Microwave dielectric ceramic material, preparation method and application

A technology of microwave dielectric ceramics and ceramics, which is applied in the field of ceramic materials, can solve the problems of weak product stability and poor thermal shock resistance, and achieve the effects of low raw material prices, improved thermal shock resistance, and high thermal shock resistance

Inactive Publication Date: 2021-09-03
无锡市高宇晟新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] ① Poor thermal shock resistance;
[0005] ②Product stability is weak

Method used

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  • Microwave dielectric ceramic material, preparation method and application

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preparation example Construction

[0088] The preparation method of the microwave dielectric ceramic material provided by the invention has the advantages of low raw material price, simple and easy process circuit, and is suitable for large-scale industrial production.

[0089] Optionally, the mixing method includes ball milling and / or sand milling.

[0090] In some embodiments of the present invention, the mixture of the ceramic main material and the binder is placed in a ball mill for ball milling and mixing, the rotating speed of the ball milling is 200r / min-400r / min, and the time of ball milling is 3h-8h to obtain a mixed slurry material.

[0091] In some embodiments of the present invention, the binder is typically but not limited to polyvinyl alcohol, polyacrylic acid.

[0092] Preferably, a granulation process after mixing is also included.

[0093] In some embodiments of the present invention, the mixed slurry is subjected to spray granulation to obtain granulated powder. The average particle diamete...

Embodiment 1

[0135] This embodiment provides a microwave dielectric ceramic material, including ceramic main materials and additives.

[0136] The ceramic main material is composed of 77wt% MgTiO 3 , 9.0wt% (Ca 0.8 Sr 0.2 )TiO 3 and 14wt% (Mg 0.5 Zn 0.5 )Al 2 o 4 constitute.

[0137] The mass of the additive is 1% of the mass of the ceramic main material. Among them, the first additive is SiO 2 , the quality is 0.5% of the mass of ceramic main material; the second additive is CeO 2 , the mass is 0.2% of the mass of the ceramic main material; the third additive is BN, and the mass is 0.3% of the mass of the ceramic main material.

[0138] The preparation process of the microwave dielectric ceramic material is as follows: figure 1 As shown, the specific steps are as follows:

[0139] (1) Preparation of MgTiO 3 : MgO and TiO 2 According to the molar ratio of 1:1, TiO 2 Consisting of 14% by mass anatase TiO 2 and rutile TiO with a mass ratio of 86% 2 constitute. After batchin...

Embodiment 2

[0144] This embodiment provides a microwave dielectric ceramic material, including ceramic main materials and additives.

[0145] The ceramic main material is composed of 79wt% MgTiO 3 , 8.0wt% (Ca 0.8 Sr 0.2 )TiO 3 and 13wt% (Mg 0.5 Zn 0.5 )Al 2 o 4 constitute.

[0146] The mass of the additive is 1.5% of the mass of the ceramic main material. Among them, the first additive is SiO 2 , the quality is 1% of the mass of ceramic main material; the second additive is Nd 2 o 3 , the mass is 0.2% of the mass of the ceramic main material; the third additive is BN, and the mass is 0.3% of the mass of the ceramic main material.

[0147] The preparation steps (1)-(3) of the microwave dielectric ceramic material are the same as (1)-(3) in Embodiment 1, and will not be repeated here.

[0148] (4) Mix ceramic main ingredients: mix ceramic main ingredients, first additive, second additive, third additive and binder polyvinyl alcohol by ball milling, the speed of ball milling is ...

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Abstract

The invention provides a microwave dielectric ceramic material, a preparation method and application, and relates to the technical field of ceramic materials. The microwave dielectric ceramic material comprises MgTiO3, (Mg0.5Zn0.5)Al2O4 and (Ca0.8Sr0.2)TiO3, wherein the mass of the MgTiO3 accounts for 75%-85% of the mass of a ceramic main material; the mass of the (Mg0.5Zn0.5)Al2O4 accounts for 10%-15% of the mass of the ceramic main material; the mass of the (Ca0.8Sr0.2)TiO3 accounts for 5%-10% of the mass of theceramic main material. According to the invention, under the condition that the dielectric constant epsilon r of the microwave dielectric ceramic material provided by the invention is kept at 20 + / - 1, the quality factor Q * f can reach 57000-70000GHz, and the temperature coefficient of resonance frequency tau f is close to 0; meanwhile, the thermal shock temperature difference [delta]Tmax of the microwave dielectric ceramic is 125-130 DEG C, so that the microwave dielectric ceramic has relatively high thermal shock resistance and relatively good comprehensive performance.

Description

technical field [0001] The invention relates to the technical field of ceramic materials, in particular to a microwave dielectric ceramic material, a preparation method and an application. Background technique [0002] Based on the rapid popularization of 5G networks, radio frequency components such as resonators, filters, oscillators, phase shifters, capacitors, and microwave substrates have become key materials for communication. Among them, the dielectric material in the microwave frequency band circuit in the radio frequency component is a microwave dielectric ceramic material. Microwave dielectric ceramic materials can realize one or more functions in radio frequency components. [0003] Existing MgTiO 3 -CaTiO 3 The microwave dielectric ceramic material of the system mainly has the following defects: [0004] ① Poor thermal shock resistance; [0005] ②Product stability is weak. [0006] In view of this, the present invention is proposed. Contents of the inventi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/465C04B35/622C04B35/63
CPCC04B35/465C04B35/622C04B35/6303C04B2235/3206C04B2235/3232C04B2235/3217C04B2235/3284C04B2235/3208C04B2235/3213C04B2235/5427C04B2235/5436C04B2235/602C04B2235/608C04B2235/656C04B2235/6567
Inventor 李礼王秀红顾国治黄庆焕
Owner 无锡市高宇晟新材料科技有限公司
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