Green recycling method for non-metallic materials in circuit board waste
A non-metallic material, circuit board technology, applied in recycling technology, plastic recycling, chemical instruments and methods, etc., can solve the problems of complex circuit board components, reduce environmental protection value, consume large acids, etc., achieve easy distillation recovery, improve Recycling efficiency, reducing the effect of waste acid generation
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Embodiment 1
[0025] Under the condition of stirring at 50°C, add 10 g of waste (non-metallic waste of circuit board) after recycling metal from the circuit board (the mass fraction of the resin is 50%) to 20 g of dichloroethane solution, stir rapidly for 0.5 h, and carry out uniform Disperse to obtain 30g of dispersion A; slowly add 2g of chloromethyl methyl ether into dispersion A, continue stirring at 10°C for 3h to obtain dispersion B; dropwise add 20mL of acetone to form dispersion C, perform centrifugation, dry, and collect . The quaternization treatment was carried out with 30% trimethylamine solution to obtain a porous ion exchange resin with an ion exchange capacity of 1.2 mmol / g. If the chloromethylation modification time is adjusted to 2 h, a porous ion exchange resin with an ion exchange capacity of 1.2 mmol / g is obtained.
Embodiment 2
[0027] Under the condition of stirring at 30°C, add 10g of waste materials (the mass fraction of which is 50% of the resin) from circuit board recycling to 20g of dichloroethane solution, stir rapidly for 0.5h, and uniformly disperse to obtain 30g of dispersion A ; Add 3 g of chloromethyl methyl ether slowly to dispersion A, and continue stirring at 10°C for 0.5 h to obtain dispersion B; add 20 mL of acetone dropwise to form dispersion C, which is centrifuged, dried, and collected. The quaternization treatment was carried out with 30% trimethylamine solution to obtain a porous ion exchange resin with an ion exchange capacity of 1.4 mmol / g.
Embodiment 3
[0029] Under the condition of stirring at 50°C, add 10 g of scrap metal recovered from circuit boards (the mass fraction of resin is 50%) to 20 g of methylene chloride solution, stir rapidly for 0.5 h, and uniformly disperse to obtain 30 g of dispersion A; Slowly add 3 g of chloromethyl ethyl ether to dispersion A, and continue stirring at 10°C for 2 h to obtain dispersion B; add 20 mL of acetone dropwise to form dispersion C, which is centrifuged, dried, and collected. The quaternization treatment was carried out with 30% trimethylamine solution to obtain a porous ion exchange resin with an ion exchange capacity of 1.4 mmol / g.
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