Film removing agent for IC carrier plate and application of film removing agent

A film-removing agent and carrier technology, which is applied in detergent compounding agent, detergent composition, surface-active detergent composition, etc., can solve the problem of sheet line falling off, poor film-removing effect, and high requirements for equipment and reaction conditions, etc. problem, to achieve the effect of efficient removal and high removal efficiency

Active Publication Date: 2021-07-23
深圳市点石源水处理技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Ordinary PCB circuit board film removal process uses sodium hydroxide or organic amine to achieve the film removal effect, but the IC substrate is relatively more difficult to remove the film because the board is a flexible board and has a smaller aperture line width and line spacing. Even simple ultrasonic treatment may cause the lines on the board to fall off, and the same process cannot be used to remove the film
Therefore, it is of great significance to develop a film remover to remove the film on the IC substrate by conventional soaking method. Although there are the following improved IC substrate treatment agents on the market today, the film removal effect is generally poor. , low efficiency or high requirements for equipment and reaction conditions

Method used

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  • Film removing agent for IC carrier plate and application of film removing agent
  • Film removing agent for IC carrier plate and application of film removing agent
  • Film removing agent for IC carrier plate and application of film removing agent

Examples

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Effect test

Embodiment 1

[0037] An embodiment of the film remover for IC substrates of the present invention includes the following components in mass percentage: 15% film remover A, 9% film remover B and the remainder of water; the film remover A Comprising the following components in mass percentage: 13% sodium hydroxide, 12% potassium hydroxide, 5% sodium carbonate, 22% triethylenetetramine, 5% dimethylamine, 8% ethylene glycol monobutyl ether and the rest Measure water; the film remover B includes the following components in mass percentage: 3% polyoxypropylene glyceryl ether, 9% dimethyl phosphoric acid aminomethanesulfonic acid, 2% polynaphthaldehyde sulfonic acid sodium salt, 8% 2-hydroxyphosphonoacetic acid, 2% N-lauroyl sarcosine, 0.8% iminodiacetic acid, 25% triethylamine and the balance water.

Embodiment 2

[0039] An embodiment of the film remover for IC substrates of the present invention includes the following components in mass percentage: 20% film remover A, 5% film remover B and the remainder of water; the film remover A Comprising the following components in mass percentage: 14% sodium hydroxide, 11% potassium hydroxide, 5% sodium carbonate, 20% triethylenetetramine, 2% tetraethylenepentamine, 6% dimethylamine, 10% ethyl Glycol monobutyl ether and the remaining amount of water; the film remover B includes the following components in mass percentage: 3% polyoxypropylene glyceryl ether, 10% dimethyl phosphoric acid, 2.3% polynaphthaldehyde Sulfonic acid sodium salt, 5% 2-hydroxyphosphonoacetic acid, 3% S-carboxyethylsulfosuccinic acid, 1% N-lauroyl sarcosine, 0.9% iminodiacetic acid, 28% triethylamine and other Measure water.

Embodiment 3

[0041]An embodiment of the IC carrier film remover of the present invention includes the following components in mass percentage: 12% film remover A, 10% film remover B and the remainder of water; the film remover A Comprising the following components in mass percentage: 13% sodium hydroxide, 13% potassium hydroxide, 5% sodium carbonate, 23% tetraethylenepentamine, 6% dimethylamine, 10% ethylene glycol monobutyl ether and the rest Measure water; the film remover B includes the following components in mass percentage: 3.5% polyoxypropylene glyceryl ether, 9% dimethyl phosphoric acid aminomethanesulfonic acid, 1% polynaphthaldehyde sulfonic acid sodium salt, 1% Sodium N-oleoylmethyl taurate, 9% 2-hydroxyphosphonoacetic acid, 1% N-lauroyl sarcosine, 0.4% iminodiacetic acid, 0.3% tetrasodium glutamate diacetate, 20% trisodium Ethylamine and the remainder of water.

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Abstract

The invention discloses a film removing agent for an IC carrier plate and application of the film removing agent, belonging to the technical field of film removing processes. In the components of the produced film removing agent for the IC carrier plate, inorganic alkali in a component A of the film removing agent can directly break a cover film on the IC carrier plate, organic alkali can enable a film layer to swell, and the film layer can completely fall off and cannot be curled and stuck under the synergistic assistance of a penetrating agent; a component B of the film removing agent can realize permeation of microstructures on the produced carrier plate and protect the microstructures from being adhered by a damaged or fallen film layer at the same time; and through the matching of the two components of the film removing agent, the obtained product can realize efficient removal of the film on the IC carrier plate. The invention further discloses application of the produced film removing agent to removal of the film on the IC carrier plate. When the produced film removing agent is applied, other auxiliary equipment or additional pretreatment procedures are not needed, a film layer on a circuit can be completely removed in a direct soaking mode, removal efficiency is high, and the circuit on the carrier plate cannot be damaged.

Description

technical field [0001] The invention relates to the technical field of film-removing technology, in particular to an IC carrier film-removing agent and its application. Background technique [0002] IC carrier board is a substrate used to package IC bare chips. Its function is to carry semiconductor IC chips. There are lines inside the product to conduct the connection between the chip and the circuit board, protect, fix, support the IC chip, and provide cooling channels. Compared with ordinary circuit boards, IC carrier boards require finer, higher density, smaller volume, smaller holes, disks, and lines on the carrier board, and thinner core layers, so it must have precise interlayer alignment technology, Line imaging technology, electroplating technology, drilling technology and surface treatment technology. [0003] Ordinary PCB circuit board film removal process uses sodium hydroxide or organic amine to achieve the film removal effect, but the IC substrate is relative...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C11D1/10C11D3/04C11D3/10C11D3/30C11D3/20C11D3/37C11D3/36C11D3/06C11D3/34C11D3/33C11D3/60H05K3/22
CPCC11D1/10C11D3/044C11D3/10C11D3/30C11D3/2068C11D3/3707C11D3/364C11D3/06C11D3/361C11D3/3472C11D3/33H05K3/22
Inventor 吴春丽石宗武
Owner 深圳市点石源水处理技术有限公司
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