Insulating and heat-dissipating coating for EB-cured aluminum-based copper-clad plate

Abstract

The invention relates to the technical field of aluminum-based copper-clad plates, in particular to an insulating and heat-dissipating coating for an EB-cured aluminum-based copper-clad plate. Metal powder or a carbon fiber material with good thermal conductivity is added into an insulating layer material, so that the thermal conductivity of the insulating layer can be remarkably improved, but the insulation reliability of the insulating layer can be reduced to a certain extent. In order to solve the problems, the invention provides an insulating and heat-dissipating coating for an EB-cured aluminum-based copper-clad plate. A fluorine-modified nano phase change capsules is added into a coating system, and a fluorine-containing long carbon chain is introduced into the outer surface of the fluorine-modified nano phase change capsule, so that the fluorine-modified nano phase change capsule has lower surface energy, tends to be enriched on the upper surface of a coating system and clings to the lower part of a circuit layer, and can quickly absorb and transfer heat generated by the circuit layer of the aluminum-based copper-clad plate, the addition amount of a heat-conducting filler carbon nano tube is reduced to a certain extent, and the reliability of an insulating layer is improved.

Description

technical field [0001] The invention relates to the technical field of aluminum-based copper-clad laminates, in particular to an insulating and heat-dissipating coating for EB-cured aluminum-based copper-clad laminates. Background technique [0002] Aluminum-based copper clad laminate, or aluminum substrate, is a metal-based copper-clad laminate with good heat dissipation function. It is a kind of raw material for aluminum-based printed circuit boards and is widely used in LED lighting products. Generally, aluminum-based copper clad laminates are composed of a circuit layer (copper foil), an insulating layer and an aluminum base layer. The insulation layer is used to bond the circuit layer and the aluminum base layer, and has the function of insulation and heat dissipation to resist voltage breakdown. [0003] In order to increase the heat dissipation performance of the insulating layer, the usual practice is to add metal powder or carbon fiber material with good thermal co...

AI Technical Summary

Problems solved by technology

[0003] In order to increase the heat dissipation performance of the insulating layer, the usual practice is to add metal powder or carbon fiber material with good thermal conductivity to the insulating layer material. This method can significantly improve the thermal conductivity of the insulating layer, but it will reduce the thermal conductivity of the insulating layer to a certain extent. The dielectric constant greatly reduces the anti-voltage breakdown effect of the insulating layer

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