Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Micro-nano composite silver paste, preparation method thereof and packaging method of airtight device

A micro-nano silver and micro-nano technology, applied in nanotechnology, electrical components, nanotechnology, etc., can solve the problems of high price, airtightness failure, and easy initiation of cracks, etc., to achieve improved density, stable performance, and sealing effect Good results

Pending Publication Date: 2021-06-11
深圳市先进连接科技有限公司
View PDF8 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially in deep well detection, new energy vehicles, military radar and other fields, devices are faced with complex service environments such as high temperature and high frequency vibration. Traditional tin-based solders, such as Au 80 Sn is not only expensive, but under the impact of high and low temperature, the internal IMC (intermetallic compound interfacial alloy co-compound) layer is easy to initiate cracks and cause air-tightness failure

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0051] The present invention further proposes a method of preparing a micro-nano-composite silver paste as described above, comprising the steps of:

[0052] S100, mix the micron silver particles and nanoscale silver particles uniform, micro-nano-silver;

[0053] In this step, the micrometer silver particles and nanoscale silver particles can be prepared, and can also be prepared from the market, and when prepared, the temperature, ratio, stirring, etc. during the preparation process can be produced. Micrometer silver particles and nano silver particles are obtained separately.

[0054] Specifically, the preparation of micron silver particles and nanoscale silver particles includes:

[0055] After the silver nitrate was reduced to silver with a reducing agent, the micrometer silver particles were obtained.

[0056] After the silver nitrate was reduced with a reducing agent, the nano-ray silver particles were obtained.

[0057] The process of preparing silver by chemical reducing m...

Embodiment 1

[0074] formula:

[0075] The mass ratio of micro-nano silver, micron silver particles and nano silver particles is 4: 1, micrometer silver particle size 10 μm, nano-stage silver particle size 800 nm, micro-nano-composite silver paste, micro-nano silver mass fraction is 90%;

[0076] The organic support, α-pine alcohol 82%, ethylcellulose 5%, ethyl acetate 8%, and the defoaming agent GP330 content is 5%.

[0077] Preparation:

[0078] 1) The chemical reduction method is used, which is a reducing agent with ethylene glycol and ascorbic acid, and the micrometer silver particles and nanoscale silver particles are prepared. After the completion of the completion, centrifugation, cleaning, drying, wherein the micrometers silver particles are cleaned with acetone. 2 times, alcohol cleaning 3 times; nano-star silver particles were cleaned once with acetone, and the deionized water was washed twice, and the micron silver particles and nano-star silver particles were obtained, and the micro...

Embodiment 2

[0082] formula:

[0083] The mass ratio of micro-nano silver, micrometer silver particles and nano silver particles is 4: 1, micrometer silver particle size 1 μm, nano-silver particle size 10 nm, micro-nano-composite silver paste, micro-nano silver mass fraction is 75%;

[0084] The organic support, α-pine alcohol 82%, ethylcellulose 5%, ethyl acetate 8%, and the defoaming agent GP330 content is 5%.

[0085] Preparation:

[0086] 1) The chemical reduction method is used, respectively, sodium sulfite and propylene glycol are reducing agent, and the micrometer silver particles and nano silver particles are prepared, and after the completion of the completion, centrifugation, cleaning, drying, wherein the micron-level silver particles are cleaned with acetone. 2 Times, alcohol cleaning 3 times; nano-stage silver particles were washed once with acetone, and the deionized water was cleaned twice, and the micron silver particles and nano-ray silver particles were obtained, and the micro...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a micro-nano composite silver paste, a preparation method thereof and a packaging method of an airtight device, and relates to the technical field of electronic device packaging. The micro-nano composite silver paste comprises micro-nano silver and an organic carrier, wherein the micro-nano silver comprises micron-scale silver particles and nano-scale silver particles, and the organic carrier comprises an organic solvent, a thickening agent, a dispersing agent and a defoaming agent. By mixing the micron-scale silver particles and the nano-scale silver particles and assisting with the organic carrier, the original stacking density of the micro-nano composite silver paste is improved, violent shrinkage of the volume of the silver paste in the sintering process is inhibited, and the density of a sintered structure of the micro-nano composite silver paste is improved. Meanwhile, the micro-nano composite silver paste has good hot and cold impact reliability, so that the micro-nano composite silver paste is not easy to generate cracks to cause airtightness failure under high and low temperature impact, and is good in sealing effect and stable in performance.

Description

Technical field [0001] The present invention relates to the field of electronic device package, and more particularly to a micro-nano-composite silver paste and a packaging method thereof and a gas-tight device. Background technique [0002] The package of integrated circuits is an important part of the manufacturing of integrated circuits, with the same important position with chip design, manufacturing and testing. In particular, military equipment and communication equipment electronic devices are required for their working environment, requires powerful anti-irradiation capabilities, anti-vibration capacity, survival capacity of evil environment, and changes in incompetent climate adaptability. [0003] With the update of microelectronics industry, the functional devices in electronic products continue to develop in the direction of miniaturization and high integration. This brings a higher package density and energy density, and a high-temperature service requires high tempe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F9/24H01L21/50B82Y30/00B82Y40/00
CPCB22F9/24H01L21/50B82Y30/00B82Y40/00B22F1/05B22F1/054B22F1/10
Inventor 李明雨杨婉春靳清胡博杨帆
Owner 深圳市先进连接科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com