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Fluorescent polyamide hot melt adhesive and preparation method thereof

A polyamide hot-melt adhesive and fluorescent technology, used in adhesives and other directions, can solve problems such as damage and surface contamination of adhesives, and achieve the effects of wide range of use scenarios, good adhesion performance, and efficient and convenient wiping and removal.

Active Publication Date: 2021-06-11
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the technical problem that general hot-melt adhesives are difficult to peel off and remove, resulting in contamination and damage to the surface of the adhesive, the purpose of the present invention is to provide a fluorescent polyamide hot-melt adhesive and its preparation method. The product obtained in the present invention has strong Adhesive properties, transparent, easy-to-remove characteristics and fluorescent properties

Method used

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  • Fluorescent polyamide hot melt adhesive and preparation method thereof
  • Fluorescent polyamide hot melt adhesive and preparation method thereof
  • Fluorescent polyamide hot melt adhesive and preparation method thereof

Examples

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Embodiment 1

[0026] This embodiment is a fluorescent polyamide hot-melt adhesive, the raw material components of which are: primary diamine and bisacrylamide, wherein the molar ratio of primary diamine to bisacrylamide is 1:1.125.

[0027] The preparation method of this embodiment:

[0028] Dissolve 12.33g of N,N'-methylenebisacrylamide in 60mL of methanol and 30mL of water and add 12.98g of 1.8-octanediamine, wherein N,N'-methylenebisacrylamide and 1.8-octanediamine The molar ratio is 1:1.125. The mixed solution was stirred at 30° C. for 24 h, and then the reacted solution was precipitated in acetone to obtain a white solid, which was a hyperbranched polyamide. It is dissolved in methanol to ensure that the mass concentration of the dissolved hyperbranched polyamide solution is 15%, and cast at room temperature to form a film.

[0029] The resulting thin film fluoresces blue under 365nm ultraviolet light. The transparent film is sandwiched between two aluminum plates, and the aluminum ...

Embodiment 2

[0033] This embodiment is a fluorescent polyamide hot-melt adhesive, the raw material components of which are: primary diamine and bisacrylamide, wherein the molar ratio of primary diamine to bisacrylamide is 1:1.

[0034] The preparation method of this embodiment:

[0035] After dissolving 12.33g of N,N'-methylenebisacrylamide in 60mL of methanol and 30mL of water, 7.05g of 1,4-butanediamine was added. The molar ratio of N,N'-methylenebisacrylamide to 1,4-butanediamine is 1:1. The mixed solution was stirred at 30° C. for 20 h, and then the reacted solution was precipitated in acetone to obtain a light yellow solid, which was a hyperbranched polyamide. It is dissolved in methanol to ensure that the mass concentration of the dissolved hyperbranched polyamide solution is 20%, and cast at room temperature to form a film.

[0036] The resulting film fluoresced blue under 365 nm ultraviolet light. The transparent film is sandwiched between two aluminum plates, and the aluminum p...

Embodiment 3

[0038] A fluorescent polyamide hot-melt adhesive, the raw material components of which are: dibasic primary amine and bisacrylamide, wherein the molar ratio of dibasic primary amine to bisacrylamide is 1:1.5.

[0039]After dissolving 13.46g of N,N'-vinylbisacrylamide in 70mL of methanol and 35mL of water, 44.1g of 4,7,10-trioxy-1,13-tridecanediamine was added. The molar ratio of N,N'-vinylbisacrylamide to 4,7,10-trioxy-1,13-tridecanediamine is 1:1.5. Stir the mixed solution at 30°C for 30 hours, then precipitate the reacted solution in acetone to obtain a white solid, which is a hyperbranched polyamide, which is dissolved in methanol to ensure hyperbranched polyamide after dissolution The mass concentration of the polyamide solution is 15%, and the film is cast at room temperature.

[0040] The resulting film fluoresced blue under 365 nm ultraviolet light. The transparent film is sandwiched between two aluminum plates, and the aluminum plates are heated at 160°C for 60 minut...

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Abstract

The invention relates to a fluorescent polyamide hot melt adhesive and a preparation method thereof. The fluorescent polyamide hot melt adhesive mainly comprises the following two compounds: a binary primary amine compound and a bisacrylamide compound; the preparation method comprises the specific synthesis steps: dissolving binary primary amine and bisacrylamide in a mixed solvent of methanol and water, stirring at room temperature for 20 h-30 h, and ending the reaction; precipitating the polymer solution obtained by the reaction in acetone to obtain polyamide; and re-dissolving polyamide with methanol, and casting to form a film, so as to obtain the polyamide hot melt adhesive; and clamping the prepared hot melt adhesive film between the surfaces of materials needing to be bonded, curing for 15 min to 120 min at the temperature of 140 DEG C to 160 DEG C, and finishing bonding after cooling. The fluorescent property of the polyamide hot melt adhesive film can be used for accurately positioning a bonded part, meanwhile, the hot melt adhesive after bonding failure is efficiently wiped and removed by adopting ethanol, and the obtained product has the characteristics of relatively strong bonding property, transparency and easiness in removal and fluorescent property.

Description

technical field [0001] The invention relates to the technical field of polymer material synthesis, in particular to a fluorescent polyamide hot melt adhesive and a preparation method thereof. Background technique [0002] Hot melt adhesive is a kind of plastic adhesive. Within a certain temperature range, its physical state changes with temperature, but its chemical properties remain unchanged. It is an environmentally friendly chemical product. Commonly used in hot melt adhesives are mainly epoxy resin hot melt adhesives and polyurethane hot melt adhesives. Epoxy hot melt adhesives are composed of epoxy group-containing polymers, amino-containing curing agents, and solvents. After cross-linking and curing, they have excellent bonding strength and mechanical strength. It is difficult to dissolve in common solvents, so it is difficult to peel off and remove, and it will cause pollution and damage to the adhesive. Polyurethane hot melt adhesives are suitable for various bond...

Claims

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Application Information

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IPC IPC(8): C09J177/06C08G69/26C08G69/28
CPCC09J177/06C08G69/26C08G69/28C08G2170/20
Inventor 张彦峰张思佳
Owner XI AN JIAOTONG UNIV