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Anionic photocuring thiol-epoxy adhesive

An epoxy adhesive and light-curing technology, which is applied in the field of light-curing, can solve the problem of low quantum yield of photobase generator, and achieve the effects of improving reactivity, high coating performance, and high hardness of the adhesive layer

Active Publication Date: 2021-06-22
JIANGNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the low photobase generator quantum yield, the coating still needs a long time of light and post-baking

Method used

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  • Anionic photocuring thiol-epoxy adhesive
  • Anionic photocuring thiol-epoxy adhesive
  • Anionic photocuring thiol-epoxy adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1: The following materials are mixed in proportion to form an anionic photocurable thiol-epoxy adhesive.

[0026]

[0027] Among them, hydantoin epoxy resin MHR070 was purchased from Guangzhou Taiji New Material Co., Ltd., with an epoxy value of 0.7 and in a liquid state.

[0028] Among them, tetrakis (3-mercaptobutyric acid) pentaerythritol ester is liquid.

[0029] Among them, 1,3,5-tris(3-mercaptopropyl)isocyanurate is solid.

[0030] The molar amounts of mercapto groups of pentaerythritol tetrakis(3-mercaptobutyrate) and 1,3,5-tris(3-mercaptopropyl)isocyanurate were 0.023 mol and 0.012 mol, respectively.

[0031] Hydantoin epoxy resin MHR070 epoxy molar weight is 0.035mol.

Embodiment 2

[0032] Embodiment 2: adopt the component ratio of embodiment 1, stir and dissolve photobase generator and photosensitizer and resin, be coated on the steel plate, steel plate is cured by ultraviolet light, in crawler type UV curing machine (Fusion company, F300UV ) under light for 9 times, cured and formed, and then cured after being placed at 80°C for 2 hours.

Embodiment 3

[0033] Embodiment 3: The following materials were mixed in proportion to form an anionic photocurable thiol-epoxy adhesive.

[0034] Element specific substance mass percentage Hein Epoxy MHR154B 45% Thiol 1 Tetrakis(3-mercaptobutyrate)pentaerythritol ester 35% Thiol 2 2,4,6-Trimercapto-s-triazine 10% Active diluent Trimethylolpropane triglycidyl ether 5% photobase generator TBD·HBPh 4

3% Photosensitizer ITX 2%

[0035] Among them, hydantoin epoxy resin MHR154B was purchased from Guangzhou Taiji New Material Co., Ltd., with an epoxy value of 0.5 and in a liquid state.

[0036] Among them, tetrakis (3-mercaptobutyric acid) pentaerythritol ester is liquid.

[0037] Among them, 2,4,6-trimercapto-s-triazine is in solid state.

[0038] The molar amounts of pentaerythritol tetrakis(3-mercaptobutyrate) and 2,4,6-trimercapto-s-triazine mercapto were 0.0188 mol and 0.0062 mol, respectively.

[0039] The epoxy molar w...

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Abstract

The invention relates to an anionic photocuring thiol-epoxy adhesive, and belongs to the field of photocuring. The anionic photocuring thiol-epoxy high-hardness adhesive comprises the components in parts by weight: 40-60 parts of hydantoin epoxy resin, 20-45 parts of thiol-1, 5-30 parts of thiol-2, 10-30 parts of a reactive diluent and 1-5 parts of a photobase generator, wherein the thiol-1 and the thiol-2 are different substances, the thiol-1 is liquid resin, and the thiol-2 is of a heterocyclic ring or benzene ring structure. The adhesive is good in bonding performance, high in reaction activity, long in working life, high in adhesive layer hardness, good in abrasion resistance and resistant to high temperature.

Description

technical field [0001] The invention relates to an anionic light-cured mercaptan-epoxy adhesive, which belongs to the field of light-cured. Background technique [0002] Light-curing technology has the advantages of green, energy saving, and environmental protection, and can be applied to coatings, adhesives, and dental repair materials. Anionic photocuring uses a photobase generator as an initiator, and the curing system has a small shrinkage rate, anaerobic polymerization inhibition, and low corrosion to the substrate. Due to the low quantum yield of photobase generators, the coating still needs to be illuminated for a long time and post-baked. [0003] Epoxy resin has outstanding bonding performance and is widely used in the field of electronic packaging. Using highly active hydantoin epoxy resin to react with mercaptans can increase the curing speed of the photoalkali system, and the formula has a longer pot life; Rigid structure mercaptan compound can increase the har...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C08G59/66
CPCC09J163/00C08G59/66
Inventor 刘仁皮玉红
Owner JIANGNAN UNIV