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Film laminate metal sheet, substrate for flexible devices, and substrate for organic el devices

A metal plate and film layer technology, applied in lamination, lamination devices, semiconductor devices, etc., can solve the problems of insufficient performance and high cost, and achieve the effect of excellent productivity and low environmental burden

Pending Publication Date: 2021-08-06
JFE STEEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are many issues of insufficient performance and high cost

Method used

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  • Film laminate metal sheet, substrate for flexible devices, and substrate for organic el devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] As a raw material resin of the resin film, pellets of PET as a polyester resin were prepared, and were sufficiently dried under high temperature in vacuum so as not to contain moisture. This was put into a single-screw extruder, and it melt-kneaded at 280 degreeC. Next, foreign substances were removed through a sintered filter with a 25 μm cut, and then discharged from a T-die, cooled and solidified on a casting drum whose surface temperature was controlled to 25° C., and an unstretched film was obtained. Next, using the heated ceramic roll, it preheated so that the resin film temperature might become 100 degreeC, and stretched 3.8 times in the longitudinal direction of the resin film. Then, the ends were clamped by chucks, introduced into a tenter stretching machine, and stretched 4.5 times in the transverse direction at 120°C. In this state, 1.0% relaxation was given in the lateral direction while heat-fixing at 165°C. Then, it cooled gradually to room temperature, ...

Embodiment 2

[0080] The polyester resin is PEN, the stretching temperature in longitudinal stretching is 140°C, the stretching temperature in transverse stretching is 150°C, the heat setting temperature is 190°C, and the A film-laminated metal sheet was obtained in the same manner as in Example 1 except that the previous metal sheet temperature was 250°C. The physical properties of the obtained film-laminated metal sheet are shown in Table 1 below.

Embodiment 3

[0082] A film-laminated metal sheet was obtained in the same manner as in Example 1 except that the temperature of the lamination cooling roll was set at 25°C. The physical properties of the obtained film-laminated metal sheet are shown in Table 1 below.

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Abstract

A film laminate metal sheet according to the present invention is coated, on at least one surface thereof, with a resin film, wherein the arithmetic mean height Sa0 on the surface of the resin film is 3.0 nm or less, and the arithmetic mean height change ratio {(Sa1 / Sa0) x 100} is 80 to 120% inclusive wherein Sa1 represents the arithmetic mean height of the surface of the resin film after the resin film is heat-treated at 100 DEG C. It is preferred that the ten-point height S10z0 of the surface of the resin film is 50 nm or less. It is preferred that the ten-point height change ratio {(S10z1 / S10z0) x 100} falls within the range from 80 to 120% inclusive, wherein S10z1 represents the ten-point height of the surface of the resin film after the resin film is heat-treated at 100 DEG C.

Description

technical field [0001] The present invention relates to a film-laminated metal plate, a substrate for a flexible device, and a substrate for an organic EL device. Background technique [0002] Flexible devices are a general term for devices characterized by being bendable using flexible materials. Various functional products can be created by combining with organic electronic devices based on organic materials, or printed electronic devices that enable low-cost and simple fabrication of devices by coating and printing. Among flexible devices, there are various devices such as organic EL (Electro-Luminescence) devices, organic thin film solar cells, organic TFT (Thin Film Transistor), electronic paper, flexible batteries, and various flexible sensors. [0003] At present, glass excellent in planarity, heat resistance, and gas barrier property, resin film excellent in flexibility, and the like are mainly used for flexible devices such as organic EL devices. However, it is di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08H01L51/50H05B33/02H10K99/00
CPCY02E10/549B32B2307/406B32B27/306B32B27/18B32B27/34B32B2307/732B32B27/286B32B27/302B32B27/285B32B15/088B32B15/082B32B2255/06B32B27/32B32B27/281B32B2270/00B32B2307/7242B32B15/18B32B27/365B32B2457/00B32B2255/205B32B27/36B32B15/20B32B2307/538B32B27/288B32B15/09B32B15/085B32B27/304B32B27/20B32B27/08B32B2307/306B32B2255/26Y02P70/50H10K71/50H10K77/111H10K2102/311B32B15/08B32B37/10B32B2457/20B32B2457/206
Inventor 藤本聪一大岛安秀小岛克己
Owner JFE STEEL CORP
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