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Silicon-containing monomer, photocuring composition, packaging structure and semiconductor device

A silicon monomer, photocuring technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve the problems of water vapor transmittance angle, low light transmittance, etc., and achieve low water vapor transmission rate, high light transmittance, and high curing speed

Inactive Publication Date: 2021-07-20
JILIN OPTICAL & ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing structure for encapsulating OLEDs is generally formed by bonding the encapsulation cover plate of glass or metal material to the OLED substrate through epoxy resin. Although it can play a certain barrier role, it still has the angle of water vapor transmission rate and the Problems such as low light transmittance

Method used

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  • Silicon-containing monomer, photocuring composition, packaging structure and semiconductor device
  • Silicon-containing monomer, photocuring composition, packaging structure and semiconductor device
  • Silicon-containing monomer, photocuring composition, packaging structure and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] This embodiment provides a method for preparing a packaging structure, which includes the following steps:

[0034] S1. Weigh 20g of silicon-containing monomer 001, 75g of epoxy alkyl-containing diluent L001 and 5g of diaryliodonium salt, mix them together, stir at 50°C for 80h under vacuum, and then filter with a syringe filter, and use a particle counter to detect, when the number of particles with a particle size greater than 0.5 μm is detected to be no more than 50, the photocurable composition is obtained for use; wherein, the structural formula of the silicon-containing monomer 001 is as follows:

[0035]

[0036] The structural formula of the alkylene oxide diluent L001 is as follows:

[0037]

[0038] S2. Selecting silicon nitride as the inorganic layer material, and coating the inorganic layer material on the surface of the object to be packaged by chemical vapor deposition (Chemical Vapor Deposition, CVD) to form an inorganic layer.

[0039] S3. Spray t...

Embodiment 2

[0042] This embodiment provides a method for preparing a packaging structure, which includes the following steps:

[0043] S1. Weigh 20g of silicon-containing monomer 002, 75g of epoxy alkyl-containing diluent L002 and 5g of triarylsulfonium salt, mix them together, stir at 50°C for 80h under vacuum, and then use a syringe filter Filter, use a particle counter to detect, when the number of particles with a particle size greater than 0.5 μm is detected to be no more than 50, obtain a photocurable composition for use; wherein, the structural formula of the silicon-containing monomer 002 is as follows:

[0044]

[0045] The structural formula of the alkylene oxide diluent L002 is as follows:

[0046]

[0047] S2. Selecting silicon nitride as the inorganic layer material, and coating the inorganic layer material on the surface of the object to be packaged by chemical vapor deposition (Chemical Vapor Deposition, CVD) to form an inorganic layer.

[0048] S3. Spray the above-men...

Embodiment 3

[0051] This embodiment provides a method for preparing a packaging structure, which includes the following steps:

[0052] S1. Weigh 20g of silicon-containing monomer 003, 75g of alkylene oxide-containing diluent L003 and 5g of iron arene salt photoinitiator, mix them together, stir for 80h under vacuum at 50°C, and then filter with a syringe filter, and use a particle counter to detect, when the number of particles with a particle size greater than 0.5 μm is detected to be no more than 50, the photocurable composition is obtained for use; wherein, the structural formula of the silicon-containing monomer 003 is as follows:

[0053]

[0054] The structural formula of the alkylene oxide diluent L003 is as follows:

[0055]

[0056] S2. Selecting silicon nitride as the inorganic layer material, and coating the inorganic layer material on the surface of the object to be packaged by chemical vapor deposition (Chemical Vapor Deposition, CVD) to form an inorganic layer.

[005...

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Abstract

The invention discloses a silicon-containing monomer, a photocuring composition, a packaging structure and a semiconductor device, and belongs to the technical field of photocuring materials and thin film packaging. The structural formula of thesilicon-containing monomer is shown as the specification, whereinat least one of R1, R2, R3, R4, R5 and R6 is shown in the specification, and the rest groups are respectively and independently hydrogen, substituted or unsubstituted alkyl, substituted or unsubstituted cycloalkyl, substituted or unsubstituted hydroxyalkyl, substituted or unsubstituted aryl, substituted or unsubstituted heteroaryl, substituted or unsubstituted alkenyl,substituted or unsubstituted alkoxy group, substituted or unsubstituted lactone group, substituted or unsubstituted carboxyl group, substituted or unsubstituted glycidyl ether group and hydroxyl group. The silicon-containing monomer provided by the invention comprises a benzene ring and an epoxy group, and when the silicon-containing monomer is matched with a photocurable epoxy-alkyl-containing diluent, a formed polymer film has higher light transmittance and lower water vapor transmittance.

Description

technical field [0001] The invention relates to the technical field of photocurable materials and thin film packaging, in particular to a silicon-containing monomer, a photocurable composition, a packaging structure and a semiconductor device. Background technique [0002] Organic Light-Emitting Diodes (OLEDs) are electroluminescent semiconductor devices. [0003] One of the biggest problems of OLED at this stage is its short service life, which is prone to failure. Among them, one of the main factors affecting the lifetime of the OLED is the existence of water vapor and oxygen inside the OLED device after long-term use. Therefore, in order to increase the service life of OLEDs, improving the packaging process of OLEDs is the most direct and effective method. [0004] The existing structure for encapsulating OLEDs is generally formed by bonding the encapsulation cover plate of glass or metal material to the OLED substrate through epoxy resin. Although it can play a certain...

Claims

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Application Information

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IPC IPC(8): C07F7/08C09D183/06H01L51/52
CPCC07F7/0838C09D4/00C09D183/06C08G77/14H10K50/8426
Inventor 于哲姜晓晨秦翠英崔明朴凤昊马晓宇王辉
Owner JILIN OPTICAL & ELECTRONICS MATERIALS
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