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Curable silicone composition, cured product thereof, and method for producing same

A silicone and curable technology, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, heat-activated film/sheet, etc., can solve damage, can not solve the stress relaxation characteristics of functional filler cured products, easy to produce warping, etc. question

Active Publication Date: 2021-08-31
DOW TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, in the conventional curable silicone composition, when a relatively large amount of functional filler is blended, especially in the case of thin molding, there is a problem that the stress relaxation of the above-mentioned cured product is reduced, and it is easy to Warpage and breakage occur, and the trade-off between the content of functional fillers and the stress relaxation properties of cured products cannot be solved

Method used

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  • Curable silicone composition, cured product thereof, and method for producing same
  • Curable silicone composition, cured product thereof, and method for producing same

Examples

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Embodiment

[0312] The hot-melt curable silicone composition of the present invention and its production method will be described in detail using examples and comparative examples. In addition, in the formula, Me, Ph, and Vi represent a methyl group, a phenyl group, and a vinyl group, respectively. In addition, about the curable silicone composition of each Example and a comparative example, the softening point was measured by the following method. In addition, the curable silicone composition was heated at 150° C. for 2 hours to prepare a cured product, and the storage elastic modulus, loss tangent (tan δ), and warpage of the molded product were measured by the following methods. The results are shown in Table 1.

[0313] [Softening point of curable granular silicone composition]

[0314] The curable granular silicone composition is molded into cylindrical particles. The pellets were placed on a heating plate set at 25° C. to 100° C., and a load of 100 grams was continuously pressed...

reference example 1

[0321] Into a 1L flask, put into a white solid at 25°C, the average unit formula (PhSiO 3 / 2 ) 0.80 (Me 2 ViSiO 1 / 2 ) 0.20 270.5 g of a 55% by mass-toluene solution of the resinous polyorganosiloxane represented by the formula HMe 2 SiO(Ph 2 SiO)SiMe 2 21.3 g of diphenylsiloxane (content of hydrogen atoms bonded to silicon atoms = 0.6% by mass) with dimethylhydrogensiloxane groups at both ends of the molecular chain represented by H and having a viscosity of 5 mPa·s (relative to the above-mentioned 1 mole of vinyl groups in resinous polyorganosiloxane, 0.5 moles of silicon atoms bonded to hydrogen atoms in this component), and 1,3-divinyltetramethyldisiloxane complex of platinum 0.43 g of 1,3-divinyltetramethyldisiloxane solution (platinum metal content=approximately 4000 ppm) of the product (relative to this liquid mixture, the amount of platinum metal is 10 ppm by mass unit), at room temperature Stir evenly. Then, raise the temperature in the flask to 100°C in a...

reference example 2

[0323] Put into a 1L flask, which is a white solid at 25°C, which is represented by the average unit formula (Me 2 ViSiO 1 / 2 ) 0.05 (Me 3 SiO 1 / 2 ) 0.39 (SiO 4 / 2 ) 0.56 (HO 1 / 2 ) 0.02 270.5 g of 55% by mass-xylene solution of polyorganosiloxane resin and 1,3-divinyltetramethyldisiloxane complex of platinum Disiloxane solution (content of platinum metal=approximately 4000ppm) 0.375g was uniformly stirred at room temperature (25°C) to prepare a polyorganosiloxane resin (2) containing 10ppm of platinum metal by mass unit. xylene solution. In addition, this polyorganosiloxane resin (2) does not soften or melt even when heated to 200° C., and does not have thermal fusibility.

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Abstract

To provide a curable granular silicone composition which has hot-melt properties, and which provides a cured product obtained through overmolding or the like having particularly excellent flexibility and toughness in a temperature range from room temperature to a high temperature of about 150 DEG C, and also provides a cured product that is not easily bent or damaged even when integrally molded with an aluminum lead frame, etc. Provided are a curable granular silicone composition and a use thereof, said composition being characterized by comprising: (A) organopolysiloxane resin fine particles having a curing-reactive functional group; (B) a functional inorganic filler; and (C) a curing agent, wherein by using said composition, a cured product is obtained which has a storage elastic modulus of 2000 MPa or less and 100 MPa or less at 25 DEG C and 150 DEG C, respectively, and which has a peak value of tan[delta] of 0.40 or more as represented by storage elastic modulus / loss elastic modulus (G' / G").

Description

technical field [0001] The present invention relates to a curable granular silicone combination which can be obtained by a simple production method and is excellent in heat-meltability and suppression of warping of cured products such as lead frames. Furthermore, the present invention relates to a curable granular silicone composition or a cured product using particles or sheets, a molding method of the cured product, and a semiconductor device including the cured product. Background technique [0002] Curable silicone compositions are used in a wide range of industrial fields because they cure to form cured products having excellent heat resistance, cold resistance, electrical insulation, weather resistance, water resistance, and transparency. The cured product of such a curable silicone composition is generally less likely to be discolored than other organic materials and has little decrease in physical properties, so it is also suitable as an encapsulant for optical mater...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08J5/00C08K3/01H01L21/56H01L23/29H01L23/31
CPCC08L83/04H01L21/56H01L23/31H01L23/29C08J2300/12C08J3/203C08J3/12C08J5/18C08J2383/04C08G77/20C08G77/12C08G77/80C08G77/70C09J183/04C08K3/013C08K5/56C08L83/00C08K3/36C09J7/35C09J7/10H01L23/296C08L2205/025C08G77/44C08G2170/20C08K3/22C08K5/14C08K9/06C08K2003/2241C08K2201/001C08L2203/20C08L2205/03C08L2205/18
Inventor 山崎亮介
Owner DOW TORAY CO LTD
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