A ring electroplated diamond wire saw and its preparation method
A technology for electroplating diamond and diamond wire saw, which is applied in stone processing equipment, manufacturing tools, electrolytic coatings, etc., can solve the problems of easy falling off, easy cracking of annular welds, poor holding force of diamond abrasive grains, etc. Improves grip
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Embodiment 1
[0050] A ring-shaped electroplated diamond wire saw and a preparation method thereof, the preparation method comprising the following steps:
[0051] Step 1. Take a single pretreated metal wire as the bus bar 1, pre-coat copper or nickel on the surface of the bus bar 1, and then wind the bus bar 1 along a loop direction in a parallel manner for seven turns to form a ring-shaped pre-roller. Coil 4 is plated, and then two adjacent strands of wires are welded together with low melting point metal tin. The diameter of the bus bar 1 is 0.08 mm.
[0052] Step 2. First carry out sand electroplating treatment, and composite electroplating metal nickel and pretreated diamond abrasive 3 on the annular pre-plating coil 4; then carry out thickening electroplating treatment, continue electroplating metal nickel, and make A part is embedded in the nickel layer; finally, after cleaning and drying, a preliminary diamond wire saw is obtained, and a part of the diamond abrasive 3 of the prelim...
Embodiment 2
[0057] A ring-shaped electroplating diamond wire saw and a preparation method thereof, the difference from Embodiment 1 is, see attached Figure 4 and attached Image 6 As shown, in step 1, the bus bar 1 is wound three times in a twisted manner along the direction of a loop wire to form an annular pre-plated coil 4 . Compared with the traditional diamond wire saw for processing single crystal silicon, the cutting material loss of the wire saw of the present invention is reduced by 70%, the service life is greatly increased by 200%, and the surface roughness of the silicon wafer reaches Ra0.4 or more.
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