ingenious in design, smooth in procedure connection and high in automation degree, automatic production of the chip fixing pieces is achieved, one person can take charge of one machine, labor is saved, the yield is high, the production efficiency is greatly improved, and remarkable economic value is achieved.

Description

technical field [0001] The invention relates to the technical field of chip processing, in particular to an automatic production process of a chip fixing sheet. Background technique [0002] The fixing sheet for installing the semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and it is also a bridge to communicate the internal world of the chip and the external circuit - the contacts on the chip are connected to the packaging shell with wires These pins are connected to other devices through wires on the printed board. Therefore, packaging plays an important role for both CPUs and other LSI integrated circuits. [0003] High-power electronic components, automotive electrical appliances, such as automotive igniters, power management devices for new energy vehicles, etc., industrial electrical appliances such as PLC power supplies, servo controllers, frequency converters, voltage...

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides an automatic production process of a chip mount to solve the problem that the traditional assembly of a chip mount requires multiple people and multiple processes to cooperate with each other, which cannot be automated, and the work efficiency is low, and manual operations in some processes are prone to errors, resulting in a large number of raw material waste

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