Porous ultrathin grinding wheel for chip cutting and preparation method thereof

A porous and ultra-thin technology, used in manufacturing tools, metal processing equipment, grinding/polishing equipment, etc., can solve the problem that the cutting quality cannot be further improved, the thinning of ultra-thin grinding wheels is difficult to carry out, and the self-sharpening of ultra-thin grinding wheels is reduced. ability and other issues, to achieve the effect of improving self-sharpening ability, improving cutting quality, and improving abrasive holding force

Active Publication Date: 2021-06-25
HUAQIAO UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the mechanically embedded abrasive must ensure sufficient coating thickness, it is difficult to continue thinning the ultra-thin grinding wheel; on the other hand, Cu-based binders often need to improve the connection of mech

Method used

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  • Porous ultrathin grinding wheel for chip cutting and preparation method thereof
  • Porous ultrathin grinding wheel for chip cutting and preparation method thereof

Examples

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Effect test

Embodiment 1

[0023] A method for preparing a porous ultra-thin grinding wheel for chip scribing, the ultra-thin grinding wheel is composed of superabrasives and a metal-based matrix, the ultrathin grinding wheel has a porous structure; the superabrasive is diamond, the The ultra-hard abrasive accounts for 50% of the volume content of the ultra-thin grinding wheel, and the abrasive grain size is 3-5 μm; the metal-based matrix is ​​a Ti-Al-based alloy, and the mass content of metal Al in the Ti-Al-based alloy is The ratio is 10%, the metal Ti content is the balance, and the powder particle size of the metal Al and metal Ti is 3-5 μm;

[0024] Its preparation method concrete steps are as follows:

[0025] (1) Material preparation: first accurately weigh Ti powder, Al powder and diamond powder, put them into a three-dimensional vortex mixer for 4 hours of material mixing, and then pass through a 200-mesh screen; then add phenolic resin glue according to 12% mass ratio , stir and mix until the...

Embodiment 2

[0032] A method for preparing a porous ultra-thin grinding wheel tool for chip scribing, the ultra-thin grinding wheel is composed of a superhard abrasive and a metal-based matrix, the ultra-thin grinding wheel has a porous structure; the superhard abrasive is diamond, and the The volume ratio of the superabrasive to the ultra-thin grinding wheel is 25%, and the particle size of the abrasive is 9-12 μm; the metal-based matrix is ​​a Ti-Al-based alloy, and the mass of metal Al in the Ti-Al-based alloy is The content ratio is 15%, the metal Ti content is the balance, and the powder particle size of the metal Al and metal Ti is 4-6 μm;

[0033] Its preparation method concrete steps are as follows:

[0034] (1) Material preparation: first accurately weigh Ti powder, Al powder and diamond micropowder, put them into a three-dimensional vortex mixer for 4 hours of material mixing, and then pass through a 100-mesh screen; then add phenolic resin glue according to 10% mass ratio , sti...

Embodiment 3

[0041] A method for preparing a porous ultra-thin grinding wheel tool for chip scribing, the ultra-thin grinding wheel is composed of superabrasives and a metal-based matrix, the ultrathin grinding wheel has a porous structure; the superabrasives are cubic nitride Boron, the volume content ratio of the ultra-hard abrasive to the ultra-thin grinding wheel is 25%, and the abrasive particle size is 19-21 μm; the metal-based matrix is ​​a Ti-Al-based alloy, and the Ti-Al-based alloy The mass content ratio of metal Al is 20%, the content of metal Ti is the balance, and the powder particle size of the metal Al and metal Ti is 8-10 μm;

[0042] Its preparation method concrete steps are as follows:

[0043] (1) Material preparation: first accurately weigh Ti powder, Al powder and cubic boron nitride micropowder, put them into a three-dimensional vortex mixer for 3 hours, and then pass through a 100-mesh sieve; then add 13% mass ratio Epoxy resin glue, stir and mix until there is no l...

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Abstract

The invention provides a porous ultrathin grinding wheel for chip cutting and a preparation method thereof. The ultrathin grinding wheel is composed of a super-hard abrasive and a metal-based matrix, the super-hard abrasive comprises diamond and cubic boron nitride, the metal-based matrix is a Ti-Al-based alloy, and a porous structure on the ultrathin grinding wheel is generated by utilizing a Kirkendall effect reaction caused by a diffusion rate difference between Ti/Al elements. The preparation method comprises the steps of carrying out material preparation, carrying out cold press molding, carrying out sintering molding and carrying out machining, wherein the sintering molding is composed of two sintering procedures of pore forming and performance adjusting, the sintering conditions of the pore forming procedure are 600-700 DEG C and 10-240 min, and the sintering conditions of the performance adjusting procedure are 750-1100 DEG C and 5-120 min. According to the porous ultrathin grinding wheel for chip cutting and the preparation method thereof, chemical bonding is achieved through mutual diffusion of Ti elements and the super-hard abrasive, so that the holding force of abrasive particles is improved, and the ultrathin grinding wheel can be further thinned; and the self-sharpening capacity of the ultrathin grinding wheel is improved by introducing the porous structure through the Kirkendall effect between the Ti/Al elements, so that the cutting quality of a chip is improved, and materials such as a pore forming agent do not need to be added, so that the production cost is reduced.

Description

【Technical field】 [0001] The invention relates to the technical field of manufacturing chip scribing grinding wheel tools, in particular to a porous ultra-thin grinding wheel for chip scribing and a preparation method thereof. 【Background technique】 [0002] The ultra-thin grinding wheel is an important tool for wafer dicing in the semiconductor industry. The quality of its dicing directly affects the yield and performance of the chip, and bears the economic cost of the previous multiple processes. With the miniaturization and increase in capacity of semiconductor chips, the cutting space between chips is getting smaller and smaller, which will greatly increase the technical requirements for the thickness and strength of ultra-thin grinding wheels. Bonding agents for ultra-thin grinding wheels are mainly divided into three categories: resin, ceramics, and metal. Metal bonding agents can avoid low strength of resin bonding agents, poor heat resistance and brittleness of ceram...

Claims

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Application Information

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IPC IPC(8): B24D18/00B24D3/10B24D3/34C22C14/00C22C26/00C22C32/00C22C1/08B22F5/00B22F3/11
CPCB24D18/0009B24D3/10B24D3/342C22C14/00C22C26/00B22F5/00B22F3/1121B22F3/1007B22F2005/001
Inventor 李勉穆德魁徐西鹏
Owner HUAQIAO UNIVERSITY
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