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Preparation method of an open all-diamond heat dissipation structure

A heat dissipation structure, diamond technology, applied in metal material coating process, coating, gaseous chemical plating and other directions, to achieve the effect of large area, easy layout design, small thermal expansion coefficient

Active Publication Date: 2021-12-24
UNIV OF SCI & TECH BEIJING +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At the same time, since diamond is the hardest material known and has excellent corrosion resistance to almost all chemical substances, it leads to the challenge of fabricating all-diamond microstructures, especially complex internal structures with non-single channels, such as internal Open all-diamond microstructure with columnar structure

Method used

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  • Preparation method of an open all-diamond heat dissipation structure

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Comparison scheme
Effect test

Embodiment 1

[0044] The polished molybdenum plate with a thickness of 5 mm is precisely drilled to obtain circular through holes with a diameter of 3 mm, and the distance between each hole is 5 mm. Using Nd:YAG laser with a current of 65A, a frequency of 100Hz, and a laser feed speed of 100mm / min, a diamond thick plate with a thickness of 5mm was cut to obtain a 5mm long diamond rod. The diamond rods are sequentially filled into the through holes of the molybdenum plate to ensure that the upper and lower surfaces of the molybdenum plate are consistent in level. Place the molybdenum plate filled with diamond rods on a diamond polishing disc, and add diamond nanopowder solution for double-sided polishing. Diamond micropowders with a particle size of 500nm, 200nm, and 50nm were used for grinding and pre-polishing for 50 hours respectively. Then change the particle size of diamond powder to 20nm and 10nm in turn, and repeat the above steps. Then it is placed on a precision diamond polishing ...

Embodiment 2

[0046] The polished molybdenum plate with a thickness of 3mm is precisely drilled to obtain 3mm circular through holes, and the distance between each hole is 3mm. A Nd:YAG laser was used to cut a diamond slab with a thickness of 3 mm at a current of 70 A, a frequency of 150 Hz, and a laser feed speed of 100 mm / min to obtain a 3 mm long diamond rod. The diamond rods are sequentially filled into the through holes of the molybdenum plate to ensure that the upper and lower surfaces of the molybdenum plate are consistent in level. Place the molybdenum plate filled with diamond rods on a diamond polishing disc, and add diamond nanopowder solution for double-sided polishing. Diamond micropowders with a particle size of 500nm, 200nm, and 50nm were used for grinding and pre-polishing for 50 hours respectively. Then change the particle size of diamond powder to 20nm and 10nm in turn, and repeat the above steps. Then it was placed on a precision diamond polishing disc, and the linear s...

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Abstract

The invention discloses a preparation method of an open all-diamond heat dissipation structure, which belongs to the field of heat dissipation of semiconductor devices. The through-hole structure of the molybdenum plate is realized by precision machining. Then the high-quality self-supporting diamond thick plate is laser cut to obtain a diamond rod that matches the hole shape of the molybdenum plate, and it is filled into the through hole of the molybdenum plate. Subsequently, diamond growth is performed on the upper and lower surfaces of the molybdenum plate filled with diamond rods until the surface is fully covered with diamonds and has a certain thickness. Finally, an open all-diamond structure is obtained by removing the molybdenum plate to achieve effective heat dissipation under extreme conditions such as high heat flux density, strong heat flow impact, and space environment. The present invention adopts DC arc plasma jet CVD technology to prepare diamond slabs with large area, fast growth speed, uniform and dense slabs, and excellent quality, so that diamond rods of different shapes can be formed to meet the requirements of different sizes and shapes. All diamond heat dissipation structure requirements.

Description

technical field [0001] The invention belongs to the field of heat dissipation of high heat flux electronic devices, and in particular provides a preparation method of an open all-diamond heat dissipation structure. The feature is that the through-hole structure of the molybdenum plate is realized through precision machining. Diamond rods matching the hole shape of the molybdenum plate are obtained by laser cutting a high-quality self-supporting diamond plate, and filled into the holes of the molybdenum plate. Subsequently, diamond growth is carried out on the upper and lower sides of the molybdenum plate filled with diamond rods, until the surface is fully covered by diamonds and has a certain thickness. Finally, an open all-diamond heat dissipation structure is obtained by removing the molybdenum plate to achieve effective heat dissipation under extreme conditions such as high power, high heat flow, and space environment. [0002] technical background [0003] Among the ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P15/00C23C16/01C23C16/27C23C16/503
CPCB23P15/00C23C16/272C23C16/503C23C16/01
Inventor 郑宇亭李成明李世谕魏俊俊刘金龙陈良贤安康欧阳晓平
Owner UNIV OF SCI & TECH BEIJING