Method for improving welding bonding rate of tungsten-containing target material

A technology of bonding rate and target material, applied in welding equipment, metal material coating process, ion implantation plating and other directions, can solve the problem of unclear specific nickel plating process, achieve high density, reduce rework, and have broad application prospects Effect

Pending Publication Date: 2021-08-24
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method does not specify the specific process of nickel plating, and it is aimed at the coating of ceramic targets, and does not involve metal targets.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] This embodiment provides a method for improving the welding bonding rate of a tungsten-containing target, the method comprising the following steps:

[0050] (1) Wipe and clean the welding surface of the tungsten-titanium alloy target with isopropanol, the titanium content of the tungsten-titanium alloy target is 10wt%, and then use the physical vapor deposition method to coat the sputtering surface of the target, The coating is carried out in physical vapor deposition equipment, the material of the coating is nickel, the power of the coating is 2.2KW, the temperature of the coating is 125°C, the coating is carried out under vacuum, and the pressure is 3.5×10 -1 Pa, the coating time is 4h, and the coating target is obtained, wherein the thickness of the coating is 6 μm;

[0051] (2) Infiltrate the welding surface of the coating target material obtained in step (1) and the copper back plate with solder, the solder is tin, the heating temperature during the infiltration i...

Embodiment 2

[0054] This embodiment provides a method for improving the welding bonding rate of a tungsten-containing target, the method comprising the following steps:

[0055] (1) Wipe and clean the welding surface of the tungsten-titanium alloy target with ethanol, the titanium content of the tungsten-titanium alloy target is 5wt%, and then use the physical vapor deposition method to coat the sputtering surface of the target. The coating is carried out in physical vapor deposition equipment, the material of the coating is nickel, the power of the coating is 1.8KW, the temperature of the coating is 120°C, the coating is carried out under vacuum, and the pressure is 3×10 -1 Pa, the coating time is 5h, and the coating target is obtained, wherein the coating thickness is 7 μm;

[0056] (2) Infiltrate the welding surface of the coating target material obtained in step (1) and the aluminum alloy back plate with brazing material, the brazing material is indium, the heating temperature during t...

Embodiment 3

[0059] This embodiment provides a method for improving the welding bonding rate of a tungsten-containing target, the method comprising the following steps:

[0060] (1) Wipe and clean the welding surface of the tungsten target with isopropanol, and then use the physical vapor deposition method to coat the sputtering surface of the target. The coating is carried out in a physical vapor deposition equipment, and the material of the coating is nickel , the power of the coating film is 1.5KW, the temperature of the coating film is 130°C, the coating film is carried out under vacuum conditions, and the pressure is 1×10 -1 Pa, the coating time is 3h, and the coating target is obtained, wherein the thickness of the coating is 4 μm;

[0061] (2) Infiltrate the welding surface of the coating target obtained in step (1) and the copper alloy back plate with solder, the solder is an indium-tin alloy, the heating temperature during the infiltration is 240° C., and the infiltration method i...

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Abstract

The invention provides a method for improving the welding bonding rate of a tungsten-containing target material. The method comprises the following steps: cleaning the welding face of the tungsten-containing target material, and then carrying out film coating on the sputtering face of the target material through a physical vapor deposition method so as to obtain a film-coated target material; and soaking the welding faces of the film-coated target material and a back plate with brazing filler metal and then welding the welding faces of the film-coated target material and the back plate to obtain a target material assembly. According to the method, aiming at the defects existing in target material film coating of a traditional film coating method, the physical vapor deposition method is adopted, an appropriate film coating process is selected according to the characteristics of the specific target material, the requirements of subsequent soaking and welding are met, the obtained film coating layer is high in compactness, thus the welding bonding rate can be increased, and the qualified target material assembly is obtained; and the method is easy to operate, the film coating quality is high, reworking can be reduced, the cost is reduced, and the application prospect is wide.

Description

technical field [0001] The invention belongs to the technical field of target material preparation and relates to a method for improving the welding bonding rate of a tungsten-containing target material. Background technique [0002] The target is a sputtering source used for sputter coating. Before using the target for sputter coating, the target needs to be fixed to the back plate to form a target assembly. The back plate can be fixedly installed on the sputter base to support the target and conduct heat. The fixation of the target and the back plate is usually by welding. By coating the solder on the welding surface and heating the solder until it melts, the welding surface of the target and the back plate are set and bonded together. After the solder is solidified, the target is formed. material components. [0003] For the selection of solder for target welding, low-melting point metals are usually selected and wetted onto the welding surface to facilitate the uniform...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B23K1/08B23K1/20C23C14/34
CPCB23K1/0008B23K1/08B23K1/206B23K1/20C23C14/3414
Inventor 姚力军边逸军潘杰王学泽赵欣雨
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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