Sandwich aluminum-based printed circuit board laminating method

A technology for printed circuit boards and aluminum substrates, which is applied to printed circuits, printed circuit manufacturing, electrical components, etc., and can solve problems such as poor performance and stability, and high production costs of aluminum substrates

Active Publication Date: 2021-07-06
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to make up for the deficiencies of the existing technology and solve the problems of high production cost of aluminum...

Method used

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  • Sandwich aluminum-based printed circuit board laminating method
  • Sandwich aluminum-based printed circuit board laminating method
  • Sandwich aluminum-based printed circuit board laminating method

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Embodiment approach

[0039] As an embodiment of the present invention, after the aluminum substrate 1 is ultrasonically cleaned, the surface of the aluminum substrate 1 is subjected to surface treatment; during the surface treatment, the aluminum substrate 1 is burnt with a flame spray gun; the surface treatment During the process, the temperature of the flame spray gun is 665-670°C; the surface treatment time is 3-5S; when the aluminum substrate 1 is surface treated, the aluminum substrate 1 is in a nitrogen atmosphere;

[0040] During work, by burning the aluminum substrate 1 with a flame, the burrs generated on the surface of the aluminum substrate 1 and the inner wall of the through hole 4 can be melted and removed when the aluminum substrate 1 is punching the groove 5 and drilling the through hole 4, so as to avoid There are burrs on the surface of the aluminum substrate 1, which affect the performance of the laminated circuit board. At the same time, avoid the reduction of the pressure resist...

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Abstract

The invention belongs to the technical field of printed circuit boards, and particularly relates to a sandwich aluminum-based printed circuit board laminating method which comprises the following steps: S1, after an aluminum substrate is fixed on a clamp, performing drilling on the aluminum substrate to obtain a through hole; S2, on the basis of the step S1, immersing the aluminum substrate in DI water at the temperature of 50-60 DEG C for ultrasonic cleaning, after cleaning is completed and drying is conducted, attaching prepregs to the upper surface and the lower surface of the aluminum substrate respectively, and then covering the surfaces of the prepregs with a layer of copper foil; S3, on the basis of the step S3, feeding the aluminum substrate into a laminating machine, and laminating the aluminum substrate to obtain a semi-finished circuit board; S4, on the basis of the step S3, conducting drilling again at the position of the through hole in the aluminum substrate, obtaining a working hole, and conducting metallization treatment on the inner wall of the working hole. The prepared circuit board is low in production cost and good in performance and stability.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, in particular to a pressing method for sandwich aluminum-based printed circuit boards. Background technique [0002] With the development of light, thin, short, small, high-density and multi-functional electronic products, the assembly density and integration of components on printed boards are getting higher and higher, and the power consumption is increasing, which affects the heat dissipation of PCB substrates. The requirements are becoming more and more urgent. The heat dissipation of the substrate will directly affect the reliability and safety of the electronic equipment. Reduced reliability and security. Aluminum substrates have good thermal conductivity, good electromagnetic shielding performance, and light weight, and have become the first choice for metal substrates. However, most of the existing aluminum substrates are expensive to manufacture and have poor performance ...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0061H05K3/0044H05K3/0047
Inventor 曾雪芳王兰
Owner SHANGHAI UNIV
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