Satellite chip anti-radiation packaging structure and manufacturing method thereof

Abstract

The invention relates to a satellite chip anti-radiation packaging structure and a manufacturing method thereof, and the packaging structure comprises a circuit board, a chip installed on the circuit board, and an anti-radiation part installed on the outer surface of the chip, thereby enabling the packaging structure to have the anti-radiation capability. In addition, the chip and the anti-radiation part are sealed on the circuit board through room-temperature silicone rubber in a potting manner. Other gaps except for the circuit board, the chip and the anti-radiation part are filled with the room-temperature silicone rubber after encapsulation, so the circuit board, the chip and the anti-radiation part are sealed in the silicone rubber after the room-temperature silicone rubber is cured. The internal structure of the packaging structure can be ensured to be more stable, so the probability of relative displacement among the three parts is reduced, and the radiation-proof part is ensured to play a better radiation-proof role. Therefore, by adopting the scheme, not only can the chip have relatively high radiation resistance, but also the cost can be effectively saved.

Description

technical field [0001] The application belongs to the field of circuit board production, and in particular relates to a satellite chip anti-irradiation packaging structure and a production method thereof. Background technique [0002] Due to the special operating environment of the chips used in spacecraft, the chips will be radiated by cosmic rays and subjected to the impact of high-energy particles for a long time, which will lead to chip failure. In order to avoid chip failure due to single event effects, the chip needs to have high radiation resistance. [0003] However, in the existing technology, the procurement of chip components involved in commercial satellite manufacturing usually adopts shelf-level product solutions, and there is no anti-radiation design for applications in space environments in terms of device selection and structural design. In addition, generally only aerospace-grade chips have good radiation resistance, but aerospace-grade chips are relativel...

AI Technical Summary

Problems solved by technology

[0003] However, in the existing technology, the procurement of chip components involved in commercial satellite manufacturing usually adopts shelf-level product solutions, and there is no anti-radiation design for applications in space environments in terms of device selection and structural design.

In addition, generally only aerospace-grade chips have better anti-radiation performance, but aerospace-grade chips are more expensive due to their special design process and material selection. If aerospace-grade chips are used, the overall cost will increase

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