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A kind of ultra-thin copper foil and preparation method thereof

An ultra-thin copper foil and metal foil technology, applied in structural parts, electrical components, battery electrodes, etc., can solve the problems of poor tensile strength and elongation, and the thickness of ultra-thin copper foil cannot meet the requirements, and achieve excellent performance, The preparation method is stable and controllable, and the effect of good peeling potential

Active Publication Date: 2021-12-28
GUANGDONG FINE YUAN SCI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The thickness of the existing ultra-thin copper foil cannot meet the requirements, and the tensile strength and elongation are poor. Although the research and development team has trial-produced ultra-thin copper foil products that are less than 6 μm and can reach a minimum of 4 μm, the surface roughness of the copper foil Ra is less than 0.35μm, the tensile performance can reach up to 408MPa, and the elongation can reach up to 9.5%, which has achieved a breakthrough in various performance aspects of ultra-thin copper foil, but due to the needs of thinner, lighter weight, cost reduction and efficiency increase, Further lightweighting of copper foil is an important direction for the development of the copper foil industry at present. How to make the thickness of ultra-thin copper foil thinner while achieving greater performance breakthroughs to meet the needs of diversified production is the key to realizing the development of ultra-thin copper foil key and difficult issues

Method used

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  • A kind of ultra-thin copper foil and preparation method thereof
  • A kind of ultra-thin copper foil and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] (1) Adsorb the organic layer on the surface of the copper foil carrier

[0034] Take copper foil with a thickness of 35 μm as the deposition carrier, pickle the carrier to remove oxides and impurities on the surface of the carrier, and then immerse the cleaned carrier copper foil in cyclohexyl hexaphosphoric acid and 2-thiouracil In the mixed aqueous solution (the concentration of cyclohexanehexaphosphoric acid is 1g / L, and the concentration of 2-thiouracil is 1g / L), soak at room temperature for 70s, take it out and wash it with deionized water to obtain a carrier for adsorbing the organic layer;

[0035] (2) Deposit an alloy layer on the organic layer adsorbed by the carrier

[0036] Preparation of tungsten-nickel alloy electrolyte: the concentration of nickel sulfate in the electrolyte is 20g / L, the concentration of sodium tungstate is 35g / L, the addition amount of rare earth element Pr is 0.05g / L, and the addition amount of Nd is 0.03g / L. Electrolyte pH4.5;

[0037...

Embodiment 2

[0043] (1) Adsorb the organic layer on the surface of the copper foil carrier

[0044] Take copper foil with a thickness of 35 μm as the deposition carrier, pickle the carrier to remove oxides and impurities on the surface of the carrier, and then immerse the cleaned carrier copper foil in cyclohexyl hexaphosphoric acid and 2-thiouracil In the mixed aqueous solution (the concentration of cyclohexanehexaphosphoric acid is 5g / L, and the concentration of 2-thiouracil is 5g / L), soak at room temperature for 75s, take it out and rinse it with deionized water to obtain a carrier for adsorbing the organic layer;

[0045] (2) Deposit an alloy layer on the organic layer adsorbed by the carrier

[0046] Preparation of tungsten-nickel alloy electrolyte: the concentration of nickel sulfate in the electrolyte is 22g / L, the concentration of sodium tungstate is 30g / L, the addition amount of rare earth element Pr is 0.06g / L, and the addition amount of Nd is 0.04g / L. Electrolyte pH5.0;

[004...

Embodiment 3

[0053] (1) Adsorb the organic layer on the surface of the copper foil carrier

[0054] Take copper foil with a thickness of 35 μm as the deposition carrier, pickle the carrier to remove oxides and impurities on the surface of the carrier, and then immerse the cleaned carrier copper foil in cyclohexyl hexaphosphoric acid and 2-thiouracil In the mixed aqueous solution (the concentration of cyclohexanehexaphosphoric acid is 10g / L, and the concentration of 2-thiouracil is 6g / L), soak at room temperature for 73s, take it out and rinse it with deionized water to obtain a carrier for adsorbing the organic layer;

[0055] (2) Deposit an alloy layer on the organic layer adsorbed by the carrier

[0056] Preparation of tungsten-nickel alloy electrolyte: the concentration of nickel sulfate in the electrolyte is 23g / L, the concentration of sodium tungstate is 25g / L, the addition amount of rare earth element Pr is 0.06g / L, and the addition amount of Nd is 0.04g / L. Electrolyte pH5.0;

[00...

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Abstract

The invention discloses an ultra-thin copper foil and a preparation method thereof, belonging to the technical field of ultra-thin copper foil preparation. The present invention uses cyclohexyl hexaphosphoric acid and 2-thiouracil as an organic layer to adsorb on a metal foil carrier, then deposits a tungsten-nickel alloy containing rare earth elements Pr and Nd on the organic layer, and then deposits copper three times To prepare ultra-thin copper foil, the copper deposition electrolyte of the present invention contains a composite additive of sodium lignosulfonate and chitosan oligosaccharide, and the copper deposition electrolyte realizes ultra-thin copper foil under the action of rare earth elements Pr and Nd in the alloy layer. Lightweight uniform deposition enables ultra-thin copper foil to break through the limit of 4μm to achieve ultra-light weight of 3.5μm, and the tensile performance is as high as 510MPa, and the elongation rate can reach up to 10%, endowing lightweight ultra-thin copper foil with excellent performance.

Description

technical field [0001] The invention relates to the technical field of ultra-thin copper foil preparation, in particular to an ultra-thin copper foil and a preparation method thereof. Background technique [0002] The production technology of ultra-thin copper foil belongs to the manufacturing technology of refinement, high degree of specialization, and high control standards of each link. With the development of high integration and miniaturization of electronic products, printed boards are becoming multi-layered and highly integrated. In the direction of development, the line width and spacing of printed circuit patterns are also becoming more and more miniaturized. Therefore, higher requirements are placed on the reliability of circuit boards. For example, the thinned copper foil required to be used in fine lines has higher peelability and can effectively reduce or avoid the "side etching" phenomenon when etching lines, so the strippable ultra-thin copper foil will be wid...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D7/06C25D5/34C25D3/56C25D3/38C25D5/10H01M4/66
CPCC25D7/0614C25D5/34C25D3/56C25D3/38C25D5/10H01M4/661Y02E60/10C25D3/562
Inventor 叶铭廖平元刘少华谢基贤李传铮古明煌
Owner GUANGDONG FINE YUAN SCI TECH CO LTD
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