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A ring electroplated diamond wire saw and its preparation method

A technology for electroplating diamond and diamond wire saw, which is applied in stone processing equipment, manufacturing tools, electrolytic coatings, etc., can solve the problems of easy falling off, easy cracking of annular welds, poor holding force of diamond abrasive grains, etc. Improves grip

Active Publication Date: 2022-06-03
SUZHOU SAITERUI PRECISION MACHINERY PARTS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The invention provides an annular electroplated diamond wire saw and a preparation method thereof, the purpose of which is to solve the technical problems that the diamond abrasive grains of the existing annular electroplated diamond wire saw have poor holding power, are easy to fall off, and the ring weld is easy to break

Method used

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  • A ring electroplated diamond wire saw and its preparation method
  • A ring electroplated diamond wire saw and its preparation method
  • A ring electroplated diamond wire saw and its preparation method

Examples

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Embodiment 1

[0050] A ring-shaped electroplated diamond wire saw and a preparation method thereof, the preparation method comprising the following steps:

[0051] Step 1. Take a single pretreated metal wire as the bus bar 1, pre-coat copper or nickel on the surface of the bus bar 1, and then wind the bus bar 1 along a loop direction in a parallel manner for seven turns to form a ring-shaped pre-roller. Coil 4 is plated, and then two adjacent strands of wires are welded together with low melting point metal tin. The diameter of the bus bar 1 is 0.08 mm.

[0052] Step 2. First carry out sand electroplating treatment, and composite electroplating metal nickel and pretreated diamond abrasive 3 on the annular pre-plating coil 4; then carry out thickening electroplating treatment, continue electroplating metal nickel, and make A part is embedded in the nickel layer; finally, after cleaning and drying, a preliminary diamond wire saw is obtained, and a part of the diamond abrasive 3 of the prelim...

Embodiment 2

[0057] A ring-shaped electroplating diamond wire saw and a preparation method thereof, the difference from Embodiment 1 is, see attached Figure 4 and attached Image 6 As shown, in step 1, the bus bar 1 is wound three times in a twisted manner along the direction of a loop wire to form an annular pre-plated coil 4 . Compared with the traditional diamond wire saw for processing single crystal silicon, the cutting material loss of the wire saw of the present invention is reduced by 70%, the service life is greatly increased by 200%, and the surface roughness of the silicon wafer reaches Ra0.4 or more.

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Abstract

An annular electroplating diamond wire saw and its preparation method include the following steps: Step 1. Take a single metal wire as a bus bar, and wind it at least twice along the direction of a loop line to form an annular pre-plating coil. Step 2. First perform sanding electroplating treatment, thickening electroplating treatment, cleaning and drying, and obtain a preliminary diamond wire saw. Step 3. Then carry out high-frequency induction treatment to generate high-frequency induction eddy current on its surface; under the action of skin effect, the nickel-plated layer and diamond abrasive both heat up rapidly, so that the nickel-plated layer undergoes recrystallization reaction, and the nickel-plated layer and diamond abrasive A chemical bond is formed between the abrasives; after cooling, the nickel coating exerts compressive stress on the diamond abrasive. Step 4. Continue to carry out the ultrasonic rolling treatment to cause plastic deformation on the surface to generate residual compressive stress, and finally obtain a circular electroplated diamond wire saw. The invention solves the technical problems that the diamond abrasive grains of the existing annular electroplated diamond wire saw have poor holding power, are easy to fall off, and the annular welding part is easy to break.

Description

technical field [0001] The invention relates to the technical field of wire saws, in particular to a ring-shaped electroplated diamond wire saw and a preparation method thereof. Background technique [0002] The early wire saw processing technology used bare metal wires and free abrasives. During the processing, the abrasives were added to the metal wire and the workpiece by a third party to produce a cutting effect. This technique has been successfully used in the processing of silicon and silicon carbide. In order to further shorten the processing time and process other hard substances and ceramics that are difficult to process, diamond abrasives are bonded to the metal wire by resin bonding, electroplating, brazing, etc., resulting in a bonded diamond wire saw, commonly used It is suitable for the processing of superhard materials such as silicon crystals and ceramics. [0003] Electroplated diamond wire saw is a kind of consolidated diamond wire saw. It is generally pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D15/00C25D7/04C25D5/50C25D5/12C22F1/10B28D1/08
CPCC25D15/00C25D7/04C25D5/505C22F1/10C25D5/12B28D1/08
Inventor 祁万章徐纯芳
Owner SUZHOU SAITERUI PRECISION MACHINERY PARTS CO LTD