All-organic composite material film and preparation method and application thereof
A composite film and organic filler technology, applied in the field of all-organic composite film and its preparation, can solve the problems of high breakdown strength, high energy density mechanical properties, simple preparation process, and reduced breakdown field strength. Achieve the effects of good physical and mechanical properties, high discharge energy density and high breakdown strength
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0067] According to an embodiment of the present invention, a method of preparing the above full organic composite material is obtained by a polymer as a substrate, a solution scraping technique is prepared by a solution scraping technique, and the obtained whole organism-based dielectric composite material is prepared. The film has a lower dielectric loss, high breakdown strength, high discharge energy, good physical mechanical properties, high electrical insulation performance, simple preparation process is simple and suitable for industrial production and engineering applications. Further, the preparation of the whole organic composite film of the present invention is easy to acquire, and the preparation process is simple and easy to provide large quantities. The existing polymer-based dielectric composites with inorganic ceramics are unable to balance dielectric constant and insulation performance, and is not suitable for large-scale industrialization.
[0068] In a third aspe...
Embodiment 1
[0071] MBs of 0.0063 g of a particle size of 1-2 μm was added to 10 ml of DMF, and after stirring at 50 ° C for 30 min, the power of the MBS was solened to obtain a dispersion of MBS; 0.5 g of VDF-HFP) was added to 10 ml In DMF, it was stirred at 50 ° C for 60 min, and the p (VDF-HFP) solution was obtained; after mixing the two, the magnetic force was stirred at 50 ° C for 5 hours to obtain a mixed solution; and the film was applied to the glass plate after a solution The temperature was 12 hours at 70 ° C, and the volume fraction of MBS was 2%, and the thickness of 8 μm was obtained. Such as figure 1 As shown, the granular substance in the figure is MBS filler, from figure 1 As can be seen, there is no defects such as agglomeration and micropores between the filler and the substrate, whereby the MBS filler is uniform in the P (VDF-HFP) matrix. The dielectric constant, dielectric loss, and strong internet extension field under different frequency conditions at room temperature, an...
Embodiment 2
[0073] MBs of 0.0129 g of a particle diameter of 1-2 μm was added to 10 ml of DMF, and after 30 min at 50 ° C, it was soaked that the dispersion of MBS was allowed to obtain a dispersion of MBS; 0.5 g p (VDF-HFP) was added to 10 ml In DMF, it was stirred at 50 ° C for 60 min, and the p (VDF-HFP) solution was obtained; after mixing the two, the magnetic force was stirred at 50 ° C for 5 hours to obtain a mixed solution; and the film was applied to the glass plate after a solution The temperature was 12 hours at 70 ° C, and the volume fraction of MBs was 4%, and the thickness of 8 μm was obtained. The dielectric constant, dielectric loss, and strong internet extension field under different frequency conditions at room temperature, and the discharge energy density is as figure 2 , 3 Curve 2 in 4, 5.
PUM
| Property | Measurement | Unit |
|---|---|---|
| Particle size | aaaaa | aaaaa |
| Thickness | aaaaa | aaaaa |
| Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More