Solvent-free environment-friendly flame-retardant adhesive film and preparation method thereof
An environmentally friendly, flame-retardant adhesive technology, which is applied in the direction of epoxy resin glue, adhesive type, adhesive, etc., can solve the problems of unapplicable, poor flammability and heat resistance of the adhesive film, and achieve the reduction of interface contact thermal resistance, Improve thermal conductivity, good interface bonding effect
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Embodiment 1
[0033] The preferred embodiment of the present invention provides a solvent-free environment-friendly flame-retardant adhesive film and its preparation method, including the following raw materials in parts by weight:
[0034] 30 parts of modified epoxy resins;
[0035] Modified filler 18 parts;
[0036] 0.5 part of defoamer;
[0037] 0.5 parts of curing agent;
[0038] 8 parts of silicone flame retardant;
[0039] 20 parts of flexible metal solution.
[0040] In this example: the preparation method of the modified epoxy resin is as follows: put the ordinary epoxy resin into the organic solution, add bis(aminophenoxy)dimethylsilane and heat it in a water bath to 80°C, and then Add NAOH aqueous solution under the PH to remove chlorine and close the ring to obtain modified epoxy resin.
[0041] In this embodiment: the preparation method of the modified filler is: dissolving the silane coupling agent in absolute ethanol to prepare a hydrolyzed solution of the silane coupling...
Embodiment 2
[0057] The preferred embodiment of the present invention provides a solvent-free environment-friendly flame-retardant adhesive film and its preparation method, including the following raw materials in parts by weight:
[0058] 32 parts of modified epoxy resins;
[0059] Modified filler 15 parts;
[0060] 0.3 part of defoamer;
[0061] 0.7 parts of curing agent;
[0062] 6 parts of silicone flame retardant;
[0063] 20 parts of flexible metal solution.
[0064] In this embodiment: the preparation method of the modified epoxy resin is: put the ordinary epoxy resin into the organic solution, add bis(aminophenoxy)dimethylsilane and heat it in a water bath to 100°C, and then Add NAOH aqueous solution under the PH to remove chlorine and close the ring to obtain modified epoxy resin.
[0065] In this embodiment: the preparation method of the modified filler is: dissolving the silane coupling agent in absolute ethanol to prepare a hydrolyzed solution of the silane coupling agent ...
Embodiment 3
[0081] The preferred embodiment of the present invention provides a solvent-free environment-friendly flame-retardant adhesive film and its preparation method, including the following raw materials in parts by weight:
[0082] 35 parts of modified epoxy resins;
[0083] Modified filler 10 parts;
[0084] 0.4 part of defoamer;
[0085] 0.6 parts of curing agent;
[0086] 8 parts of silicone flame retardant;
[0087] 21 parts of flexible metal solution.
[0088] In this example: the preparation method of the modified epoxy resin is: put the ordinary epoxy resin into the organic solution, add bis(aminophenoxy)dimethylsilane and heat it in a water bath to 90°C, and then Add NAOH aqueous solution under the PH to remove chlorine and close the ring to obtain modified epoxy resin.
[0089] In this embodiment: the preparation method of the modified filler is: dissolving the silane coupling agent in absolute ethanol to prepare a hydrolyzed solution of the silane coupling agent with...
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